DE60027510T2 - Halbleiterscheibe Poliervorrichtung - Google Patents

Halbleiterscheibe Poliervorrichtung Download PDF

Info

Publication number
DE60027510T2
DE60027510T2 DE60027510T DE60027510T DE60027510T2 DE 60027510 T2 DE60027510 T2 DE 60027510T2 DE 60027510 T DE60027510 T DE 60027510T DE 60027510 T DE60027510 T DE 60027510T DE 60027510 T2 DE60027510 T2 DE 60027510T2
Authority
DE
Germany
Prior art keywords
semiconductor substrate
workpiece
cleaning
polishing
cleaning machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60027510T
Other languages
German (de)
English (en)
Other versions
DE60027510D1 (de
Inventor
Syozo Yokohama-shi Oguri
Masafumi Fujisawa-shi Inoue
c/o Ebara Corporation Saburo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60027510D1 publication Critical patent/DE60027510D1/de
Application granted granted Critical
Publication of DE60027510T2 publication Critical patent/DE60027510T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60027510T 1999-07-26 2000-07-26 Halbleiterscheibe Poliervorrichtung Expired - Fee Related DE60027510T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21119899 1999-07-26
JP21119899A JP2001038614A (ja) 1999-07-26 1999-07-26 研磨装置

Publications (2)

Publication Number Publication Date
DE60027510D1 DE60027510D1 (de) 2006-06-01
DE60027510T2 true DE60027510T2 (de) 2007-06-06

Family

ID=16602004

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027510T Expired - Fee Related DE60027510T2 (de) 1999-07-26 2000-07-26 Halbleiterscheibe Poliervorrichtung

Country Status (4)

Country Link
US (1) US6409576B1 (enExample)
EP (1) EP1072359B1 (enExample)
JP (1) JP2001038614A (enExample)
DE (1) DE60027510T2 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020023715A1 (en) * 2000-05-26 2002-02-28 Norio Kimura Substrate polishing apparatus and substrate polishing mehod
DE10053410C1 (de) * 2000-10-27 2002-04-04 Haertl Erwin Schleifanlage und Verfahren zum differenzierten Schleifen einer mit einem leitfähigem Material beschichteten Platte für Leiterplatinen
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
JP2002251079A (ja) * 2001-02-26 2002-09-06 Canon Inc 画像形成装置及び回転体速度検出装置
US7204743B2 (en) * 2001-02-27 2007-04-17 Novellus Systems, Inc. Integrated circuit interconnect fabrication systems
TWI222154B (en) * 2001-02-27 2004-10-11 Asm Nutool Inc Integrated system for processing semiconductor wafers
US20040259348A1 (en) * 2001-02-27 2004-12-23 Basol Bulent M. Method of reducing post-CMP defectivity
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
KR100734669B1 (ko) * 2003-08-08 2007-07-02 동부일렉트로닉스 주식회사 반도체 소자의 제조 방법 및 그 장치
US7030603B2 (en) * 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
WO2006035624A1 (en) * 2004-09-28 2006-04-06 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
JP5093651B2 (ja) * 2007-06-12 2012-12-12 株式会社ニコン 作業情報管理システム
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
CN102485424B (zh) * 2010-12-03 2015-01-21 中芯国际集成电路制造(北京)有限公司 抛光装置及其异常处理方法
JP6265702B2 (ja) * 2012-12-06 2018-01-24 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP6007889B2 (ja) * 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法
JP6423600B2 (ja) 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
JP6560572B2 (ja) * 2015-09-14 2019-08-14 株式会社荏原製作所 反転機および基板研磨装置
JP6792512B2 (ja) * 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
CN110459497B (zh) * 2018-05-08 2022-04-22 北京北方华创微电子装备有限公司 晶圆预定位方法
CN118119480A (zh) * 2021-06-15 2024-05-31 崇硕科技公司 用于化学机械平坦化cmp工艺的原位监控的方法和装置
JP2025522007A (ja) * 2022-07-14 2025-07-10 アプライド マテリアルズ インコーポレイテッド フェースアップ研磨における厚さのモニタリング

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit

Also Published As

Publication number Publication date
EP1072359B1 (en) 2006-04-26
EP1072359A3 (en) 2003-11-12
JP2001038614A (ja) 2001-02-13
US6409576B1 (en) 2002-06-25
DE60027510D1 (de) 2006-06-01
EP1072359A2 (en) 2001-01-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee