DE60110820T2 - Polierkissen mit vorteilhafter textur - Google Patents

Polierkissen mit vorteilhafter textur Download PDF

Info

Publication number
DE60110820T2
DE60110820T2 DE60110820T DE60110820T DE60110820T2 DE 60110820 T2 DE60110820 T2 DE 60110820T2 DE 60110820 T DE60110820 T DE 60110820T DE 60110820 T DE60110820 T DE 60110820T DE 60110820 T2 DE60110820 T2 DE 60110820T2
Authority
DE
Germany
Prior art keywords
polishing pad
polishing
groove
grooves
microtexture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110820T
Other languages
German (de)
English (en)
Other versions
DE60110820D1 (de
Inventor
Scott Barry PINHEIRO
Steven Naugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Application granted granted Critical
Publication of DE60110820D1 publication Critical patent/DE60110820D1/de
Publication of DE60110820T2 publication Critical patent/DE60110820T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60110820T 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur Expired - Lifetime DE60110820T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23374700P 2000-09-19 2000-09-19
US233747P 2000-09-19
PCT/US2001/029114 WO2002024415A1 (en) 2000-09-19 2001-09-18 Polishing pad having an advantageous micro-texture

Publications (2)

Publication Number Publication Date
DE60110820D1 DE60110820D1 (de) 2005-06-16
DE60110820T2 true DE60110820T2 (de) 2006-01-26

Family

ID=22878534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110820T Expired - Lifetime DE60110820T2 (de) 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur

Country Status (7)

Country Link
US (1) US6641471B1 (enExample)
EP (1) EP1320443B1 (enExample)
JP (1) JP4926351B2 (enExample)
KR (1) KR100571448B1 (enExample)
DE (1) DE60110820T2 (enExample)
TW (1) TW491755B (enExample)
WO (1) WO2002024415A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
US10707069B2 (en) 2010-03-10 2020-07-07 Siltronic Ag Method for polishing a semiconductor wafer

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WO2002024415A1 (en) 2002-03-28
KR20030028846A (ko) 2003-04-10
EP1320443A1 (en) 2003-06-25
EP1320443B1 (en) 2005-05-11
JP4926351B2 (ja) 2012-05-09
DE60110820D1 (de) 2005-06-16
TW491755B (en) 2002-06-21
US6641471B1 (en) 2003-11-04
JP2002144220A (ja) 2002-05-21
KR100571448B1 (ko) 2006-04-17

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