DE60231952D1 - Leiterplattenanordnung und Verfahren zu deren Herstellung - Google Patents

Leiterplattenanordnung und Verfahren zu deren Herstellung

Info

Publication number
DE60231952D1
DE60231952D1 DE60231952T DE60231952T DE60231952D1 DE 60231952 D1 DE60231952 D1 DE 60231952D1 DE 60231952 T DE60231952 T DE 60231952T DE 60231952 T DE60231952 T DE 60231952T DE 60231952 D1 DE60231952 D1 DE 60231952D1
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
board assembly
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231952T
Other languages
English (en)
Inventor
Shunichi Kikuchi
Mitsutaka Yamada
Kenji Iketaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE60231952D1 publication Critical patent/DE60231952D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
DE60231952T 2001-12-14 2002-07-17 Leiterplattenanordnung und Verfahren zu deren Herstellung Expired - Lifetime DE60231952D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001381326A JP3816380B2 (ja) 2001-12-14 2001-12-14 吸熱用ダミー部品を備えた基板ユニット及びその製造方法

Publications (1)

Publication Number Publication Date
DE60231952D1 true DE60231952D1 (de) 2009-05-28

Family

ID=19187321

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231952T Expired - Lifetime DE60231952D1 (de) 2001-12-14 2002-07-17 Leiterplattenanordnung und Verfahren zu deren Herstellung

Country Status (4)

Country Link
US (1) US6787711B2 (de)
EP (1) EP1320288B1 (de)
JP (1) JP3816380B2 (de)
DE (1) DE60231952D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4518114B2 (ja) * 2007-07-25 2010-08-04 Ｔｄｋ株式会社 電子部品内蔵基板及びその製造方法
JP4518113B2 (ja) 2007-07-25 2010-08-04 Ｔｄｋ株式会社 電子部品内蔵基板及びその製造方法
EP2276329A1 (de) * 2009-07-16 2011-01-19 ABB Research Ltd. Elektronische Platine mit Wärmekondensator
US10879211B2 (en) 2016-06-30 2020-12-29 R.S.M. Electron Power, Inc. Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
JP6737221B2 (ja) 2017-04-11 2020-08-05 株式会社デンソー 電動パワーステアリング制御装置および電子ユニット。
JP7543863B2 (ja) 2020-11-17 2024-09-03 富士電機株式会社 半導体モジュール

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113512A (ja) * 1988-10-21 1990-04-25 Matsushita Electric Ind Co Ltd フィルムコンデンサ
US4941067A (en) * 1989-04-07 1990-07-10 Motorola Inc. Thermal shunt for electronic circuits
JPH02309602A (ja) * 1989-05-24 1990-12-25 Matsushita Electric Ind Co Ltd 角形チップ抵抗器
US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
US6021046A (en) * 1993-06-09 2000-02-01 Dallas Semiconductor Corporation Thermal protection of electrical elements systems
JPH0737337A (ja) 1993-07-08 1995-02-07 Hitachi Ltd ディジタル信号記録再生方法およびその装置
JPH0888463A (ja) * 1994-09-19 1996-04-02 Fujitsu Ltd 電子部品のはんだ付け実装方法
JPH08213724A (ja) * 1995-01-31 1996-08-20 Mitsumi Electric Co Ltd 回路基板
JPH1022335A (ja) * 1996-06-28 1998-01-23 Toyota Motor Corp ハンダ膜厚制御方法
ES2196453T3 (es) * 1997-12-24 2003-12-16 Denso Corp Aparato con circuito electronico y metodo para montar el mismo.
US6281573B1 (en) * 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6034875A (en) * 1998-06-17 2000-03-07 International Business Machines Corporation Cooling structure for electronic components
US6175500B1 (en) * 1998-09-22 2001-01-16 Lucent Technologies Inc. Surface mount thermal connections
JP2000114674A (ja) * 1998-10-08 2000-04-21 Sony Corp 伝熱部を備えるプリント回路板およびプリント配線基板
JP2001085827A (ja) 1999-09-14 2001-03-30 Fuji Xerox Co Ltd プリント配線基板
JP2001291741A (ja) * 2000-04-06 2001-10-19 Nec Corp 半導体集積回路実装方法及び半導体集積回路装置

Also Published As

Publication number Publication date
JP2003188506A (ja) 2003-07-04
JP3816380B2 (ja) 2006-08-30
EP1320288B1 (de) 2009-04-15
US6787711B2 (en) 2004-09-07
EP1320288A2 (de) 2003-06-18
EP1320288A3 (de) 2004-10-13
US20030111262A1 (en) 2003-06-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE