DE69031153D1 - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
DE69031153D1
DE69031153D1 DE69031153T DE69031153T DE69031153D1 DE 69031153 D1 DE69031153 D1 DE 69031153D1 DE 69031153 T DE69031153 T DE 69031153T DE 69031153 T DE69031153 T DE 69031153T DE 69031153 D1 DE69031153 D1 DE 69031153D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69031153T
Other languages
English (en)
Other versions
DE69031153T2 (de
Inventor
Takashi Maruyama
Tatsuo Chijimatsu
Koichi Kobayashi
Keiko Yano
Hiroyuki Kanata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69031153D1 publication Critical patent/DE69031153D1/de
Application granted granted Critical
Publication of DE69031153T2 publication Critical patent/DE69031153T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
DE69031153T 1989-09-20 1990-08-31 Verfahren zur Herstellung einer Halbleitervorrichtung Expired - Fee Related DE69031153T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24404289 1989-09-20

Publications (2)

Publication Number Publication Date
DE69031153D1 true DE69031153D1 (de) 1997-09-04
DE69031153T2 DE69031153T2 (de) 1997-12-04

Family

ID=17112853

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69031153T Expired - Fee Related DE69031153T2 (de) 1989-09-20 1990-08-31 Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (4)

Country Link
EP (1) EP0419073B1 (de)
JP (1) JP2961838B2 (de)
KR (1) KR940006332B1 (de)
DE (1) DE69031153T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443942A (en) * 1990-11-28 1995-08-22 Canon Kabushiki Kaisha Process for removing resist
EP0698825A1 (de) * 1994-07-29 1996-02-28 AT&T Corp. Energieempfindlicher Resist und Verfahren zur Herstellung eines Geräts mit diesem Resist
JP5797532B2 (ja) * 2011-02-24 2015-10-21 東京エレクトロン株式会社 有機溶剤を含有する現像液を用いた現像処理方法及び現像処理装置
JP6049825B2 (ja) * 2011-02-24 2016-12-21 東京エレクトロン株式会社 有機溶剤を含有する現像液を用いた現像処理方法及び現像処理装置
JP6077311B2 (ja) * 2013-01-11 2017-02-08 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ ネガティブ現像処理方法およびネガティブ現像処理装置
JP2016225529A (ja) * 2015-06-02 2016-12-28 株式会社デンソー 半導体装置の製造方法
KR102391199B1 (ko) * 2020-06-09 2022-04-26 한남대학교 산학협력단 이중 차동기어

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961101A (en) * 1974-09-16 1976-06-01 Rca Corporation Process for improved development of electron-beam-sensitive resist films
JPS56148831A (en) * 1980-04-22 1981-11-18 Nec Corp Developing device for semiconductor wafer
JPS58214151A (ja) * 1982-06-07 1983-12-13 Hitachi Ltd 微細レジストパタ−ン形成の現像方法
JPS6461915A (en) * 1987-09-02 1989-03-08 Hitachi Ltd Formation of pattern

Also Published As

Publication number Publication date
EP0419073B1 (de) 1997-07-30
KR940006332B1 (ko) 1994-07-16
KR910006782A (ko) 1991-04-30
JPH03184050A (ja) 1991-08-12
EP0419073A3 (en) 1991-09-18
JP2961838B2 (ja) 1999-10-12
EP0419073A2 (de) 1991-03-27
DE69031153T2 (de) 1997-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee