DE60110820T2 - Polierkissen mit vorteilhafter textur - Google Patents

Polierkissen mit vorteilhafter textur Download PDF

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Publication number
DE60110820T2
DE60110820T2 DE60110820T DE60110820T DE60110820T2 DE 60110820 T2 DE60110820 T2 DE 60110820T2 DE 60110820 T DE60110820 T DE 60110820T DE 60110820 T DE60110820 T DE 60110820T DE 60110820 T2 DE60110820 T2 DE 60110820T2
Authority
DE
Germany
Prior art keywords
polishing pad
polishing
groove
grooves
microtexture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110820T
Other languages
German (de)
English (en)
Other versions
DE60110820D1 (de
Inventor
Scott Barry PINHEIRO
Steven Naugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Application granted granted Critical
Publication of DE60110820D1 publication Critical patent/DE60110820D1/de
Publication of DE60110820T2 publication Critical patent/DE60110820T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60110820T 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur Expired - Lifetime DE60110820T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23374700P 2000-09-19 2000-09-19
US233747P 2000-09-19
PCT/US2001/029114 WO2002024415A1 (en) 2000-09-19 2001-09-18 Polishing pad having an advantageous micro-texture

Publications (2)

Publication Number Publication Date
DE60110820D1 DE60110820D1 (de) 2005-06-16
DE60110820T2 true DE60110820T2 (de) 2006-01-26

Family

ID=22878534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110820T Expired - Lifetime DE60110820T2 (de) 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur

Country Status (7)

Country Link
US (1) US6641471B1 (enExample)
EP (1) EP1320443B1 (enExample)
JP (1) JP4926351B2 (enExample)
KR (1) KR100571448B1 (enExample)
DE (1) DE60110820T2 (enExample)
TW (1) TW491755B (enExample)
WO (1) WO2002024415A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe

Families Citing this family (137)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832950B2 (en) * 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
EP1052062A1 (en) 1999-05-03 2000-11-15 Applied Materials, Inc. Pré-conditioning fixed abrasive articles
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
JP2004537175A (ja) * 2001-08-02 2004-12-09 エスケーシー カンパニー，リミテッド レーザーを使用した化学的機械的研磨パッドの製造方法
US6632026B2 (en) * 2001-08-24 2003-10-14 Nihon Microcoating Co., Ltd. Method of polishing optical fiber connector
US7050605B2 (en) * 2002-01-02 2006-05-23 Jonas Elliott Gerson Designing tread with fractal characteristics
US20030224678A1 (en) * 2002-05-31 2003-12-04 Applied Materials, Inc. Web pad design for chemical mechanical polishing
TWI250572B (en) * 2002-06-03 2006-03-01 Jsr Corp Polishing pad and multi-layer polishing pad
JP4266579B2 (ja) 2002-06-28 2009-05-20 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
JP4168839B2 (ja) 2003-03-06 2008-10-22 日産自動車株式会社 金属ベルト
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP4532077B2 (ja) * 2003-03-27 2010-08-25 ニッタ・ハース株式会社 仕上げ研磨用研磨布
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
WO2005035194A2 (en) * 2003-10-09 2005-04-21 Thomas West, Inc. Stacked pad and method of use
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
EP1588803A1 (en) * 2004-04-21 2005-10-26 JSR Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method
JP2005333121A (ja) * 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
JP2006110665A (ja) * 2004-10-14 2006-04-27 Nihon Micro Coating Co Ltd 研磨パッド
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
SG160369A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
JP2006320982A (ja) * 2005-05-17 2006-11-30 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4979200B2 (ja) * 2005-05-17 2012-07-18 東洋ゴム工業株式会社 研磨パッド
KR101134058B1 (ko) 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
EP1943056A1 (fr) * 2005-10-11 2008-07-16 RM Distribution Galet de polissage de revetement mural et procede de fabrication
US7290471B2 (en) * 2005-11-15 2007-11-06 3M Innovative Properties Company Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
JP2007255277A (ja) * 2006-03-23 2007-10-04 Jtekt Corp カムフォロア
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
MX2009000576A (es) * 2006-07-14 2009-05-11 Saint Gobain Abrasives Inc Articulo abrasivo sin respaldo.
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7234224B1 (en) 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP2008235508A (ja) * 2007-03-20 2008-10-02 Kuraray Co Ltd 研磨パッド、それを用いた研磨方法および半導体デバイスの製造方法
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5143518B2 (ja) * 2007-09-27 2013-02-13 株式会社クラレ 繊維複合研磨パッド
TWI473685B (zh) * 2008-01-15 2015-02-21 Iv Technologies Co Ltd 研磨墊及其製造方法
JP2009267367A (ja) * 2008-03-31 2009-11-12 Toshiba Corp 半導体装置の製造方法
JP4641319B2 (ja) * 2008-05-12 2011-03-02 ジヤトコ株式会社 無段変速機用ベルト
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
US7906427B2 (en) * 2008-10-14 2011-03-15 General Electric Company Dimension profiling of SiC devices
WO2010045151A2 (en) * 2008-10-16 2010-04-22 Applied Materials, Inc. Textured platen
JP5502987B2 (ja) 2009-03-24 2014-05-28 サンーゴバン アブレイシブズ，インコーポレイティド 化学機械平坦化パッドコンディショナとして使用するための研磨工具
JP5453526B2 (ja) 2009-06-02 2014-03-26 サンーゴバン アブレイシブズ，インコーポレイティド 耐腐食性ｃｍｐコンディショニング工具並びにその作製および使用法
US8951099B2 (en) 2009-09-01 2015-02-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR20120104344A (ko) * 2009-12-29 2012-09-20 생-고벵 아브라시프 가정용 표면의 세정 방법
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
SG10201608125WA (en) 2012-04-02 2016-11-29 Thomas West Inc Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10022842B2 (en) * 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
SG11201606734RA (en) * 2014-02-20 2016-09-29 Thomas West Inc Method and systems to control optical transmissivity of a polish pad material
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN108698206B (zh) 2016-01-19 2021-04-02 应用材料公司 多孔化学机械抛光垫
CN108701610B (zh) 2016-03-09 2023-06-02 应用材料公司 增材制造中制造形状的校正
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
KR102362022B1 (ko) * 2016-07-12 2022-02-10 가부시키가이샤 노리타케 캄파니 리미티드 연마체 및 그 제조 방법
US11137243B2 (en) 2016-09-20 2021-10-05 Applied Materials, Inc. Two step curing of polishing pad material in additive manufacturing
US20180085888A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having a consistent pad surface microtexture
US9802293B1 (en) 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
US10786885B2 (en) 2017-01-20 2020-09-29 Applied Materials, Inc. Thin plastic polishing article for CMP applications
CN109153107A (zh) * 2017-03-31 2019-01-04 古河电气工业株式会社 抛光垫
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US11826876B2 (en) 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
WO2020255744A1 (ja) 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
JP7032469B2 (ja) * 2020-03-26 2022-03-08 大同メタル工業株式会社 摺動部材
US12138738B2 (en) * 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022020480A1 (en) * 2020-07-22 2022-01-27 Elemental Scientific, Inc. Abrasive sampling system and method for representative homogeneous, and planarized preparation of solid samples for laser ablation
KR102512675B1 (ko) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114196327A (zh) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 一种用于光学零件抛光的复合材料及制备方法
WO2025226271A1 (en) * 2024-04-25 2025-10-30 Ursa Major Technologies, Inc. Rocket motor additive manufacturing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5569062A (en) 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
EP1015176B1 (en) 1997-04-04 2003-03-12 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
US5990010A (en) 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6139402A (en) 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
US10707069B2 (en) 2010-03-10 2020-07-07 Siltronic Ag Method for polishing a semiconductor wafer

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KR20030028846A (ko) 2003-04-10
EP1320443B1 (en) 2005-05-11
EP1320443A1 (en) 2003-06-25
KR100571448B1 (ko) 2006-04-17
JP4926351B2 (ja) 2012-05-09
JP2002144220A (ja) 2002-05-21
WO2002024415A1 (en) 2002-03-28
DE60110820D1 (de) 2005-06-16
TW491755B (en) 2002-06-21

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