DE60101756D1 - Leiterplatte mit körnigem magnetischem Film - Google Patents

Leiterplatte mit körnigem magnetischem Film

Info

Publication number
DE60101756D1
DE60101756D1 DE60101756T DE60101756T DE60101756D1 DE 60101756 D1 DE60101756 D1 DE 60101756D1 DE 60101756 T DE60101756 T DE 60101756T DE 60101756 T DE60101756 T DE 60101756T DE 60101756 D1 DE60101756 D1 DE 60101756D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
magnetic film
granular magnetic
granular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60101756T
Other languages
English (en)
Other versions
DE60101756T2 (de
Inventor
Yoshio Awakura
Shinya Watanabe
Satoshi Shiratori
Hiroshi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
NEC Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000101765A external-priority patent/JP4417521B2/ja
Priority claimed from JP2000101756A external-priority patent/JP2001284755A/ja
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Publication of DE60101756D1 publication Critical patent/DE60101756D1/de
Application granted granted Critical
Publication of DE60101756T2 publication Critical patent/DE60101756T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
DE60101756T 2000-04-04 2001-04-04 Leiterplatte mit körnigem magnetischem Film Expired - Lifetime DE60101756T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000101765A JP4417521B2 (ja) 2000-04-04 2000-04-04 配線基板
JP2000101756 2000-04-04
JP2000101756A JP2001284755A (ja) 2000-04-04 2000-04-04 配線基板
JP2000101765 2000-04-04

Publications (2)

Publication Number Publication Date
DE60101756D1 true DE60101756D1 (de) 2004-02-19
DE60101756T2 DE60101756T2 (de) 2004-12-02

Family

ID=26589399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60101756T Expired - Lifetime DE60101756T2 (de) 2000-04-04 2001-04-04 Leiterplatte mit körnigem magnetischem Film

Country Status (9)

Country Link
US (4) US6653573B2 (de)
EP (1) EP1143774B1 (de)
KR (1) KR100882388B1 (de)
CN (1) CN100336423C (de)
DE (1) DE60101756T2 (de)
MY (1) MY126823A (de)
NO (1) NO20011707L (de)
SG (1) SG100666A1 (de)
TW (1) TWI268125B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143516B1 (de) * 2000-04-04 2009-03-11 NEC TOKIN Corporation Halbleiterbaustein mit einem elektromagnetischen Geräuschunterdrücker und Verfahren zur Herstellung
JP2002064189A (ja) * 2000-08-21 2002-02-28 Tokin Corp マグネティック・ランダム・アクセス・メモリ
US7371471B2 (en) * 2004-03-08 2008-05-13 Nec Tokin Corporation Electromagnetic noise suppressing thin film
JP4701942B2 (ja) * 2005-09-14 2011-06-15 Ｔｄｋ株式会社 半導体ｉｃ内蔵モジュール
US8134084B2 (en) * 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
DE102007055291A1 (de) * 2006-11-22 2008-06-26 Nec Tokin Corp., Sendai Mehrschichtige gedruckte Leiterplatte
JP5139750B2 (ja) * 2006-11-22 2013-02-06 Ｎｅｃトーキン株式会社 多層プリント配線基板
TWI382645B (zh) * 2006-12-29 2013-01-11 Hon Hai Prec Ind Co Ltd 電源裝置
JP5082060B2 (ja) * 2008-05-22 2012-11-28 学校法人明星学苑 低特性インピーダンス電源・グランドペア線路構造
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
US9307631B2 (en) * 2013-01-25 2016-04-05 Laird Technologies, Inc. Cavity resonance reduction and/or shielding structures including frequency selective surfaces
JP6350513B2 (ja) * 2013-02-27 2018-07-04 日本電気株式会社 配線基板、半導体装置、プリント基板及び配線基板の製造方法
CN108289369B (zh) * 2017-01-09 2020-12-25 莱尔德技术股份有限公司 具有介电间隔件的吸收器组件以及相应的组装方法
CN110035603B (zh) * 2019-04-25 2021-08-03 电子科技大学 一种印制电路埋嵌电感的制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531468B2 (de) 1972-08-30 1978-01-19
JPH01151297A (ja) 1987-12-08 1989-06-14 Nec Corp 複合回路基板
JPH01235662A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 記録電極及びその製造法
JP2799465B2 (ja) * 1989-10-04 1998-09-17 イビデン株式会社 磁性合金層被覆回路基板
EP0422760A1 (de) * 1989-10-12 1991-04-17 Mitsubishi Rayon Co., Ltd Amorphe legierung und Verfahren zu ihrer Herstellung
JPH04196285A (ja) * 1990-11-27 1992-07-16 Ibiden Co Ltd 金属層被覆回路基板
JPH05183291A (ja) 1991-12-27 1993-07-23 Japan Metals & Chem Co Ltd Ｅｍｉシールドプリント配線板の製造方法
JPH06275927A (ja) 1993-03-19 1994-09-30 Cmk Corp 磁界・電磁波シールド層を有するプリント配線板とそ の製造方法
JPH0758485A (ja) 1993-08-20 1995-03-03 Cmk Corp 磁界・電磁波シールド層を有するプリント配線板 とその製造方法
JP2665134B2 (ja) * 1993-09-03 1997-10-22 日本黒鉛工業株式会社 フレキシブル回路基板及びその製造方法
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
US5738931A (en) * 1994-09-16 1998-04-14 Kabushiki Kaisha Toshiba Electronic device and magnetic device
JPH08250858A (ja) 1995-03-07 1996-09-27 Ngk Spark Plug Co Ltd 回路基板
US5698131A (en) * 1995-05-15 1997-12-16 Matsushita Electric Industrial Co., Ltd. Paste for manufacturing ferrite and ferrite
JP3327375B2 (ja) * 1996-04-26 2002-09-24 富士通株式会社 磁気抵抗効果型トランスデューサ、その製造方法及び磁気記録装置
JP3151155B2 (ja) * 1996-09-10 2001-04-03 アルプス電気株式会社 薄膜磁気ヘッド
JPH10105961A (ja) * 1996-09-26 1998-04-24 Mitsubishi Chem Corp 磁気記録媒体およびその記録再生方法ならびに磁気記録装置
JP3184465B2 (ja) * 1996-11-19 2001-07-09 アルプス電気株式会社 薄膜磁気ヘッドおよびその製造方法
JP2867985B2 (ja) * 1996-12-20 1999-03-10 日本電気株式会社 プリント回路基板
JPH1196520A (ja) * 1997-09-17 1999-04-09 Fujitsu Ltd 磁気ヘッド及びその製造方法並びに該磁気ヘッドを備えた磁気記録装置
JPH11233909A (ja) 1998-02-18 1999-08-27 Kyocera Corp 配線基板
US5998048A (en) * 1998-03-02 1999-12-07 Lucent Technologies Inc. Article comprising anisotropic Co-Fe-Cr-N soft magnetic thin films
JPH11274362A (ja) 1998-03-25 1999-10-08 Kyocera Corp 配線基板
JP3769120B2 (ja) * 1998-05-08 2006-04-19 株式会社東芝 半導体素子
JP3474455B2 (ja) * 1998-09-10 2003-12-08 Ｔｄｋ株式会社 薄膜磁気ヘッドおよびその製造方法
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6462630B1 (en) * 2000-07-03 2002-10-08 Oki Electric Cable Co., Ltd. Wideband noise reducing device

Also Published As

Publication number Publication date
US20040124941A1 (en) 2004-07-01
EP1143774A3 (de) 2002-02-27
MY126823A (en) 2006-10-31
US6653573B2 (en) 2003-11-25
NO20011707L (no) 2001-10-05
US6919772B2 (en) 2005-07-19
US6953899B1 (en) 2005-10-11
SG100666A1 (en) 2003-12-26
US6956173B2 (en) 2005-10-18
EP1143774B1 (de) 2004-01-14
DE60101756T2 (de) 2004-12-02
US20010037897A1 (en) 2001-11-08
NO20011707D0 (no) 2001-04-04
KR100882388B1 (ko) 2009-02-05
TWI268125B (en) 2006-12-01
EP1143774A2 (de) 2001-10-10
KR20010095320A (ko) 2001-11-03
CN100336423C (zh) 2007-09-05
US20040124005A1 (en) 2004-07-01
CN1321059A (zh) 2001-11-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition