DE602004019833D1 - Zusammensetzungen zur Zinnlegierungselektroplattierung und Verfahren - Google Patents

Zusammensetzungen zur Zinnlegierungselektroplattierung und Verfahren

Info

Publication number
DE602004019833D1
DE602004019833D1 DE602004019833T DE602004019833T DE602004019833D1 DE 602004019833 D1 DE602004019833 D1 DE 602004019833D1 DE 602004019833 T DE602004019833 T DE 602004019833T DE 602004019833 T DE602004019833 T DE 602004019833T DE 602004019833 D1 DE602004019833 D1 DE 602004019833D1
Authority
DE
Germany
Prior art keywords
methods
tin alloy
alloy electroplating
electroplating compositions
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004019833T
Other languages
English (en)
Inventor
Rozalia Beica
Neil D Brown
Kai Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of DE602004019833D1 publication Critical patent/DE602004019833D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B17/00—Accessories for brushes
    • A46B17/04—Protective covers for the bristles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
DE602004019833T 2003-04-07 2004-04-01 Zusammensetzungen zur Zinnlegierungselektroplattierung und Verfahren Expired - Lifetime DE602004019833D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46093703P 2003-04-07 2003-04-07

Publications (1)

Publication Number Publication Date
DE602004019833D1 true DE602004019833D1 (de) 2009-04-23

Family

ID=32869682

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004019833T Expired - Lifetime DE602004019833D1 (de) 2003-04-07 2004-04-01 Zusammensetzungen zur Zinnlegierungselektroplattierung und Verfahren

Country Status (7)

Country Link
US (1) US7151049B2 (de)
EP (1) EP1467004B1 (de)
JP (1) JP4758614B2 (de)
KR (1) KR101092328B1 (de)
CN (1) CN1570219B (de)
DE (1) DE602004019833D1 (de)
TW (1) TWI261632B (de)

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EP2194165A1 (de) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Verfahren zum Nachfüllen von Blech und seinen Legierungsmetallen in Elektrolytlösungen
EP2221396A1 (de) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Bleifreie Elektroplattierungszusammensetzungen aus Blechlegierung und Verfahren
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CN102517615A (zh) * 2011-12-19 2012-06-27 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种Sn-Ag合金电镀液
CN102644098B (zh) * 2012-04-20 2014-10-29 大连理工大学 一种无氰Au-Sn合金电镀液
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EP2722419B1 (de) 2012-10-19 2018-08-15 Rohm and Haas Electronic Materials LLC Dünnes Weißblech
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US8877630B1 (en) * 2013-11-12 2014-11-04 Chipmos Technologies Inc. Semiconductor structure having a silver alloy bump body and manufacturing method thereof
US9368340B2 (en) * 2014-06-02 2016-06-14 Lam Research Corporation Metallization of the wafer edge for optimized electroplating performance on resistive substrates
KR101636361B1 (ko) * 2014-07-31 2016-07-06 주식회사 에이피씨티 과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액
KR101722703B1 (ko) * 2015-04-10 2017-04-03 엘티씨에이엠 주식회사 주석-은 솔더 범프 도금액
KR101722704B1 (ko) * 2015-12-16 2017-04-11 엘티씨에이엠 주식회사 주석-은 솔더 범프 고속 도금액 및 이를 이용한 도금 방법
US20180016689A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium
US9809892B1 (en) 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US11280014B2 (en) * 2020-06-05 2022-03-22 Macdermid Enthone Inc. Silver/tin electroplating bath and method of using the same
CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液

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Also Published As

Publication number Publication date
CN1570219A (zh) 2005-01-26
KR101092328B1 (ko) 2011-12-09
CN1570219B (zh) 2011-04-27
TW200506106A (en) 2005-02-16
JP2004308006A (ja) 2004-11-04
EP1467004B1 (de) 2009-03-11
JP4758614B2 (ja) 2011-08-31
EP1467004A1 (de) 2004-10-13
KR20040087883A (ko) 2004-10-15
US7151049B2 (en) 2006-12-19
US20040253804A1 (en) 2004-12-16
TWI261632B (en) 2006-09-11

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