DE602006017761D1 - Keramisches Elektronikbauteil und Vielschichtkondensator - Google Patents

Keramisches Elektronikbauteil und Vielschichtkondensator

Info

Publication number
DE602006017761D1
DE602006017761D1 DE602006017761T DE602006017761T DE602006017761D1 DE 602006017761 D1 DE602006017761 D1 DE 602006017761D1 DE 602006017761 T DE602006017761 T DE 602006017761T DE 602006017761 T DE602006017761 T DE 602006017761T DE 602006017761 D1 DE602006017761 D1 DE 602006017761D1
Authority
DE
Germany
Prior art keywords
electronic component
ceramic electronic
multilayer capacitor
multilayer
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006017761T
Other languages
English (en)
Inventor
Akitoshi Yoshii
Shirou Ootsuki
Taisuke Ahiko
Atsushi Takeda
Shinya Onodera
Miki Kimura
Hiromi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE602006017761D1 publication Critical patent/DE602006017761D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE602006017761T 2005-02-18 2006-02-10 Keramisches Elektronikbauteil und Vielschichtkondensator Active DE602006017761D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005042940A JP4747604B2 (ja) 2005-02-18 2005-02-18 セラミック電子部品

Publications (1)

Publication Number Publication Date
DE602006017761D1 true DE602006017761D1 (de) 2010-12-09

Family

ID=36120107

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006017761T Active DE602006017761D1 (de) 2005-02-18 2006-02-10 Keramisches Elektronikbauteil und Vielschichtkondensator

Country Status (5)

Country Link
US (1) US7304831B2 (de)
EP (1) EP1693864B1 (de)
JP (1) JP4747604B2 (de)
CN (1) CN1822263A (de)
DE (1) DE602006017761D1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200630008A (en) * 2005-02-04 2006-08-16 Ind Tech Res Inst Switch design for wireless communication
JP4799059B2 (ja) * 2005-06-27 2011-10-19 株式会社東芝 半導体装置
JP3861927B1 (ja) * 2005-07-07 2006-12-27 株式会社村田製作所 電子部品、電子部品の実装構造および電子部品の製造方法
JP2007281400A (ja) * 2006-04-04 2007-10-25 Taiyo Yuden Co Ltd 表面実装型セラミック電子部品
JP2008085280A (ja) * 2006-09-26 2008-04-10 Taiyo Yuden Co Ltd 表面実装型電子部品とその製造方法
JP4834022B2 (ja) * 2007-03-27 2011-12-07 古河電気工業株式会社 可動接点部品用銀被覆材およびその製造方法
US7808770B2 (en) * 2007-06-27 2010-10-05 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
JP5115349B2 (ja) * 2008-06-13 2013-01-09 株式会社村田製作所 積層セラミック電子部品およびその製造方法
CN101477893B (zh) * 2009-01-23 2011-02-16 华为技术有限公司 一种陶瓷电容器及其制造方法
JP4905497B2 (ja) * 2009-04-22 2012-03-28 株式会社村田製作所 電子部品
KR101053329B1 (ko) * 2009-07-09 2011-08-01 삼성전기주식회사 세라믹 전자부품
JP5246207B2 (ja) * 2010-06-04 2013-07-24 株式会社村田製作所 チップ型電子部品
CN103168332B (zh) * 2010-10-18 2015-11-25 株式会社村田制作所 芯片型陶瓷电子部件及其制造方法
EP2557420B1 (de) * 2011-08-12 2015-10-14 Nxp B.V. Halbleitervorrichtung mit Au-Cu-Elektroden und Verfahren zur Herstellung der Halbleitervorrichtung
US9202640B2 (en) * 2011-10-31 2015-12-01 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
JP2013165180A (ja) * 2012-02-10 2013-08-22 Tdk Corp 電子部品及び電子部品の製造方法
KR101792268B1 (ko) * 2012-03-13 2017-11-01 삼성전기주식회사 적층 세라믹 전자 부품
KR101751079B1 (ko) * 2012-06-28 2017-06-26 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
TW201501150A (zh) * 2013-06-17 2015-01-01 Mag Layers Scient Technics Co 模鑄電感焊接點製程
JP6011574B2 (ja) * 2013-06-27 2016-10-19 株式会社村田製作所 積層セラミックコンデンサ
CN104282427B (zh) * 2013-07-03 2016-12-28 美磊科技股份有限公司 模铸电感焊接点制作工艺
KR102097329B1 (ko) * 2013-09-12 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터 실장 기판
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
CN104576051B (zh) * 2013-10-25 2017-05-24 株式会社村田制作所 陶瓷电子部件
JP2015026840A (ja) * 2013-10-25 2015-02-05 株式会社村田製作所 セラミック電子部品及びテーピング電子部品連
JP6623574B2 (ja) * 2015-06-24 2019-12-25 株式会社村田製作所 積層セラミックコンデンサ
KR101892802B1 (ko) * 2016-04-25 2018-08-28 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
JP6627080B2 (ja) * 2016-05-06 2020-01-08 パナソニックＩｐマネジメント株式会社 チップ抵抗器の製造方法およびチップ抵抗器
CN114899007B (zh) * 2016-09-23 2023-09-01 Tdk株式会社 电子部件和电子部件装置
DE102020107286A1 (de) * 2019-03-28 2020-10-01 Taiyo Yuden Co., Ltd. Mehrschichtiger Keramikkondensator und Verfahren zu dessen Herstellung
CN113728406B (zh) * 2019-04-26 2023-05-23 株式会社村田制作所 电子部件和安装结构体
JP2020202220A (ja) * 2019-06-07 2020-12-17 株式会社村田製作所 積層セラミック電子部品
JP7379899B2 (ja) * 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
KR102270303B1 (ko) * 2019-08-23 2021-06-30 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
JP7338554B2 (ja) * 2020-05-20 2023-09-05 Tdk株式会社 セラミック電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107039A (ja) 1994-10-06 1996-04-23 Murata Mfg Co Ltd セラミック電子部品
KR100255906B1 (ko) * 1994-10-19 2000-05-01 모리시타 요이찌 전자부품과 그 제조방법
JPH08203771A (ja) 1995-01-27 1996-08-09 Murata Mfg Co Ltd セラミック電子部品
JPH113834A (ja) * 1996-07-25 1999-01-06 Murata Mfg Co Ltd 積層セラミックコンデンサおよびその製造方法
JPH10284343A (ja) 1997-04-11 1998-10-23 Mitsubishi Materials Corp チップ型電子部品
CN1523619B (zh) * 1997-11-18 2010-05-26 松下电器产业株式会社 层叠体及电容器
JPH11162771A (ja) 1997-11-25 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
US6542352B1 (en) * 1997-12-09 2003-04-01 Daniel Devoe Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
JP3331953B2 (ja) * 1998-03-19 2002-10-07 株式会社村田製作所 高圧コンデンサ
JP3376970B2 (ja) * 1999-09-08 2003-02-17 株式会社村田製作所 セラミック電子部品
JP2002246257A (ja) * 2001-02-19 2002-08-30 Murata Mfg Co Ltd 積層セラミック電子部品及びその製造方法
JP4556337B2 (ja) * 2001-03-22 2010-10-06 Ｔｄｋ株式会社 積層セラミック電子部品の製造方法
JP2003318059A (ja) 2002-04-25 2003-11-07 Kyocera Corp 積層セラミックコンデンサ
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法

Also Published As

Publication number Publication date
CN1822263A (zh) 2006-08-23
EP1693864B1 (de) 2010-10-27
US20060187613A1 (en) 2006-08-24
EP1693864A1 (de) 2006-08-23
JP2006229077A (ja) 2006-08-31
US7304831B2 (en) 2007-12-04
JP4747604B2 (ja) 2011-08-17

Similar Documents

Publication Publication Date Title
DE602006017761D1 (de) Keramisches Elektronikbauteil und Vielschichtkondensator
DE602006021119D1 (de) Dielektrische Keramikzusammensetzung, Elektronikbauteil und keramischer Mehrschichtkondensator
DE602005015791D1 (de) Keramischer Mehrschichtkondensator
DE602005004687D1 (de) Mehrschichtiger keramischer Kondensator
TWI319884B (en) Multilayer ceramic capacitors component and method of making the same
DE602006011570D1 (de) Piezoelektisches Vielschichtbauelement und Herstellungsverfahren dafür
DE602005006501D1 (de) Vielschichtkondensator
EP1884967A4 (de) Mehrschichtige keramik-elektronikkomponente und verfahren zu deren herstellung
DE602005022071D1 (de) Mehrschichtiges piezoelektrisches bauelement und herstellungsverfahren dafür
DE602006011710D1 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
TWI319582B (en) Laminated ceramic capacitor
FI20060256L (fi) Piirilevyn valmistaminen ja komponentin sisältävä piirilevy
EP1830372A4 (de) Mehrschichtiger kondensator und montagestruktur dafür
TWI315882B (en) Dielectric ceramic composition for low temperature sintering and multilayer ceramic capacitor using the same
HK1107975A1 (en) Dielectric ceramics and multi-layer ceramic capacitor
EP2028664A4 (de) Laminierte keramische elektronische komponente
DE602006020226D1 (de) Elektronisches Bauteil und dessen Herstellungsverfahren
GB2445907B (en) Ceramic doors and boards and applications thereof
EP1890302A4 (de) Keramik-elektronikkomponente und verfahren zu deren herstellung
DE602005014521D1 (de) Piezoelektrische Keramik und piezoelektrisches Bauteil
EP1953776A4 (de) Mehrschichtiger kondensator
DE602005019639D1 (de) Dielektrische keramische Zusammensetzung und elektronisches Gerät
EP2026379A4 (de) Mehrschichtige keramische elektronische komponente und herstellungsverfahren dafür
DE602005011082D1 (de) Dielektrische keramische Zusammensetzung und elektronisches Gerät
EP1953777A4 (de) Mehrschichtiger kondensator