DE3915039C2 - - Google Patents

Info

Publication number
DE3915039C2
DE3915039C2 DE3915039A DE3915039A DE3915039C2 DE 3915039 C2 DE3915039 C2 DE 3915039C2 DE 3915039 A DE3915039 A DE 3915039A DE 3915039 A DE3915039 A DE 3915039A DE 3915039 C2 DE3915039 C2 DE 3915039C2
Authority
DE
Germany
Prior art keywords
workpiece
manipulator according
lifting table
shaft
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3915039A
Other languages
German (de)
English (en)
Other versions
DE3915039A1 (de
Inventor
Rudolf Fontnas Ch Wagner
Hans Dr. Bad Ragaz Ch Hirscher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE3943478A priority Critical patent/DE3943478C2/de
Application filed by Balzers AG filed Critical Balzers AG
Priority to DE3915039A priority patent/DE3915039A1/de
Priority to DE3943482A priority patent/DE3943482C2/de
Priority to AT90106915T priority patent/ATE85589T1/de
Priority to DE9090106915T priority patent/DE59000868D1/de
Priority to EP90106915A priority patent/EP0396923B1/de
Priority to ES199090106915T priority patent/ES2038012T3/es
Priority to KR1019900006219A priority patent/KR900017725A/ko
Priority to DE9090108364T priority patent/DE59000869D1/de
Priority to ES199090108364T priority patent/ES2038016T3/es
Priority to AT90108364T priority patent/ATE85658T1/de
Priority to EP90108364A priority patent/EP0397029B1/de
Priority to KR1019900006358A priority patent/KR0132665B1/ko
Priority to EP90908310A priority patent/EP0423327B1/en
Priority to US07/520,030 priority patent/US5033538A/en
Priority to AT90908310T priority patent/ATE103645T1/de
Priority to JP2507759A priority patent/JP2935474B2/ja
Priority to US07/613,667 priority patent/US5177878A/en
Priority to ES90908310T priority patent/ES2054357T3/es
Priority to PCT/NL1990/000063 priority patent/WO1990013687A2/en
Priority to DE69007733T priority patent/DE69007733T2/de
Priority to KR1019910700013A priority patent/KR0166973B1/ko
Priority to DD90340443A priority patent/DD298435A5/de
Priority to DD90340445A priority patent/DD298450A5/de
Priority to US07/519,845 priority patent/US5051054A/en
Priority to JP2115925A priority patent/JPH02308547A/ja
Priority to JP2117006A priority patent/JP2918986B2/ja
Publication of DE3915039A1 publication Critical patent/DE3915039A1/de
Priority to US07/694,680 priority patent/US5180000A/en
Application granted granted Critical
Publication of DE3915039C2 publication Critical patent/DE3915039C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463—Cooling of the substrate
    • C23C16/466—Cooling of the substrate using thermal contact gas
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/12—Substrate holders or susceptors
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Forging (AREA)
  • Furnace Details (AREA)
  • Tunnel Furnaces (AREA)
DE3915039A 1989-05-08 1989-05-08 Hubtisch Granted DE3915039A1 (de)

Priority Applications (28)

Application Number Priority Date Filing Date Title
DE3915039A DE3915039A1 (de) 1989-05-08 1989-05-08 Hubtisch
DE3943482A DE3943482C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumprozeßkammer
DE3943478A DE3943478C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage
DE9090106915T DE59000868D1 (de) 1989-05-08 1990-04-11 Hubtisch und transportverfahren.
AT90106915T ATE85589T1 (de) 1989-05-08 1990-04-11 Hubtisch und transportverfahren.
EP90106915A EP0396923B1 (de) 1989-05-08 1990-04-11 Hubtisch und Transportverfahren
ES199090106915T ES2038012T3 (es) 1989-05-08 1990-04-11 Mesa elevadora y procedimiento de transporte.
KR1019900006219A KR900017725A (ko) 1989-05-08 1990-05-01 리프팅 테이블 및 운반방법
DE9090108364T DE59000869D1 (de) 1989-05-08 1990-05-03 Werkstuecktraeger fuer ein scheibenfoermiges werkstueck sowie vakuumprozesskammer.
ES199090108364T ES2038016T3 (es) 1989-05-08 1990-05-03 Soporte para una pieza en forma de disco asi como camara de proceso en vacio.
AT90108364T ATE85658T1 (de) 1989-05-08 1990-05-03 Werkstuecktraeger fuer ein scheibenfoermiges werkstueck sowie vakuumprozesskammer.
EP90108364A EP0397029B1 (de) 1989-05-08 1990-05-03 Werkstückträger für ein scheibenförmiges Werkstück sowie Vakuumprozesskammer
KR1019900006358A KR0132665B1 (ko) 1989-05-08 1990-05-04 공작물용 캐리어 및 진공처리실
DD90340443A DD298435A5 (de) 1989-05-08 1990-05-07 Werkstuecktraeger fuer ein scheibenfoermiges werkstueck
EP90908310A EP0423327B1 (en) 1989-05-08 1990-05-07 Apparatus and method for treating flat substrates under reduced pressure
JP2507759A JP2935474B2 (ja) 1989-05-08 1990-05-07 平坦な基板を処理する装置及び方法
US07/613,667 US5177878A (en) 1989-05-08 1990-05-07 Apparatus and method for treating flat substrate under reduced pressure in the manufacture of electronic devices
ES90908310T ES2054357T3 (es) 1989-05-08 1990-05-07 Aparato y metodo para tratar substratos planos bajo una presion reducida.
PCT/NL1990/000063 WO1990013687A2 (en) 1989-05-08 1990-05-07 Apparatus and method for treating flat substrates under reduced pressure
DE69007733T DE69007733T2 (de) 1989-05-08 1990-05-07 Vorrichtung und verfahren zur behandlung eines flachen, scheibenförmigen substrates unter niedrigem druck.
KR1019910700013A KR0166973B1 (ko) 1989-05-08 1990-05-07 반도체 웨이퍼 처리장치 및 방법
US07/520,030 US5033538A (en) 1989-05-08 1990-05-07 Workpiece carrier for a disk-shaped workpiece as well as a vacuum process space
DD90340445A DD298450A5 (de) 1989-05-08 1990-05-07 Hubtisch und transportverfahren
US07/519,845 US5051054A (en) 1989-05-08 1990-05-07 Elevating table and transporting method
JP2115925A JPH02308547A (ja) 1989-05-08 1990-05-07 昇降盤と運搬方法
AT90908310T ATE103645T1 (de) 1989-05-08 1990-05-07 Vorrichtung und verfahren zur behandlung eines flachen, scheibenfoermigen substrates unter niedrigem druck.
JP2117006A JP2918986B2 (ja) 1989-05-08 1990-05-08 円板状工作物のための工作物支持盤および真空処理チャンバー
US07/694,680 US5180000A (en) 1989-05-08 1991-05-02 Workpiece carrier with suction slot for a disk-shaped workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3915039A DE3915039A1 (de) 1989-05-08 1989-05-08 Hubtisch

Publications (2)

Publication Number Publication Date
DE3915039A1 DE3915039A1 (de) 1990-11-15
DE3915039C2 true DE3915039C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-09

Family

ID=6380264

Family Applications (5)

Application Number Title Priority Date Filing Date
DE3943478A Expired - Fee Related DE3943478C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage
DE3915039A Granted DE3915039A1 (de) 1989-05-08 1989-05-08 Hubtisch
DE3943482A Expired - Fee Related DE3943482C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumprozeßkammer
DE9090106915T Expired - Fee Related DE59000868D1 (de) 1989-05-08 1990-04-11 Hubtisch und transportverfahren.
DE9090108364T Expired - Lifetime DE59000869D1 (de) 1989-05-08 1990-05-03 Werkstuecktraeger fuer ein scheibenfoermiges werkstueck sowie vakuumprozesskammer.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3943478A Expired - Fee Related DE3943478C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage

Family Applications After (3)

Application Number Title Priority Date Filing Date
DE3943482A Expired - Fee Related DE3943482C2 (de) 1989-05-08 1989-05-08 Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumprozeßkammer
DE9090106915T Expired - Fee Related DE59000868D1 (de) 1989-05-08 1990-04-11 Hubtisch und transportverfahren.
DE9090108364T Expired - Lifetime DE59000869D1 (de) 1989-05-08 1990-05-03 Werkstuecktraeger fuer ein scheibenfoermiges werkstueck sowie vakuumprozesskammer.

Country Status (8)

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EP0397029A2 (de) 1990-11-14
KR920701534A (ko) 1992-08-12
EP0397029B1 (de) 1993-02-10
JPH02308547A (ja) 1990-12-21
DE3943478C2 (de) 1995-11-16
ATE85589T1 (de) 1993-02-15
DE3943482A1 (de) 1990-11-15
KR0166973B1 (ko) 1999-01-15
EP0396923B1 (de) 1993-02-10
EP0397029A3 (en) 1990-12-12
KR900017725A (ko) 1990-12-19
EP0396923A1 (de) 1990-11-14
ES2038016T3 (es) 1993-07-01
US5051054A (en) 1991-09-24
JPH0349839A (ja) 1991-03-04
DE3943478A1 (de) 1990-11-15
DE59000869D1 (de) 1993-03-25
ATE85658T1 (de) 1993-02-15
DD298435A5 (de) 1992-02-20
DE3943482C2 (de) 1994-07-07
KR900017726A (ko) 1990-12-19
JP2918986B2 (ja) 1999-07-12
DD298450A5 (de) 1992-02-20
DE3915039A1 (de) 1990-11-15
ES2038012T3 (es) 1993-07-01
KR0132665B1 (ko) 1998-04-13
US5033538A (en) 1991-07-23
DE59000868D1 (de) 1993-03-25

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