DE60137676D1 - Bildaufnahmegerät, Verfahren zur Herstellung, und elektrische Vorrichtung - Google Patents

Bildaufnahmegerät, Verfahren zur Herstellung, und elektrische Vorrichtung

Info

Publication number
DE60137676D1
DE60137676D1 DE60137676T DE60137676T DE60137676D1 DE 60137676 D1 DE60137676 D1 DE 60137676D1 DE 60137676 T DE60137676 T DE 60137676T DE 60137676 T DE60137676 T DE 60137676T DE 60137676 D1 DE60137676 D1 DE 60137676D1
Authority
DE
Germany
Prior art keywords
manufacture
imaging device
electrical device
electrical
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60137676T
Other languages
English (en)
Inventor
Masao Sagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60137676D1 publication Critical patent/DE60137676D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/14—Systems for two-way working
    • H04N7/141—Systems for two-way working between two video terminals, e.g. videophone
    • H04N7/142—Constructional details of the terminal equipment, e.g. arrangements of the camera and the display
    • H04N2007/145—Handheld terminals
DE60137676T 2000-11-14 2001-11-14 Bildaufnahmegerät, Verfahren zur Herstellung, und elektrische Vorrichtung Expired - Lifetime DE60137676D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000346564 2000-11-14

Publications (1)

Publication Number Publication Date
DE60137676D1 true DE60137676D1 (de) 2009-04-02

Family

ID=18820413

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137676T Expired - Lifetime DE60137676D1 (de) 2000-11-14 2001-11-14 Bildaufnahmegerät, Verfahren zur Herstellung, und elektrische Vorrichtung

Country Status (5)

Country Link
US (1) US7304684B2 (de)
EP (1) EP1220324B8 (de)
CN (1) CN1157052C (de)
DE (1) DE60137676D1 (de)
TW (1) TW528889B (de)

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003219459A1 (en) 2002-05-30 2003-12-19 Koninklijke Philips Electronics N.V. Electronic imaging device
JP2004104078A (ja) * 2002-06-28 2004-04-02 Sanyo Electric Co Ltd カメラモジュールおよびその製造方法
AU2003281652A1 (en) * 2002-07-18 2004-02-09 Koninklijke Philips Electronics N.V. Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
JP2005533451A (ja) * 2002-07-18 2005-11-04 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラモジュール、カメラモジュール中で使用されるホルダ、カメラシステム及びカメラモジュールの製造方法
US6823582B1 (en) * 2002-08-02 2004-11-30 National Semiconductor Corporation Apparatus and method for force mounting semiconductor packages to printed circuit boards
JP2004103860A (ja) * 2002-09-10 2004-04-02 Fujitsu Ltd 半導体装置、カメラモジュール及びその製造方法
TW558064U (en) * 2002-09-23 2003-10-11 Ist Internat Semiconductor Tec Thin type camera module
JP5030360B2 (ja) * 2002-12-25 2012-09-19 オリンパス株式会社 固体撮像装置の製造方法
FI20030071A (fi) * 2003-01-17 2004-07-18 Nokia Corp Kameramoduulin sijoittaminen kannettavaan laitteeseen
JP4204368B2 (ja) 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
JP2004304604A (ja) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd 小型カメラモジュールのソケットへの取付け構造
FR2854496B1 (fr) * 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur
FR2854498B1 (fr) 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur a capteur optique s'installant a l'interieur d'un objet.
TW579169U (en) * 2003-05-28 2004-03-01 Benq Corp Optical module for a digital camera
KR100526191B1 (ko) * 2003-06-18 2005-11-03 삼성전자주식회사 고체 촬상용 반도체 장치
TWM244685U (en) * 2003-07-04 2004-09-21 Hon Hai Prec Ind Co Ltd Digital cameral module
US6934065B2 (en) * 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
DE10344768B3 (de) 2003-09-26 2005-08-18 Siemens Ag Optisches Modul mit federndem Element zwischen Linsenhalter und Schaltungsträger und optisches System
FR2861217B1 (fr) * 2003-10-21 2006-03-17 St Microelectronics Sa Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
US7091124B2 (en) 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
JP3921467B2 (ja) * 2003-12-11 2007-05-30 シャープ株式会社 カメラモジュール、カメラモジュールの製造方法、電子機器及び電子機器の製造方法
US7253397B2 (en) * 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
KR100593555B1 (ko) * 2004-02-26 2006-06-28 (주)아이디에스 화상카메라 모듈
US7663693B2 (en) * 2004-03-01 2010-02-16 United Microelectronics Corp. Camera module
TWI282873B (en) * 2004-03-12 2007-06-21 Premier Image Technology Corp Lens module and assembling method thereof
JP4446773B2 (ja) * 2004-03-26 2010-04-07 富士フイルム株式会社 撮影装置
JP2005284147A (ja) * 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd 撮像装置
FR2869158A1 (fr) 2004-04-20 2005-10-21 St Microelectronics Sa Boitier semi-conducteur optique a moyen compressible de reglage
US7632713B2 (en) * 2004-04-27 2009-12-15 Aptina Imaging Corporation Methods of packaging microelectronic imaging devices
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
US20060109366A1 (en) * 2004-05-04 2006-05-25 Tessera, Inc. Compact lens turret assembly
CN1969539A (zh) * 2004-05-04 2007-05-23 德塞拉股份有限公司 紧凑透镜塔形组件
US20050247894A1 (en) 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
JP3830495B2 (ja) * 2004-05-10 2006-10-04 シャープ株式会社 半導体装置、半導体装置の製造方法及び光学装置用モジュール
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) * 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7714931B2 (en) * 2004-06-25 2010-05-11 Flextronics International Usa, Inc. System and method for mounting an image capture device on a flexible substrate
US7232754B2 (en) * 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7294897B2 (en) * 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7416913B2 (en) * 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) * 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060023107A1 (en) * 2004-08-02 2006-02-02 Bolken Todd O Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
US7364934B2 (en) * 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7397066B2 (en) * 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7223626B2 (en) * 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7115961B2 (en) * 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7276393B2 (en) * 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7083425B2 (en) 2004-08-27 2006-08-01 Micron Technology, Inc. Slanted vias for electrical circuits on circuit boards and other substrates
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7646075B2 (en) * 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7294827B2 (en) * 2004-09-21 2007-11-13 Delphi Technologies, Inc. Electronic module with light-blocking features
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7214919B2 (en) * 2005-02-08 2007-05-08 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060177999A1 (en) * 2005-02-10 2006-08-10 Micron Technology, Inc. Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
JP4852535B2 (ja) * 2005-04-01 2012-01-11 パナソニック株式会社 撮像装置
DE102005022406A1 (de) * 2005-05-13 2006-11-23 Robert Bosch Gmbh Bildsensoraufnahmesystem und Verfahren zur Herstellung
EP1734743A3 (de) * 2005-06-16 2011-08-31 Basler Aktiengesellschaft Träger für Sensorboards
CN1885909A (zh) * 2005-06-24 2006-12-27 鸿富锦精密工业（深圳）有限公司 数码相机模块
US7795134B2 (en) * 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US20060290001A1 (en) * 2005-06-28 2006-12-28 Micron Technology, Inc. Interconnect vias and associated methods of formation
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
JP4618507B2 (ja) 2005-10-28 2011-01-26 ソニー株式会社 カメラモジュールおよび電子機器
DE102006005519A1 (de) * 2006-02-07 2007-08-09 Siemens Ag Optisches Erfassungssystem
KR100748722B1 (ko) * 2006-04-03 2007-08-13 삼성전자주식회사 미소소자 패키지 모듈 및 그 제조방법
DE102006019717A1 (de) * 2006-04-27 2007-10-31 Siemens Ag Optisches Modul und Verfahren zum Herstellen eines optischen Moduls
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
DE102006035635A1 (de) 2006-07-31 2008-02-07 Osram Opto Semiconductors Gmbh Beleuchtungsanordnung
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US8112128B2 (en) 2006-08-31 2012-02-07 Flextronics Ap, Llc Discreetly positionable camera housing
CN101141562A (zh) * 2006-09-08 2008-03-12 鸿富锦精密工业（深圳）有限公司 影像感测装置
TWI394432B (zh) * 2006-11-27 2013-04-21 Hon Hai Prec Ind Co Ltd 數位相機模組及其組裝方法
JP2008148222A (ja) * 2006-12-13 2008-06-26 Matsushita Electric Ind Co Ltd 固体撮像装置とその製造方法
US7593636B2 (en) * 2007-02-01 2009-09-22 Tessera, Inc. Pin referenced image sensor to reduce tilt in a camera module
JP4302745B2 (ja) * 2007-02-19 2009-07-29 シャープ株式会社 カメラ装置およびそれを備えた電子機器
CN101303443A (zh) * 2007-05-11 2008-11-12 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法
CN101303444A (zh) * 2007-05-11 2008-11-12 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法
JP2009017234A (ja) * 2007-07-04 2009-01-22 Sharp Corp カメラ装置
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
JP2009086075A (ja) * 2007-09-28 2009-04-23 Alps Electric Co Ltd 鏡筒付きレンズ
US8564716B2 (en) * 2007-11-21 2013-10-22 Lg Innotek Co., Ltd. Camera module
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
JP5017168B2 (ja) * 2008-04-25 2012-09-05 日立オートモティブシステムズ株式会社 カメラ装置
US20100194465A1 (en) * 2009-02-02 2010-08-05 Ali Salih Temperature compensated current source and method therefor
KR101594831B1 (ko) * 2009-03-26 2016-02-17 삼성전자 주식회사 바이오 드라이브에서의 카메라 모듈 고정 구조
KR20110001659A (ko) * 2009-06-30 2011-01-06 삼성테크윈 주식회사 카메라 모듈
CN101998035B (zh) * 2009-08-24 2013-07-03 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法
TW201210327A (en) * 2010-08-19 2012-03-01 Hon Hai Prec Ind Co Ltd Camera module and manufacturing method of the same
TW201210326A (en) * 2010-08-19 2012-03-01 Hon Hai Prec Ind Co Ltd Camera module and manufacturing method of the same
TWI483026B (zh) * 2011-01-10 2015-05-01 Hon Hai Prec Ind Co Ltd 相機模組
US8982267B2 (en) 2011-07-27 2015-03-17 Flextronics Ap, Llc Camera module with particle trap
US9136289B2 (en) * 2011-08-23 2015-09-15 Flextronics Ap, Llc Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
JP6176118B2 (ja) * 2012-02-07 2017-08-09 株式会社ニコン 撮像ユニットおよび撮像装置
WO2014013742A1 (ja) * 2012-07-20 2014-01-23 株式会社ニコン 撮像ユニット、撮像装置、および撮像ユニットの製造方法
KR102089445B1 (ko) * 2012-08-08 2020-03-17 엘지이노텍 주식회사 카메라 모듈
US9060111B2 (en) * 2012-09-06 2015-06-16 Apple Inc. Electronic device with compact camera module
DE102013223858A1 (de) * 2013-11-21 2015-05-21 Conti Temic Microelectronic Gmbh Optische Vorrichtung mit optischem Modul, Bildaufnahmeelement und Trägerplatte
CN106031161B (zh) * 2013-12-27 2020-06-02 株式会社尼康 摄像单元、摄像装置以及基板
CN104954634B (zh) * 2014-03-25 2019-01-29 宁波舜宇光电信息有限公司 一种摄像模组及其制造方法
US9691801B2 (en) * 2014-12-22 2017-06-27 Stmicroelectronics Pte Ltd Image sensing device with cap and related methods
EP3306907B1 (de) 2015-06-08 2020-08-26 LG Innotek Co., Ltd. Kameramodul
CN105450913B (zh) * 2015-12-01 2020-04-28 宁波舜宇光电信息有限公司 摄像模组和电气支架及其组装方法和应用
US10750071B2 (en) * 2016-03-12 2020-08-18 Ningbo Sunny Opotech Co., Ltd. Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
CN109791267A (zh) * 2016-09-28 2019-05-21 夏普株式会社 光学设备及相机模块
CN207781947U (zh) * 2017-03-10 2018-08-28 唐虞企业股份有限公司 连接器
CN107477184B (zh) * 2017-06-16 2023-10-13 Oppo广东移动通信有限公司 密封件、摄像头组件、移动终端及其摄像头的安装方法
CN111405145B (zh) * 2019-01-02 2021-12-07 三赢科技（深圳）有限公司 相机模组以及具有该相机模组的电子装置
JP6901603B1 (ja) * 2020-03-27 2021-07-14 日本航空電子工業株式会社 基板対基板コネクタ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
JP2605174B2 (ja) * 1989-11-30 1997-04-30 富士写真フイルム株式会社 固体撮像装置の取付構造
JP3035784B2 (ja) * 1990-01-09 2000-04-24 コニカ株式会社 画像記録装置
JPH05275201A (ja) * 1992-03-27 1993-10-22 Nec Corp 接続端子
JP3207319B2 (ja) 1993-05-28 2001-09-10 株式会社東芝 光電変換装置及びその製造方法
JP3355881B2 (ja) 1994-09-21 2002-12-09 ソニー株式会社 固体撮像装置及びその製造方法
US5861654A (en) * 1995-11-28 1999-01-19 Eastman Kodak Company Image sensor assembly
JP3138191B2 (ja) * 1995-08-10 2001-02-26 三洋電機株式会社 固体撮像素子
US6795120B2 (en) * 1996-05-17 2004-09-21 Sony Corporation Solid-state imaging apparatus and camera using the same
JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
US6654064B2 (en) * 1997-05-23 2003-11-25 Canon Kabushiki Kaisha Image pickup device incorporating a position defining member
JP3750276B2 (ja) * 1997-05-23 2006-03-01 ソニー株式会社 固体撮像素子の搭載方法および固体撮像素子パッケージの装着方法
JP3836235B2 (ja) * 1997-12-25 2006-10-25 松下電器産業株式会社 固体撮像装置及びその製造方法
JP4003991B2 (ja) * 1998-04-14 2007-11-07 Ｃｂｃ株式会社 電子撮像装置
JP2000069336A (ja) 1998-08-26 2000-03-03 Sanyo Electric Co Ltd 撮像装置の取付け構造
JP2001188155A (ja) 1999-12-28 2001-07-10 Kuurii Components Kk 撮像素子の固定手段

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