DE602005022071D1 - Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür - Google Patents

Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür

Info

Publication number
DE602005022071D1
DE602005022071D1 DE200560022071 DE602005022071T DE602005022071D1 DE 602005022071 D1 DE602005022071 D1 DE 602005022071D1 DE 200560022071 DE200560022071 DE 200560022071 DE 602005022071 T DE602005022071 T DE 602005022071T DE 602005022071 D1 DE602005022071 D1 DE 602005022071D1
Authority
DE
Germany
Prior art keywords
manufacturing
method therefor
multilayer piezoelectric
piezoelectric component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560022071
Other languages
English (en)
Inventor
Shigenobu Nakamura
Hiroyuki Masuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE602005022071D1 publication Critical patent/DE602005022071D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M51/00Fuel-injection apparatus characterised by being operated electrically
    • F02M51/06Injectors peculiar thereto with means directly operating the valve needle
    • F02M51/0603Injectors peculiar thereto with means directly operating the valve needle using piezoelectric or magnetostrictive operating means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
DE200560022071 2004-05-27 2005-03-23 Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür Active DE602005022071D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004158452A JP4931334B2 (ja) 2004-05-27 2004-05-27 噴射装置
PCT/JP2005/005229 WO2005117155A1 (ja) 2004-05-27 2005-03-23 積層型圧電素子及びその製造方法

Publications (1)

Publication Number Publication Date
DE602005022071D1 true DE602005022071D1 (de) 2010-08-12

Family

ID=35451172

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560022071 Active DE602005022071D1 (de) 2004-05-27 2005-03-23 Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür

Country Status (6)

Country Link
US (2) US7498727B2 (de)
EP (1) EP1763092B1 (de)
JP (1) JP4931334B2 (de)
CN (1) CN100583479C (de)
DE (1) DE602005022071D1 (de)
WO (1) WO2005117155A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10307825A1 (de) * 2003-02-24 2004-09-09 Epcos Ag Elektrisches Vielschichtbauelement und Schichtstapel
WO2005011009A1 (ja) * 2003-07-28 2005-02-03 Kyocera Corporation 積層型電子部品とその製造方法及び積層型圧電素子
EP1675190B1 (de) * 2003-09-24 2010-06-02 Kyocera Corporation Mehrschichtiges piezoelektrisches bauelement
EP1732146B1 (de) * 2004-03-09 2014-04-30 Kyocera Corporation Mehrschichtiges piezoelektrisches element
ATE538502T1 (de) * 2005-02-15 2012-01-15 Murata Manufacturing Co Mehrschichtiges piezoelektrisches bauelement
EP1930962B1 (de) * 2005-08-29 2013-03-20 Kyocera Corporation Geschichtetes piezoelektrisches element und injektionseinrichtung damit
JP4864899B2 (ja) * 2005-10-28 2012-02-01 京セラ株式会社 積層型圧電素子およびこれを用いた噴射装置
JP5211553B2 (ja) * 2006-06-27 2013-06-12 コニカミノルタアドバンストレイヤー株式会社 アクチュエータ素子、及びアクチュエータ素子の製造方法
JP4911066B2 (ja) 2007-02-26 2012-04-04 株式会社デンソー 積層型圧電素子
US8421310B2 (en) 2007-09-27 2013-04-16 Kyocera Corporation Multi-layer piezoelectric element, ejection apparatus using the same and fuel ejection system
JP5133091B2 (ja) * 2008-02-28 2013-01-30 太陽誘電株式会社 電子部品及びその製造方法
EP2333858B1 (de) * 2008-07-29 2014-10-22 Kyocera Corporation Piezoelektrisches vielschichtelement sowie einspritzvorrichtung und kraftstoffeinspritzsystem mit demselben
CN102132432A (zh) * 2008-08-26 2011-07-20 京瓷株式会社 层叠型压电元件及使用该层叠型压电元件的喷射装置以及燃料喷射系统
JP5419976B2 (ja) 2009-05-26 2014-02-19 京セラ株式会社 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム
US8242651B2 (en) * 2009-09-25 2012-08-14 Siemens Industry, Inc. Self-contained bearing lubrication system operating on oil ring lubricated by nozzle
CN103180941B (zh) * 2010-10-27 2016-06-29 京瓷株式会社 布线基板
JP5993330B2 (ja) * 2013-03-18 2016-09-14 オリンパス株式会社 積層型超音波振動デバイス、積層型超音波振動デバイスの製造方法および超音波医療装置
JP6193725B2 (ja) * 2013-10-30 2017-09-06 京セラ株式会社 圧電セラミック基体、およびそれを用いた圧電アクチュエータ基板、液体吐出ヘッドならびに記録装置
JP2019134037A (ja) * 2018-01-30 2019-08-08 太陽誘電株式会社 積層圧電セラミック部品の製造方法、積層圧電セラミック部品及び圧電デバイス

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2707782B2 (ja) * 1989-06-01 1998-02-04 富士電機株式会社 積層型圧電素子
JP2545639B2 (ja) * 1990-07-30 1996-10-23 富士通株式会社 積層型圧電素子
JPH0496385A (ja) * 1990-08-13 1992-03-27 Nec Corp 積層セラミック圧電素子
JPH06120579A (ja) * 1991-01-30 1994-04-28 Nec Corp 積層型圧電アクチュエータ
JPH04340778A (ja) 1991-01-30 1992-11-27 Nec Corp 積層圧電アクチュエータ素子
JPH06151994A (ja) * 1992-10-29 1994-05-31 Toyota Central Res & Dev Lab Inc 積層型圧電素子
JPH06252469A (ja) * 1993-02-25 1994-09-09 Nec Corp 積層圧電アクチュエータの製造方法
JPH06334236A (ja) * 1993-05-20 1994-12-02 Fujitsu Ltd 積層型圧電・電歪アクチュエータの製造方法
US5406164A (en) * 1993-06-10 1995-04-11 Brother Kogyo Kabushiki Kaisha Multilayer piezoelectric element
JPH07312447A (ja) * 1994-05-16 1995-11-28 Chichibu Onoda Cement Corp 圧電変位素子及びその製造方法
JP3237497B2 (ja) * 1995-12-27 2001-12-10 株式会社村田製作所 導電ペースト並びにそれを用いた導電体及びセラミック基板
JPH09270540A (ja) 1996-03-29 1997-10-14 Chichibu Onoda Cement Corp 積層型圧電アクチュエータ素子及びその製造方法
JP2000297273A (ja) * 1998-03-17 2000-10-24 Tosoh Corp セラミックス微小粒研磨材およびその製造方法
JP3852649B2 (ja) * 1998-08-18 2006-12-06 ローム株式会社 チップ抵抗器の製造方法
JP2000277381A (ja) * 1999-03-25 2000-10-06 Matsushita Electric Ind Co Ltd 多連型積層セラミックコンデンサ
JP2002054526A (ja) * 2000-05-31 2002-02-20 Denso Corp インジェクタ用圧電体素子
JP2002299712A (ja) * 2001-03-28 2002-10-11 Toshiba Corp 圧電素子、および超音波発振装置
JP2003017768A (ja) * 2001-06-28 2003-01-17 Kyocera Corp 積層型圧電素子及び噴射装置
JP3872349B2 (ja) * 2002-01-24 2007-01-24 京セラ株式会社 積層型圧電素子の製法
JP4104345B2 (ja) * 2002-02-21 2008-06-18 独立行政法人科学技術振興機構 積層型圧電素子
DE10207530A1 (de) * 2002-02-22 2003-09-11 Epcos Ag Piezoaktor mit strukturierter Außenelektrode
JP3929858B2 (ja) * 2002-09-04 2007-06-13 京セラ株式会社 積層型圧電素子
AU2003267172A1 (en) * 2002-09-13 2004-04-30 Towa-Intercon Technology, Inc. Jet singulation of a substrate
JP2004297041A (ja) * 2003-03-12 2004-10-21 Denso Corp 積層型圧電体素子
JP4471606B2 (ja) * 2003-08-26 2010-06-02 京セラ株式会社 セラミック積層体の切断方法および積層型アクチュエータ
WO2005064700A1 (ja) * 2003-12-26 2005-07-14 Murata Manufacturing Co., Ltd 厚膜電極、及び積層セラミック電子部品
DE102005042520A1 (de) * 2004-09-07 2006-03-30 Denso Corp., Kariya Gestapeltes piezoelektrisches Element und Herstellungsverfahren für dasselbe
JP4876467B2 (ja) * 2004-12-06 2012-02-15 株式会社デンソー 積層型圧電素子
JP4736422B2 (ja) * 2004-12-24 2011-07-27 株式会社デンソー 積層型圧電素子の製造方法

Also Published As

Publication number Publication date
JP4931334B2 (ja) 2012-05-16
US8209827B2 (en) 2012-07-03
US20090133238A1 (en) 2009-05-28
US20080007143A1 (en) 2008-01-10
US7498727B2 (en) 2009-03-03
EP1763092A4 (de) 2009-01-28
CN1961434A (zh) 2007-05-09
CN100583479C (zh) 2010-01-20
WO2005117155A1 (ja) 2005-12-08
EP1763092A1 (de) 2007-03-14
JP2005340540A (ja) 2005-12-08
EP1763092B1 (de) 2010-06-30

Similar Documents

Publication Publication Date Title
DE602005022071D1 (de) Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür
DE602006011570D1 (de) Piezoelektisches Vielschichtbauelement und Herstellungsverfahren dafür
EP1732146A4 (de) Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür
DE602006011710D1 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
DE602005025091D1 (de) Piezooszillator und herstellungsverfahren dafür
DE602005000585D1 (de) Piezoelektrischer Aktor und Bauelement
DE602005027449D1 (de) Wabenstruktur und herstellungsverfahren dafür
DE602005020725D1 (de) Piezoelektrisches Resonatorelement und piezoelektrisches Bauelement
DE602006009540D1 (de) L und herstellungsverfahren dafür
DE602006020117D1 (de) Nadellager und herstellungsverfahren dafür
DE602006017761D1 (de) Keramisches Elektronikbauteil und Vielschichtkondensator
DE602006021036D1 (de) Substituierte benzimidazole und herstellungsverfahren dafür
DE602005022751D1 (de) Gleitelement und herstellungsverfahren dafür
DE602006017185D1 (de) Innenautozierteil und herstellungsverfahren dafür
DE602005009957D1 (de) Rfid-einrichtung und herstellungsverfahren
DE602006000104D1 (de) Schaltungsvorrichtung und Herstellungsverfahren dafür
DE602006021761D1 (de) Lederartiges bahnenmaterial und herstellungsverfahren dafür
DE602005015791D1 (de) Keramischer Mehrschichtkondensator
DE602005020158D1 (de) Glucanderivate und herstellungsverfahren dafür
DE602006019201D1 (de) Rotor und herstellungsverfahren
DE602005009200D1 (de) Quecksilberfreisetzende zusammensetzungen und herstellungsverfahren dafür
DE602004030057D1 (de) Mehrschichtiges Piezoelektrisches Bauelement
DE602005004687D1 (de) Mehrschichtiger keramischer Kondensator
ZA200602215B (en) Honeycomb structure and manufacturing method thereof
DE602006020226D1 (de) Elektronisches Bauteil und dessen Herstellungsverfahren