DE60106577T8 - Abnehmbare Schirmvorrichtung für Plasmareaktoren - Google Patents

Abnehmbare Schirmvorrichtung für Plasmareaktoren Download PDF

Info

Publication number
DE60106577T8
DE60106577T8 DE60106577T DE60106577T DE60106577T8 DE 60106577 T8 DE60106577 T8 DE 60106577T8 DE 60106577 T DE60106577 T DE 60106577T DE 60106577 T DE60106577 T DE 60106577T DE 60106577 T8 DE60106577 T8 DE 60106577T8
Authority
DE
Germany
Prior art keywords
clamping means
substrate holder
shield arrangement
reactive ion
plasma reactors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60106577T
Other languages
English (en)
Other versions
DE60106577T2 (de
DE60106577D1 (de
Inventor
Patrick Garabedian
Philippe Pagnod-Rossiaux
Michel Puech
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SA filed Critical Alcatel SA
Application granted granted Critical
Publication of DE60106577D1 publication Critical patent/DE60106577D1/de
Publication of DE60106577T2 publication Critical patent/DE60106577T2/de
Publication of DE60106577T8 publication Critical patent/DE60106577T8/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Discharge Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Walking Sticks, Umbrellas, And Fans (AREA)
  • Treatment Of Fiber Materials (AREA)
DE60106577T 2001-05-31 2001-05-31 Abnehmbare Schirmvorrichtung für Plasmareaktoren Expired - Fee Related DE60106577T8 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01401416A EP1263025B1 (de) 2001-05-31 2001-05-31 Abnehmbare Schirmvorrichtung für Plasmareaktoren

Publications (3)

Publication Number Publication Date
DE60106577D1 DE60106577D1 (de) 2004-11-25
DE60106577T2 DE60106577T2 (de) 2006-02-09
DE60106577T8 true DE60106577T8 (de) 2006-04-27

Family

ID=8182753

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60106577T Expired - Fee Related DE60106577T8 (de) 2001-05-31 2001-05-31 Abnehmbare Schirmvorrichtung für Plasmareaktoren

Country Status (5)

Country Link
US (1) US20020179246A1 (de)
EP (1) EP1263025B1 (de)
JP (1) JP2003092288A (de)
AT (1) ATE280437T1 (de)
DE (1) DE60106577T8 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3992018B2 (ja) * 2003-07-23 2007-10-17 松下電器産業株式会社 プラズマ処理装置
FR2875054B1 (fr) 2004-09-08 2006-12-01 Cit Alcatel Support de substrats minces
US7439093B2 (en) * 2005-09-16 2008-10-21 Dalsa Semiconductor Inc. Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch
JP2007294812A (ja) * 2006-04-27 2007-11-08 Fujikura Ltd 冷却装置およびプラズマ処理装置
US8647438B2 (en) * 2007-04-27 2014-02-11 Applied Materials, Inc. Annular baffle
KR20100004857A (ko) * 2008-07-03 2010-01-13 주성엔지니어링(주) 건식 에칭 장치
KR101141577B1 (ko) * 2010-07-07 2012-06-08 (주)세미머티리얼즈 태양전지의 플라즈마 텍스처링 장치 및 방법
US9136794B2 (en) 2011-06-22 2015-09-15 Research Triangle Institute, International Bipolar microelectronic device
CN104878363B (zh) * 2014-02-28 2017-07-21 北京北方微电子基地设备工艺研究中心有限责任公司 机械卡盘及等离子体加工设备
JP2016051876A (ja) * 2014-09-02 2016-04-11 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
CN107305853A (zh) * 2016-04-18 2017-10-31 北京北方华创微电子装备有限公司 反应腔室
GR1009426B (el) 2016-04-27 2019-01-15 Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων "Δημοκριτος" Μεταβλητος κλωβος faraday σε αντιδραστηρα πλασματος για την βαση του υποστρωματος, τον δακτυλιο συγκρατησης, ή το ηλεκτροδιο ή συνδυασμο τους
US20220108908A1 (en) * 2020-10-06 2022-04-07 Applied Materials, Inc. Shadow ring kit for plasma etch wafer singulation process
US20220178021A1 (en) * 2020-12-08 2022-06-09 Skytech Co., Ltd. Wafer fixing mechanism and wafer pre-cleaning machine using the wafer fixing mechanism

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512283A (en) * 1982-02-01 1985-04-23 Texas Instruments Incorporated Plasma reactor sidewall shield
US4632719A (en) * 1985-09-18 1986-12-30 Varian Associates, Inc. Semiconductor etching apparatus with magnetic array and vertical shield
US5484011A (en) * 1986-12-19 1996-01-16 Applied Materials, Inc. Method of heating and cooling a wafer during semiconductor processing
US5215619A (en) * 1986-12-19 1993-06-01 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
JPH029115A (ja) * 1988-06-28 1990-01-12 Mitsubishi Electric Corp 半導体製造装置
DE3943482C2 (de) * 1989-05-08 1994-07-07 Balzers Hochvakuum Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumprozeßkammer
US5292399A (en) * 1990-04-19 1994-03-08 Applied Materials, Inc. Plasma etching apparatus with conductive means for inhibiting arcing
US5304248A (en) * 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
KR960006956B1 (ko) * 1993-02-06 1996-05-25 현대전자산업주식회사 이시알(ecr) 장비
US5680013A (en) * 1994-03-15 1997-10-21 Applied Materials, Inc. Ceramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfaces
US6117349A (en) * 1998-08-28 2000-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Composite shadow ring equipped with a sacrificial inner ring
US6221221B1 (en) * 1998-11-16 2001-04-24 Applied Materials, Inc. Apparatus for providing RF return current path control in a semiconductor wafer processing system
US6123804A (en) * 1999-02-22 2000-09-26 Applied Materials, Inc. Sectional clamp ring
US6709547B1 (en) * 1999-06-30 2004-03-23 Lam Research Corporation Moveable barrier for multiple etch processes
US6176931B1 (en) * 1999-10-29 2001-01-23 International Business Machines Corporation Wafer clamp ring for use in an ionized physical vapor deposition apparatus

Also Published As

Publication number Publication date
EP1263025B1 (de) 2004-10-20
DE60106577T2 (de) 2006-02-09
US20020179246A1 (en) 2002-12-05
DE60106577D1 (de) 2004-11-25
ATE280437T1 (de) 2004-11-15
JP2003092288A (ja) 2003-03-28
EP1263025A1 (de) 2002-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ALCATEL LUCENT, PARIS, FR

8339 Ceased/non-payment of the annual fee