DE69930970D1 - Mehrschichtige gedruckte leiterplatte und ihre herstellungsmethode - Google Patents

Mehrschichtige gedruckte leiterplatte und ihre herstellungsmethode

Info

Publication number
DE69930970D1
DE69930970D1 DE69930970T DE69930970T DE69930970D1 DE 69930970 D1 DE69930970 D1 DE 69930970D1 DE 69930970 T DE69930970 T DE 69930970T DE 69930970 T DE69930970 T DE 69930970T DE 69930970 D1 DE69930970 D1 DE 69930970D1
Authority
DE
Germany
Prior art keywords
manufacturing
multilayer printed
printed pcb
pcb
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69930970T
Other languages
English (en)
Other versions
DE69930970T2 (de
Inventor
Motoo Asai
Kouta Noda
Takashi Kariya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69930970D1 publication Critical patent/DE69930970D1/de
Publication of DE69930970T2 publication Critical patent/DE69930970T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69930970T 1999-05-13 1999-05-13 Mehrschichtige gedruckte leiterplatte und ihre herstellungsmethode Expired - Lifetime DE69930970T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/002488 WO2000070925A1 (fr) 1998-01-28 1999-05-13 Carte a circuit imprime multicouche et procede de fabrication correspondant

Publications (2)

Publication Number Publication Date
DE69930970D1 true DE69930970D1 (de) 2006-05-24
DE69930970T2 DE69930970T2 (de) 2006-08-31

Family

ID=14235674

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69930970T Expired - Lifetime DE69930970T2 (de) 1999-05-13 1999-05-13 Mehrschichtige gedruckte leiterplatte und ihre herstellungsmethode

Country Status (6)

Country Link
US (1) US6762921B1 (de)
EP (1) EP1194024B1 (de)
KR (1) KR100556818B1 (de)
CN (1) CN1182767C (de)
DE (1) DE69930970T2 (de)
WO (1) WO2000070925A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69936892T2 (de) 1998-02-26 2007-12-06 Ibiden Co., Ltd., Ogaki Mehrschichtige Leiterplatte mit gefüllten Kontaktlöchern
MY144573A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP3986743B2 (ja) 2000-10-03 2007-10-03 株式会社日立製作所 配線基板とその製造方法及びそれに用いる無電解銅めっき液
JP2004031586A (ja) * 2002-06-25 2004-01-29 Sony Corp 半導体装置の製造方法
KR100584965B1 (ko) * 2003-02-24 2006-05-29 삼성전기주식회사 패키지 기판 및 그 제조 방법
JP5214154B2 (ja) * 2007-01-19 2013-06-19 住友電気工業株式会社 プリント配線板およびその製造方法
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
KR100950916B1 (ko) * 2008-05-06 2010-04-01 삼성전기주식회사 인쇄회로기판의 제조방법 및 이에 의해 제조된인쇄회로기판
KR100993342B1 (ko) * 2008-09-03 2010-11-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US8426959B2 (en) * 2009-08-19 2013-04-23 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
JP5725962B2 (ja) * 2010-04-27 2015-05-27 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
US8552564B2 (en) * 2010-12-09 2013-10-08 Intel Corporation Hybrid-core through holes and vias
CN102307437B (zh) * 2011-08-24 2012-12-12 上海美维科技有限公司 提高半加成工艺中积层基材与积层导体层的结合力的方法
US20130284500A1 (en) * 2012-04-25 2013-10-31 Jun-Chung Hsu Laminate circuit board structure
JPWO2014034539A1 (ja) * 2012-08-27 2016-08-08 日本ゼオン株式会社 回路基板の製造方法
KR20170038535A (ko) * 2015-09-30 2017-04-07 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US20170179042A1 (en) * 2015-12-17 2017-06-22 International Business Machines Corporation Protection of elements on a laminate surface
CN108633175B (zh) * 2017-03-23 2020-08-28 欣兴电子股份有限公司 线路板堆叠结构及其制作方法
JP7056226B2 (ja) 2018-02-27 2022-04-19 Tdk株式会社 回路モジュール
JP2022178308A (ja) * 2021-05-20 2022-12-02 イビデン株式会社 プリント配線板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585502A (en) * 1984-04-27 1986-04-29 Hitachi Condenser Co., Ltd. Process for producing printed circuit board
JPS61163691A (ja) 1985-01-14 1986-07-24 松下電工株式会社 プリント配線板の電路形成方法
JPH06177511A (ja) 1992-12-02 1994-06-24 Ibiden Co Ltd プリント配線板
JP3400049B2 (ja) * 1993-11-26 2003-04-28 住友ベークライト株式会社 プリント配線板用接着剤及びこの接着剤を用いたプリント配線板の製造方法
US5827604A (en) * 1994-12-01 1998-10-27 Ibiden Co., Ltd. Multilayer printed circuit board and method of producing the same
JPH09223859A (ja) 1996-02-16 1997-08-26 Ibiden Co Ltd プリント配線板
JP3229923B2 (ja) 1996-03-01 2001-11-19 イビデン株式会社 多層プリント配線板およびその製造方法
JP3560299B2 (ja) 1996-03-13 2004-09-02 三井金属鉱業株式会社 ヴィアホール付き多層プリント配線板
US5770032A (en) * 1996-10-16 1998-06-23 Fidelity Chemical Products Corporation Metallizing process
EP1802186B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatte
US6835895B1 (en) * 1996-12-19 2004-12-28 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JPH10261869A (ja) 1997-01-17 1998-09-29 Ibiden Co Ltd 多層プリント配線板
JPH1168308A (ja) 1997-08-22 1999-03-09 Ngk Spark Plug Co Ltd 配線基板の製造方法
US6541301B1 (en) * 1999-02-12 2003-04-01 Brook David Raymond Low RF loss direct die attach process and apparatus
JP3635219B2 (ja) * 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法

Also Published As

Publication number Publication date
DE69930970T2 (de) 2006-08-31
CN1350771A (zh) 2002-05-22
WO2000070925A1 (fr) 2000-11-23
KR100556818B1 (ko) 2006-03-10
CN1182767C (zh) 2004-12-29
EP1194024A4 (de) 2004-08-25
US6762921B1 (en) 2004-07-13
EP1194024B1 (de) 2006-04-19
EP1194024A1 (de) 2002-04-03
KR20020002502A (ko) 2002-01-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition