DE60126596D1 - Leiterplattenherstellungsverfahren und leiterplattenherstellungs-einrichtung - Google Patents

Leiterplattenherstellungsverfahren und leiterplattenherstellungs-einrichtung

Info

Publication number
DE60126596D1
DE60126596D1 DE60126596T DE60126596T DE60126596D1 DE 60126596 D1 DE60126596 D1 DE 60126596D1 DE 60126596 T DE60126596 T DE 60126596T DE 60126596 T DE60126596 T DE 60126596T DE 60126596 D1 DE60126596 D1 DE 60126596D1
Authority
DE
Germany
Prior art keywords
pcb
plate manufacturing
platform equipment
pcb plate
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60126596T
Other languages
English (en)
Other versions
DE60126596T2 (de
Inventor
Toshiaki Takenaka
Toshihiro Nishii
Yuichiro Sugita
Shinji Nakamura
Hideaki Komoda
Toshikazu Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60126596D1 publication Critical patent/DE60126596D1/de
Application granted granted Critical
Publication of DE60126596T2 publication Critical patent/DE60126596T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
DE60126596T 2000-12-04 2001-12-04 Leiterplattenherstellungsverfahren und leiterplattenherstellungs-einrichtung Expired - Lifetime DE60126596T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000368046 2000-12-04
JP2000368046A JP3721982B2 (ja) 2000-12-04 2000-12-04 回路形成基板の製造方法および回路形成基板の製造装置
PCT/JP2001/010572 WO2002047450A1 (fr) 2000-12-04 2001-12-04 Procede et dispositif de production d'une carte a circuits imprimes

Publications (2)

Publication Number Publication Date
DE60126596D1 true DE60126596D1 (de) 2007-03-29
DE60126596T2 DE60126596T2 (de) 2007-05-31

Family

ID=18838361

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60126596T Expired - Lifetime DE60126596T2 (de) 2000-12-04 2001-12-04 Leiterplattenherstellungsverfahren und leiterplattenherstellungs-einrichtung

Country Status (7)

Country Link
US (1) US7018672B2 (de)
EP (1) EP1278405B1 (de)
JP (1) JP3721982B2 (de)
CN (1) CN1250058C (de)
DE (1) DE60126596T2 (de)
TW (1) TW511425B (de)
WO (1) WO2002047450A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6810797B2 (en) * 2000-06-29 2004-11-02 Toray Engineering Company, Limited Method of resin-sealing electronic parts, and stencil printing plate used therefor
US6946384B2 (en) * 2003-06-06 2005-09-20 Intel Corporation Stacked device underfill and a method of fabrication
US7320928B2 (en) * 2003-06-20 2008-01-22 Intel Corporation Method of forming a stacked device filler
JP3972902B2 (ja) * 2003-12-26 2007-09-05 松下電器産業株式会社 回路基板の製造方法および製造装置
JP2007291469A (ja) * 2006-04-26 2007-11-08 Ebara Corp 基板処理方法、半導体装置及び基板処理装置
JP2011031506A (ja) * 2009-08-03 2011-02-17 Panasonic Corp 印刷用版
JP4973796B1 (ja) 2011-04-27 2012-07-11 パナソニック株式会社 配線基板の製造方法
JP5229437B2 (ja) 2011-04-27 2013-07-03 パナソニック株式会社 配線基板の製造方法
EP2590488A4 (de) 2011-07-27 2013-10-23 Panasonic Corp Verfahren zur herstellung einer wiederverwendbaren paste, wiederverwendbare paste und verfahren zur herstellung eines verdrahtungssubstrats mit der wiederverwendbaren paste
TWI501377B (zh) * 2012-11-30 2015-09-21 Unistars 半導體結構、半導體單元及其製造方法
CN104411120B (zh) * 2014-11-28 2017-05-24 广州杰赛科技股份有限公司 电路板盲孔的塞孔判定方法及装置
CN104411121B (zh) * 2014-11-28 2017-09-26 广州杰赛科技股份有限公司 塞孔的判定方法及装置
US11950378B2 (en) * 2021-08-13 2024-04-02 Harbor Electronics, Inc. Via bond attachment

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126891A (ja) * 1983-12-13 1985-07-06 松下電器産業株式会社 スクリ−ン印刷機
US4893556A (en) * 1987-02-23 1990-01-16 Tdk Corporation Screen printer with double doctor/squeegee, printing pressure sensor and aligning mechanism
JPH0349293A (ja) * 1989-07-17 1991-03-04 Toshiba Corp 配線基板用印刷装置
JPH04247687A (ja) * 1991-02-04 1992-09-03 Matsushita Electric Ind Co Ltd クリーム半田の自動練り方法
JPH0516327A (ja) * 1991-07-17 1993-01-26 Toshiba Corp スクリーン印刷装置
JPH05237986A (ja) * 1992-02-26 1993-09-17 Ibiden Co Ltd 高粘度ペーストの充填方法及び充填装置
JP2601128B2 (ja) 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
JP3314434B2 (ja) * 1993-02-09 2002-08-12 松下電器産業株式会社 クリーム半田のスクリーン印刷方法
CN1268182C (zh) * 1995-08-30 2006-08-02 松下电器产业株式会社 丝网印刷方法和丝网印刷设备
JPH09314799A (ja) * 1996-05-30 1997-12-09 Matsushita Electric Ind Co Ltd スクリーン印刷方法およびスクリーン印刷装置
US5761803A (en) * 1996-06-26 1998-06-09 St. John; Frank Method of forming plugs in vias of a circuit board by utilizing a porous membrane
DE69737281T2 (de) * 1996-12-10 2007-12-20 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung und Verfahren zum Drucken von Lötpaste
JP3644270B2 (ja) * 1997-09-03 2005-04-27 松下電器産業株式会社 ペースト充填方法およびペースト充填装置
JPH11227157A (ja) * 1998-02-18 1999-08-24 Fuji Mach Mfg Co Ltd クリーム半田印刷機
JP2000071419A (ja) * 1998-08-31 2000-03-07 Matsushita Electric Ind Co Ltd スクリーン印刷方法
JP2977198B1 (ja) * 1998-10-20 1999-11-10 日本特殊陶業株式会社 プリント配線板の製造方法
JP2000188472A (ja) * 1998-12-22 2000-07-04 Matsushita Electric Works Ltd スルーホールへのペーストの充填方法
JP2000238233A (ja) * 1999-02-23 2000-09-05 Fuji Mach Mfg Co Ltd スクリーン検査方法，装置およびスクリーン印刷機
JP2000299560A (ja) * 1999-04-15 2000-10-24 Matsushita Electric Ind Co Ltd セラミック回路板の製造方法
JP2000309081A (ja) * 1999-04-27 2000-11-07 Matsushita Electric Ind Co Ltd スクリーン印刷方法
JP2001191483A (ja) * 2000-01-17 2001-07-17 Fuji Mach Mfg Co Ltd スクリーン印刷方法およびスクリーン印刷機
JP2001203437A (ja) * 2000-01-20 2001-07-27 Matsushita Electric Ind Co Ltd ブラインドビア用ペースト充填方法およびペースト充填装置
GB2360252B (en) * 2000-03-07 2002-07-24 Matsushita Electric Ind Co Ltd Screen printing method

Also Published As

Publication number Publication date
CN1250058C (zh) 2006-04-05
EP1278405B1 (de) 2007-02-14
US20030138553A1 (en) 2003-07-24
US7018672B2 (en) 2006-03-28
JP2002171060A (ja) 2002-06-14
EP1278405A1 (de) 2003-01-22
TW511425B (en) 2002-11-21
DE60126596T2 (de) 2007-05-31
EP1278405A4 (de) 2004-09-15
CN1397153A (zh) 2003-02-12
WO2002047450A1 (fr) 2002-06-13
JP3721982B2 (ja) 2005-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP