DE60036993D1 - Piezoelektrisches/elektrostriktives Bauelement und dessen Herstellungsverfahren - Google Patents

Piezoelektrisches/elektrostriktives Bauelement und dessen Herstellungsverfahren

Info

Publication number
DE60036993D1
DE60036993D1 DE60036993T DE60036993T DE60036993D1 DE 60036993 D1 DE60036993 D1 DE 60036993D1 DE 60036993 T DE60036993 T DE 60036993T DE 60036993 T DE60036993 T DE 60036993T DE 60036993 D1 DE60036993 D1 DE 60036993D1
Authority
DE
Germany
Prior art keywords
piezoelectric
manufacturing
electrostrictive device
electrostrictive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036993T
Other languages
English (en)
Other versions
DE60036993T2 (de
Inventor
Yukihisa Takeuchi
Tsutomu Nanataki
Koji Ikeda
Koji Kimura
Kazuyoshi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/524,042 external-priority patent/US6498419B1/en
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE60036993D1 publication Critical patent/DE60036993D1/de
Publication of DE60036993T2 publication Critical patent/DE60036993T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H10N30/2043—Cantilevers, i.e. having one fixed end connected at their free ends, e.g. parallelogram type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/501—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane parallel to the stacking direction, e.g. polygonal or trapezoidal in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
DE2000636993 1999-10-01 2000-09-29 Piezoelektrisches/elektrostriktives Bauelement und dessen Herstellungsverfahren Expired - Lifetime DE60036993T2 (de)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
JP28152299 1999-10-01
JP28152299 1999-10-01
JP30784499 1999-10-28
JP30784499 1999-10-28
JP32619599 1999-11-16
JP32619599 1999-11-16
JP37196799 1999-12-27
JP37196799 1999-12-27
JP2000013576 2000-01-21
JP2000013576 2000-01-21
JP2000015123 2000-01-24
JP2000015123 2000-01-24
JP2000056434 2000-03-01
JP2000056434 2000-03-01
US09/524,042 US6498419B1 (en) 1999-10-01 2000-03-13 Piezoelectric/electrostrictive device having mutually opposing end surfaces and method of manufacturing the same
US524042 2000-03-13
JP2000169584A JP4058223B2 (ja) 1999-10-01 2000-06-06 圧電／電歪デバイス及びその製造方法
JP2000169584 2000-06-06

Publications (2)

Publication Number Publication Date
DE60036993D1 true DE60036993D1 (de) 2007-12-20
DE60036993T2 DE60036993T2 (de) 2008-08-28

Family

ID=27577724

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2000636993 Expired - Lifetime DE60036993T2 (de) 1999-10-01 2000-09-29 Piezoelektrisches/elektrostriktives Bauelement und dessen Herstellungsverfahren

Country Status (4)

Country Link
US (6) US6534898B1 (de)
EP (1) EP1089352B1 (de)
JP (1) JP4058223B2 (de)
DE (1) DE60036993T2 (de)

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US6404109B1 (en) 1999-10-01 2002-06-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device having increased strength
JP4058223B2 (ja) 1999-10-01 2008-03-05 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
US6915547B2 (en) 1999-10-01 2005-07-12 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
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US6525448B1 (en) 1999-10-01 2003-02-25 Ngk Insulators Ltd Piezoelectric/electrostrictive device
JP3436735B2 (ja) 1999-10-01 2003-08-18 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
EP1833102A3 (de) 1999-10-01 2009-04-08 Ngk Insulators, Ltd. Piezoelektrische/elektrostriktive Vorrichtung
JP3436727B2 (ja) * 1999-10-01 2003-08-18 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
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US7164221B1 (en) * 1999-10-01 2007-01-16 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
EP1306908A4 (de) * 2000-06-16 2006-10-04 Ngk Insulators Ltd Piezoelektrisches/elektrostriktives bauelement und verfahren zu seiner herstellung
US7345406B2 (en) * 2001-01-18 2008-03-18 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device
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US6624549B2 (en) * 2001-03-02 2003-09-23 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of fabricating the same
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US10768738B1 (en) 2017-09-27 2020-09-08 Apple Inc. Electronic device having a haptic actuator with magnetic augmentation
US10942571B2 (en) 2018-06-29 2021-03-09 Apple Inc. Laptop computing device with discrete haptic regions
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JP4007767B2 (ja) 2001-01-18 2007-11-14 日本碍子株式会社 圧電／電歪デバイスおよびその製造方法
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JP4038400B2 (ja) 2001-09-11 2008-01-23 日本碍子株式会社 セラミック積層体、セラミック積層体の製造方法、圧電／電歪デバイス、圧電／電歪デバイスの製造方法及びセラミック焼結体
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Also Published As

Publication number Publication date
EP1089352A2 (de) 2001-04-04
US20080054761A1 (en) 2008-03-06
US6476538B2 (en) 2002-11-05
US7321180B2 (en) 2008-01-22
EP1089352A3 (de) 2004-10-06
JP2001320103A (ja) 2001-11-16
DE60036993T2 (de) 2008-08-28
EP1089352B1 (de) 2007-11-07
JP4058223B2 (ja) 2008-03-05
US6534898B1 (en) 2003-03-18
US20040017133A1 (en) 2004-01-29
US20030020369A1 (en) 2003-01-30
US20050168109A1 (en) 2005-08-04
US6605887B2 (en) 2003-08-12
US20020070637A1 (en) 2002-06-13

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