TW491755B - Polishing pad having an advantageous micro-texture and methods relating thereto - Google Patents
Polishing pad having an advantageous micro-texture and methods relating thereto Download PDFInfo
- Publication number
- TW491755B TW491755B TW090123032A TW90123032A TW491755B TW 491755 B TW491755 B TW 491755B TW 090123032 A TW090123032 A TW 090123032A TW 90123032 A TW90123032 A TW 90123032A TW 491755 B TW491755 B TW 491755B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing pad
- pad
- polymer
- item
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23374700P | 2000-09-19 | 2000-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW491755B true TW491755B (en) | 2002-06-21 |
Family
ID=22878534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090123032A TW491755B (en) | 2000-09-19 | 2001-09-19 | Polishing pad having an advantageous micro-texture and methods relating thereto |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6641471B1 (enExample) |
| EP (1) | EP1320443B1 (enExample) |
| JP (1) | JP4926351B2 (enExample) |
| KR (1) | KR100571448B1 (enExample) |
| DE (1) | DE60110820T2 (enExample) |
| TW (1) | TW491755B (enExample) |
| WO (1) | WO2002024415A1 (enExample) |
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- 2001-09-18 KR KR1020037003986A patent/KR100571448B1/ko not_active Expired - Lifetime
- 2001-09-18 DE DE60110820T patent/DE60110820T2/de not_active Expired - Lifetime
- 2001-09-18 EP EP01973123A patent/EP1320443B1/en not_active Expired - Lifetime
- 2001-09-18 WO PCT/US2001/029114 patent/WO2002024415A1/en not_active Ceased
- 2001-09-19 TW TW090123032A patent/TW491755B/zh not_active IP Right Cessation
- 2001-09-19 JP JP2001285787A patent/JP4926351B2/ja not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7132070B2 (en) | 2002-11-19 | 2006-11-07 | Iv Technologies, Co., Ltd. | Method of manufacturing polishing pad |
| CN100537143C (zh) * | 2004-04-21 | 2009-09-09 | Jsr株式会社 | 化学机械研磨垫、其制造方法和化学机械研磨方法 |
| TWI418429B (zh) * | 2005-11-15 | 2013-12-11 | 3M Innovative Properties Co | 具有圍繞一ｙ方向可變旋轉橫向跨越一工件以形成微結構之切割工具 |
| TWI418443B (zh) * | 2006-05-25 | 2013-12-11 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 化學機械研磨墊 |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| TWI558501B (zh) * | 2010-07-08 | 2016-11-21 | 奈平科技股份有限公司 | 用於拋光半導體基板之軟性拋光墊及其製備方法 |
| TWI587978B (zh) * | 2010-07-08 | 2017-06-21 | 奈平科技股份有限公司 | 用於拋光半導體基板之軟性拋光墊及其製備方法 |
| TWI594840B (zh) * | 2012-09-27 | 2017-08-11 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 製造經溝槽化之化學機械硏磨層之方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002024415A1 (en) | 2002-03-28 |
| KR20030028846A (ko) | 2003-04-10 |
| EP1320443A1 (en) | 2003-06-25 |
| EP1320443B1 (en) | 2005-05-11 |
| JP4926351B2 (ja) | 2012-05-09 |
| DE60110820T2 (de) | 2006-01-26 |
| DE60110820D1 (de) | 2005-06-16 |
| US6641471B1 (en) | 2003-11-04 |
| JP2002144220A (ja) | 2002-05-21 |
| KR100571448B1 (ko) | 2006-04-17 |
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