DE3789372T2 - Verfahren zur Herstellung eines Halbleiterbauelements. - Google Patents
Verfahren zur Herstellung eines Halbleiterbauelements.Info
- Publication number
- DE3789372T2 DE3789372T2 DE3789372T DE3789372T DE3789372T2 DE 3789372 T2 DE3789372 T2 DE 3789372T2 DE 3789372 T DE3789372 T DE 3789372T DE 3789372 T DE3789372 T DE 3789372T DE 3789372 T2 DE3789372 T2 DE 3789372T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08630814A GB2199694A (en) | 1986-12-23 | 1986-12-23 | A method of manufacturing a semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3789372D1 DE3789372D1 (de) | 1994-04-21 |
DE3789372T2 true DE3789372T2 (de) | 1994-09-29 |
Family
ID=10609539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3789372T Expired - Fee Related DE3789372T2 (de) | 1986-12-23 | 1987-12-17 | Verfahren zur Herstellung eines Halbleiterbauelements. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4904613A (de) |
JP (1) | JPH084093B2 (de) |
KR (1) | KR970003846B1 (de) |
DE (1) | DE3789372T2 (de) |
GB (1) | GB2199694A (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01270359A (ja) * | 1988-04-22 | 1989-10-27 | Nec Corp | 縦型電界効果トランジスタの製造方法 |
JP2751612B2 (ja) * | 1990-10-01 | 1998-05-18 | 株式会社デンソー | 縦型パワートランジスタ及びその製造方法 |
US5798550A (en) * | 1990-10-01 | 1998-08-25 | Nippondenso Co. Ltd. | Vertical type semiconductor device and gate structure |
US5256563A (en) * | 1992-04-16 | 1993-10-26 | Texas Instruments Incorporated | Doped well structure and method for semiconductor technologies |
GB9215653D0 (en) * | 1992-07-23 | 1992-09-09 | Philips Electronics Uk Ltd | A method of manufacturing a semiconductor device comprising an insulated gate field effect device |
US5414283A (en) * | 1993-11-19 | 1995-05-09 | Ois Optical Imaging Systems, Inc. | TFT with reduced parasitic capacitance |
US6724039B1 (en) * | 1998-08-31 | 2004-04-20 | Stmicroelectronics, Inc. | Semiconductor device having a Schottky diode |
US6621107B2 (en) | 2001-08-23 | 2003-09-16 | General Semiconductor, Inc. | Trench DMOS transistor with embedded trench schottky rectifier |
JP4793840B2 (ja) * | 2003-11-10 | 2011-10-12 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
US7881118B2 (en) * | 2007-05-25 | 2011-02-01 | Cypress Semiconductor Corporation | Sense transistor protection for memory programming |
US8269287B2 (en) * | 2007-05-25 | 2012-09-18 | Cypress Semiconductor Corporation | Floating gate memory device with increased coupling coefficient |
JP4956351B2 (ja) * | 2007-09-28 | 2012-06-20 | オンセミコンダクター・トレーディング・リミテッド | Dmosトランジスタの製造方法 |
DE102014005879B4 (de) * | 2014-04-16 | 2021-12-16 | Infineon Technologies Ag | Vertikale Halbleitervorrichtung |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1432309A (en) * | 1973-03-02 | 1976-04-14 | Signetics Corp | Semiconductor structures |
US3933541A (en) * | 1974-01-22 | 1976-01-20 | Mitsubishi Denki Kabushiki Kaisha | Process of producing semiconductor planar device |
US4038107B1 (en) * | 1975-12-03 | 1995-04-18 | Samsung Semiconductor Tele | Method for making transistor structures |
DE2723254A1 (de) * | 1976-07-02 | 1978-01-12 | Ibm | Halbleiterstruktur mit vom halbleitermaterial isolierten polysiliciumelektroden und verfahren zu ihrer herstellung |
DE2930780C2 (de) * | 1979-07-28 | 1982-05-27 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Verfahren zur Herstellung eines VMOS-Transistors |
GB2071413B (en) * | 1980-03-10 | 1983-12-21 | Trw Inc | Method of adhesion of passivation layer to gold metalization regions in a semiconductor device |
US4378627A (en) * | 1980-07-08 | 1983-04-05 | International Business Machines Corporation | Self-aligned metal process for field effect transistor integrated circuits using polycrystalline silicon gate electrodes |
DE3040775A1 (de) * | 1980-10-29 | 1982-05-13 | Siemens AG, 1000 Berlin und 8000 München | Mis-gesteuertes halbleiterbauelement |
JPS58171832A (ja) * | 1982-03-31 | 1983-10-08 | Toshiba Corp | 半導体装置の製造方法 |
AT380974B (de) * | 1982-04-06 | 1986-08-11 | Shell Austria | Verfahren zum gettern von halbleiterbauelementen |
JPS58175846A (ja) * | 1982-04-08 | 1983-10-15 | Toshiba Corp | 半導体装置の製造方法 |
US4503598A (en) * | 1982-05-20 | 1985-03-12 | Fairchild Camera & Instrument Corporation | Method of fabricating power MOSFET structure utilizing self-aligned diffusion and etching techniques |
US4470874A (en) * | 1983-12-15 | 1984-09-11 | International Business Machines Corporation | Planarization of multi-level interconnected metallization system |
US4587713A (en) * | 1984-02-22 | 1986-05-13 | Rca Corporation | Method for making vertical MOSFET with reduced bipolar effects |
JPS60182171A (ja) * | 1984-02-29 | 1985-09-17 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS61156882A (ja) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | 二重拡散形絶縁ゲ−ト電界効果トランジスタ及びその製造方法 |
US4716126A (en) * | 1986-06-05 | 1987-12-29 | Siliconix Incorporated | Fabrication of double diffused metal oxide semiconductor transistor |
-
1986
- 1986-12-23 GB GB08630814A patent/GB2199694A/en not_active Withdrawn
-
1987
- 1987-12-17 DE DE3789372T patent/DE3789372T2/de not_active Expired - Fee Related
- 1987-12-21 US US07/135,880 patent/US4904613A/en not_active Expired - Lifetime
- 1987-12-23 KR KR87014795A patent/KR970003846B1/ko not_active IP Right Cessation
- 1987-12-23 JP JP62326654A patent/JPH084093B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH084093B2 (ja) | 1996-01-17 |
KR970003846B1 (en) | 1997-03-22 |
GB8630814D0 (en) | 1987-02-04 |
KR880008459A (ko) | 1988-08-31 |
JPS63169068A (ja) | 1988-07-13 |
GB2199694A (en) | 1988-07-13 |
US4904613A (en) | 1990-02-27 |
DE3789372D1 (de) | 1994-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8339 | Ceased/non-payment of the annual fee |