DE60110820D1 - Polierkissen mit vorteilhafter textur - Google Patents

Polierkissen mit vorteilhafter textur

Info

Publication number
DE60110820D1
DE60110820D1 DE60110820T DE60110820T DE60110820D1 DE 60110820 D1 DE60110820 D1 DE 60110820D1 DE 60110820 T DE60110820 T DE 60110820T DE 60110820 T DE60110820 T DE 60110820T DE 60110820 D1 DE60110820 D1 DE 60110820D1
Authority
DE
Germany
Prior art keywords
pillow
polishing
advantageous texture
texture
advantageous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110820T
Other languages
English (en)
Other versions
DE60110820T2 (de
Inventor
Scott Pinheiro
Steven Naugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Application granted granted Critical
Publication of DE60110820D1 publication Critical patent/DE60110820D1/de
Publication of DE60110820T2 publication Critical patent/DE60110820T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60110820T 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur Expired - Lifetime DE60110820T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23374700P 2000-09-19 2000-09-19
US233747P 2000-09-19
PCT/US2001/029114 WO2002024415A1 (en) 2000-09-19 2001-09-18 Polishing pad having an advantageous micro-texture

Publications (2)

Publication Number Publication Date
DE60110820D1 true DE60110820D1 (de) 2005-06-16
DE60110820T2 DE60110820T2 (de) 2006-01-26

Family

ID=22878534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110820T Expired - Lifetime DE60110820T2 (de) 2000-09-19 2001-09-18 Polierkissen mit vorteilhafter textur

Country Status (7)

Country Link
US (1) US6641471B1 (de)
EP (1) EP1320443B1 (de)
JP (1) JP4926351B2 (de)
KR (1) KR100571448B1 (de)
DE (1) DE60110820T2 (de)
TW (1) TW491755B (de)
WO (1) WO2002024415A1 (de)

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832950B2 (en) * 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2004537175A (ja) * 2001-08-02 2004-12-09 エスケーシー カンパニー，リミテッド レーザーを使用した化学的機械的研磨パッドの製造方法
US6632026B2 (en) * 2001-08-24 2003-10-14 Nihon Microcoating Co., Ltd. Method of polishing optical fiber connector
US7050605B2 (en) * 2002-01-02 2006-05-23 Jonas Elliott Gerson Designing tread with fractal characteristics
US20030224678A1 (en) * 2002-05-31 2003-12-04 Applied Materials, Inc. Web pad design for chemical mechanical polishing
TWI250572B (en) * 2002-06-03 2006-03-01 Jsr Corp Polishing pad and multi-layer polishing pad
JP4266579B2 (ja) 2002-06-28 2009-05-20 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
JP4168839B2 (ja) 2003-03-06 2008-10-22 日産自動車株式会社 金属ベルト
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP4532077B2 (ja) * 2003-03-27 2010-08-25 ニッタ・ハース株式会社 仕上げ研磨用研磨布
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US20070087177A1 (en) * 2003-10-09 2007-04-19 Guangwei Wu Stacked pad and method of use
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
EP1588803A1 (de) * 2004-04-21 2005-10-26 JSR Corporation CMP Polierkissen, dessen Herstellung und Poliermethode
JP2005333121A (ja) * 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP2006110665A (ja) * 2004-10-14 2006-04-27 Nihon Micro Coating Co Ltd 研磨パッド
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
CN101115779B (zh) 2005-03-08 2012-09-19 东洋橡胶工业株式会社 研磨垫及其制造方法
KR101134058B1 (ko) * 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
JP4979200B2 (ja) * 2005-05-17 2012-07-18 東洋ゴム工業株式会社 研磨パッド
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
JP2006320982A (ja) * 2005-05-17 2006-11-30 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
EP1943056A1 (de) * 2005-10-11 2008-07-16 RM Distribution Polierwalze für wandbeschichtung und herstellungsverfahren dafür
US7290471B2 (en) * 2005-11-15 2007-11-06 3M Innovative Properties Company Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
JP2007255277A (ja) * 2006-03-23 2007-10-04 Jtekt Corp カムフォロア
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
TWI337915B (en) * 2006-07-14 2011-03-01 Saint Gobain Abrasives Inc Backingless abrasive article
WO2008026451A1 (en) 2006-08-28 2008-03-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7234224B1 (en) 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP2008235508A (ja) * 2007-03-20 2008-10-02 Kuraray Co Ltd 研磨パッド、それを用いた研磨方法および半導体デバイスの製造方法
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5143518B2 (ja) * 2007-09-27 2013-02-13 株式会社クラレ 繊維複合研磨パッド
TWI473685B (zh) * 2008-01-15 2015-02-21 Iv Technologies Co Ltd 研磨墊及其製造方法
JP2009267367A (ja) * 2008-03-31 2009-11-12 Toshiba Corp 半導体装置の製造方法
JP4641319B2 (ja) * 2008-05-12 2011-03-02 ジヤトコ株式会社 無段変速機用ベルト
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
US7906427B2 (en) * 2008-10-14 2011-03-15 General Electric Company Dimension profiling of SiC devices
JP2012505763A (ja) * 2008-10-16 2012-03-08 アプライド マテリアルズ インコーポレイテッド テクスチャ付きプラテン
WO2010110834A1 (en) 2009-03-24 2010-09-30 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
MY155563A (en) 2009-06-02 2015-10-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
WO2011028700A2 (en) 2009-09-01 2011-03-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
AU2010343085A1 (en) * 2009-12-29 2012-06-14 Saint-Gobain Abrasifs Method of cleaning a household surface
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
TWI671161B (zh) 2012-04-02 2019-09-11 美商湯瑪士衛斯有限公司 用於離心鑄造聚合物拋光墊之方法及系統及由該方法製得之拋光墊
US10022842B2 (en) * 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
WO2015127077A1 (en) * 2014-02-20 2015-08-27 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
JP6545261B2 (ja) 2014-10-17 2019-07-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR102629800B1 (ko) 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6941618B2 (ja) 2016-03-09 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 付加製造で製造される形状の補正
WO2018012468A1 (ja) * 2016-07-12 2018-01-18 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
US10830545B2 (en) 2016-07-12 2020-11-10 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a heat sink
US11137243B2 (en) 2016-09-20 2021-10-05 Applied Materials, Inc. Two step curing of polishing pad material in additive manufacturing
US9802293B1 (en) 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
US20180085888A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having a consistent pad surface microtexture
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWM573509U (zh) 2017-01-20 2019-01-21 美商應用材料股份有限公司 用於cmp 應用的薄的塑膠拋光用具及支撐元件
KR102285674B1 (ko) * 2017-03-31 2021-08-04 후루카와 덴끼고교 가부시키가이샤 연마 패드
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US10882160B2 (en) 2017-05-25 2021-01-05 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using sacrificial material
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20200140931A (ko) 2018-05-07 2020-12-16 어플라이드 머티어리얼스, 인코포레이티드 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
WO2020255744A1 (ja) 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
JP7032469B2 (ja) * 2020-03-26 2022-03-08 大同メタル工業株式会社 摺動部材
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
WO2022020480A1 (en) * 2020-07-22 2022-01-27 Elemental Scientific, Inc. Abrasive sampling system and method for representative homogeneous, and planarized preparation of solid samples for laser ablation
KR102512675B1 (ko) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114196327A (zh) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 一种用于光学零件抛光的复合材料及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5569062A (en) 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
DE69812127T2 (de) 1997-04-04 2003-11-27 Rodel Inc Polierkissen und verfahren zu seiner herstellung
US5990010A (en) 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6139402A (en) 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates

Also Published As

Publication number Publication date
KR20030028846A (ko) 2003-04-10
EP1320443B1 (de) 2005-05-11
JP4926351B2 (ja) 2012-05-09
WO2002024415A1 (en) 2002-03-28
US6641471B1 (en) 2003-11-04
JP2002144220A (ja) 2002-05-21
DE60110820T2 (de) 2006-01-26
TW491755B (en) 2002-06-21
KR100571448B1 (ko) 2006-04-17
EP1320443A1 (de) 2003-06-25

Similar Documents

Publication Publication Date Title
DE60110820D1 (de) Polierkissen mit vorteilhafter textur
CY2008006I1 (el) Παραγωγα τροπανιου χρησιμα στη θepαπευτικη
DE69903175T2 (de) Kosmetisches kissen mit reinigender bräusemittel
ID30366A (id) Pakaian dalam sekali pakai
DE60112388D1 (de) Bildaufzeichnungselement mit Schaumkern und glänzender Oberfläche
AT4231U3 (de) Einstellbares schleifkissen
GB2372695B (en) Improvements in furniture
GB0026329D0 (en) Improvements in relation to duvets
DE50106854D1 (de) Thermobehälter
GB0224690D0 (en) Cervical pillow with profiled surface
GB0010355D0 (en) In remembrance
DE60007567D1 (de) Kissen mit abnehmbaren Überzug
CA88957S (en) Corner vase
GB0008091D0 (en) Pillow
GB0015543D0 (en) Pillow
GB0002659D0 (en) Groundsheet airbed
CA90999S (en) Vase
TW445850U (en) Chair with simple pillow structure
TW466935U (en) Pillow structure
TW480979U (en) Adjustable pillow
FI4346U1 (fi) Sovitelma tyynyssä tai sen kaltaisessa
SE0002203D0 (sv) Handledskudde
AU144525S (en) Vase
GB0010218D0 (en) Active picture in picture
FI990199A (fi) Sovitelma tyynyssä, patjassa tai sen kaltaisessa

Legal Events

Date Code Title Description
8364 No opposition during term of opposition