DE602005022071D1 - Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür - Google Patents
Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafürInfo
- Publication number
- DE602005022071D1 DE602005022071D1 DE200560022071 DE602005022071T DE602005022071D1 DE 602005022071 D1 DE602005022071 D1 DE 602005022071D1 DE 200560022071 DE200560022071 DE 200560022071 DE 602005022071 T DE602005022071 T DE 602005022071T DE 602005022071 D1 DE602005022071 D1 DE 602005022071D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- method therefor
- multilayer piezoelectric
- piezoelectric component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M51/00—Fuel-injection apparatus characterised by being operated electrically
- F02M51/06—Injectors peculiar thereto with means directly operating the valve needle
- F02M51/0603—Injectors peculiar thereto with means directly operating the valve needle using piezoelectric or magnetostrictive operating means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Fuel-Injection Apparatus (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004158452A JP4931334B2 (ja) | 2004-05-27 | 2004-05-27 | 噴射装置 |
PCT/JP2005/005229 WO2005117155A1 (ja) | 2004-05-27 | 2005-03-23 | 積層型圧電素子及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005022071D1 true DE602005022071D1 (de) | 2010-08-12 |
Family
ID=35451172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200560022071 Active DE602005022071D1 (de) | 2004-05-27 | 2005-03-23 | Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (2) | US7498727B2 (de) |
EP (1) | EP1763092B1 (de) |
JP (1) | JP4931334B2 (de) |
CN (1) | CN100583479C (de) |
DE (1) | DE602005022071D1 (de) |
WO (1) | WO2005117155A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10307825A1 (de) * | 2003-02-24 | 2004-09-09 | Epcos Ag | Elektrisches Vielschichtbauelement und Schichtstapel |
WO2005011009A1 (ja) * | 2003-07-28 | 2005-02-03 | Kyocera Corporation | 積層型電子部品とその製造方法及び積層型圧電素子 |
EP1675190B1 (de) * | 2003-09-24 | 2010-06-02 | Kyocera Corporation | Mehrschichtiges piezoelektrisches bauelement |
EP1732146B1 (de) * | 2004-03-09 | 2014-04-30 | Kyocera Corporation | Mehrschichtiges piezoelektrisches element |
ATE538502T1 (de) * | 2005-02-15 | 2012-01-15 | Murata Manufacturing Co | Mehrschichtiges piezoelektrisches bauelement |
EP1930962B1 (de) * | 2005-08-29 | 2013-03-20 | Kyocera Corporation | Geschichtetes piezoelektrisches element und injektionseinrichtung damit |
JP4864899B2 (ja) * | 2005-10-28 | 2012-02-01 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置 |
JP5211553B2 (ja) * | 2006-06-27 | 2013-06-12 | コニカミノルタアドバンストレイヤー株式会社 | アクチュエータ素子、及びアクチュエータ素子の製造方法 |
JP4911066B2 (ja) | 2007-02-26 | 2012-04-04 | 株式会社デンソー | 積層型圧電素子 |
US8421310B2 (en) | 2007-09-27 | 2013-04-16 | Kyocera Corporation | Multi-layer piezoelectric element, ejection apparatus using the same and fuel ejection system |
JP5133091B2 (ja) * | 2008-02-28 | 2013-01-30 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
EP2333858B1 (de) * | 2008-07-29 | 2014-10-22 | Kyocera Corporation | Piezoelektrisches vielschichtelement sowie einspritzvorrichtung und kraftstoffeinspritzsystem mit demselben |
CN102132432A (zh) * | 2008-08-26 | 2011-07-20 | 京瓷株式会社 | 层叠型压电元件及使用该层叠型压电元件的喷射装置以及燃料喷射系统 |
JP5419976B2 (ja) | 2009-05-26 | 2014-02-19 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
US8242651B2 (en) * | 2009-09-25 | 2012-08-14 | Siemens Industry, Inc. | Self-contained bearing lubrication system operating on oil ring lubricated by nozzle |
CN103180941B (zh) * | 2010-10-27 | 2016-06-29 | 京瓷株式会社 | 布线基板 |
JP5993330B2 (ja) * | 2013-03-18 | 2016-09-14 | オリンパス株式会社 | 積層型超音波振動デバイス、積層型超音波振動デバイスの製造方法および超音波医療装置 |
JP6193725B2 (ja) * | 2013-10-30 | 2017-09-06 | 京セラ株式会社 | 圧電セラミック基体、およびそれを用いた圧電アクチュエータ基板、液体吐出ヘッドならびに記録装置 |
JP2019134037A (ja) * | 2018-01-30 | 2019-08-08 | 太陽誘電株式会社 | 積層圧電セラミック部品の製造方法、積層圧電セラミック部品及び圧電デバイス |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2707782B2 (ja) * | 1989-06-01 | 1998-02-04 | 富士電機株式会社 | 積層型圧電素子 |
JP2545639B2 (ja) * | 1990-07-30 | 1996-10-23 | 富士通株式会社 | 積層型圧電素子 |
JPH0496385A (ja) * | 1990-08-13 | 1992-03-27 | Nec Corp | 積層セラミック圧電素子 |
JPH06120579A (ja) * | 1991-01-30 | 1994-04-28 | Nec Corp | 積層型圧電アクチュエータ |
JPH04340778A (ja) | 1991-01-30 | 1992-11-27 | Nec Corp | 積層圧電アクチュエータ素子 |
JPH06151994A (ja) * | 1992-10-29 | 1994-05-31 | Toyota Central Res & Dev Lab Inc | 積層型圧電素子 |
JPH06252469A (ja) * | 1993-02-25 | 1994-09-09 | Nec Corp | 積層圧電アクチュエータの製造方法 |
JPH06334236A (ja) * | 1993-05-20 | 1994-12-02 | Fujitsu Ltd | 積層型圧電・電歪アクチュエータの製造方法 |
US5406164A (en) * | 1993-06-10 | 1995-04-11 | Brother Kogyo Kabushiki Kaisha | Multilayer piezoelectric element |
JPH07312447A (ja) * | 1994-05-16 | 1995-11-28 | Chichibu Onoda Cement Corp | 圧電変位素子及びその製造方法 |
JP3237497B2 (ja) * | 1995-12-27 | 2001-12-10 | 株式会社村田製作所 | 導電ペースト並びにそれを用いた導電体及びセラミック基板 |
JPH09270540A (ja) | 1996-03-29 | 1997-10-14 | Chichibu Onoda Cement Corp | 積層型圧電アクチュエータ素子及びその製造方法 |
JP2000297273A (ja) * | 1998-03-17 | 2000-10-24 | Tosoh Corp | セラミックス微小粒研磨材およびその製造方法 |
JP3852649B2 (ja) * | 1998-08-18 | 2006-12-06 | ローム株式会社 | チップ抵抗器の製造方法 |
JP2000277381A (ja) * | 1999-03-25 | 2000-10-06 | Matsushita Electric Ind Co Ltd | 多連型積層セラミックコンデンサ |
JP2002054526A (ja) * | 2000-05-31 | 2002-02-20 | Denso Corp | インジェクタ用圧電体素子 |
JP2002299712A (ja) * | 2001-03-28 | 2002-10-11 | Toshiba Corp | 圧電素子、および超音波発振装置 |
JP2003017768A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 積層型圧電素子及び噴射装置 |
JP3872349B2 (ja) * | 2002-01-24 | 2007-01-24 | 京セラ株式会社 | 積層型圧電素子の製法 |
JP4104345B2 (ja) * | 2002-02-21 | 2008-06-18 | 独立行政法人科学技術振興機構 | 積層型圧電素子 |
DE10207530A1 (de) * | 2002-02-22 | 2003-09-11 | Epcos Ag | Piezoaktor mit strukturierter Außenelektrode |
JP3929858B2 (ja) * | 2002-09-04 | 2007-06-13 | 京セラ株式会社 | 積層型圧電素子 |
AU2003267172A1 (en) * | 2002-09-13 | 2004-04-30 | Towa-Intercon Technology, Inc. | Jet singulation of a substrate |
JP2004297041A (ja) * | 2003-03-12 | 2004-10-21 | Denso Corp | 積層型圧電体素子 |
JP4471606B2 (ja) * | 2003-08-26 | 2010-06-02 | 京セラ株式会社 | セラミック積層体の切断方法および積層型アクチュエータ |
WO2005064700A1 (ja) * | 2003-12-26 | 2005-07-14 | Murata Manufacturing Co., Ltd | 厚膜電極、及び積層セラミック電子部品 |
DE102005042520A1 (de) * | 2004-09-07 | 2006-03-30 | Denso Corp., Kariya | Gestapeltes piezoelektrisches Element und Herstellungsverfahren für dasselbe |
JP4876467B2 (ja) * | 2004-12-06 | 2012-02-15 | 株式会社デンソー | 積層型圧電素子 |
JP4736422B2 (ja) * | 2004-12-24 | 2011-07-27 | 株式会社デンソー | 積層型圧電素子の製造方法 |
-
2004
- 2004-05-27 JP JP2004158452A patent/JP4931334B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-23 US US11/569,656 patent/US7498727B2/en active Active
- 2005-03-23 WO PCT/JP2005/005229 patent/WO2005117155A1/ja active Application Filing
- 2005-03-23 DE DE200560022071 patent/DE602005022071D1/de active Active
- 2005-03-23 EP EP20050726962 patent/EP1763092B1/de active Active
- 2005-03-23 CN CN200580016973A patent/CN100583479C/zh active Active
-
2009
- 2009-01-21 US US12/357,252 patent/US8209827B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP4931334B2 (ja) | 2012-05-16 |
US8209827B2 (en) | 2012-07-03 |
US20090133238A1 (en) | 2009-05-28 |
US20080007143A1 (en) | 2008-01-10 |
US7498727B2 (en) | 2009-03-03 |
EP1763092A4 (de) | 2009-01-28 |
CN1961434A (zh) | 2007-05-09 |
CN100583479C (zh) | 2010-01-20 |
WO2005117155A1 (ja) | 2005-12-08 |
EP1763092A1 (de) | 2007-03-14 |
JP2005340540A (ja) | 2005-12-08 |
EP1763092B1 (de) | 2010-06-30 |
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