JPS56148831A - Developing device for semiconductor wafer - Google Patents

Developing device for semiconductor wafer

Info

Publication number
JPS56148831A
JPS56148831A JP5309380A JP5309380A JPS56148831A JP S56148831 A JPS56148831 A JP S56148831A JP 5309380 A JP5309380 A JP 5309380A JP 5309380 A JP5309380 A JP 5309380A JP S56148831 A JPS56148831 A JP S56148831A
Authority
JP
Japan
Prior art keywords
treating
section
semiconductor wafer
liquid
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5309380A
Other languages
Japanese (ja)
Inventor
Minoru Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5309380A priority Critical patent/JPS56148831A/en
Publication of JPS56148831A publication Critical patent/JPS56148831A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Abstract

PURPOSE:To develop a superfine pattern in excellent reproducibility by mounting a plural stage of treating sections with the first means, which adsorb semiconductor wafers by vacuum and turn them, and the second means consisting of treating- liquid dropping means and treating-liquid injection means. CONSTITUTION:A spin chuck 6, which adsorbs a semiconductor wafer 5 by vacuum and turns it, and the second treating section consisting of the same constitution as the first treating section being composed of a treating-liquid injection nozzle 7 and a treating-liquid dropping nozzle 8 are installed through a transfer section 16, and the semiconductor wafer is successively treated using the first treating section as a developing section and the second treating section as a rinsing section. Thus, a superfine pattern can be obtained in excellent reproducibility because the wafer is coated with a new treating liquid at all times and uniformly developed stably.
JP5309380A 1980-04-22 1980-04-22 Developing device for semiconductor wafer Pending JPS56148831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5309380A JPS56148831A (en) 1980-04-22 1980-04-22 Developing device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5309380A JPS56148831A (en) 1980-04-22 1980-04-22 Developing device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS56148831A true JPS56148831A (en) 1981-11-18

Family

ID=12933160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5309380A Pending JPS56148831A (en) 1980-04-22 1980-04-22 Developing device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS56148831A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111318A (en) * 1981-12-25 1983-07-02 Hitachi Ltd Developing method
JPH0262549A (en) * 1988-08-29 1990-03-02 Tokyo Electron Ltd Spin developer
EP0419073A2 (en) * 1989-09-20 1991-03-27 Fujitsu Limited Process for production of a semiconductor device
JPH08138990A (en) * 1994-11-02 1996-05-31 Furontetsuku:Kk Method and apparatus for developing of resist
US5783367A (en) * 1989-09-20 1998-07-21 Fujitsu Limited Process for production of semiconductor device and resist developing apparatus used therein

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111318A (en) * 1981-12-25 1983-07-02 Hitachi Ltd Developing method
JPH0262549A (en) * 1988-08-29 1990-03-02 Tokyo Electron Ltd Spin developer
EP0419073A2 (en) * 1989-09-20 1991-03-27 Fujitsu Limited Process for production of a semiconductor device
US5783367A (en) * 1989-09-20 1998-07-21 Fujitsu Limited Process for production of semiconductor device and resist developing apparatus used therein
US6033134A (en) * 1989-09-20 2000-03-07 Fujitsu Limited Resist developing apparatus used in process for production of semiconductor device
JPH08138990A (en) * 1994-11-02 1996-05-31 Furontetsuku:Kk Method and apparatus for developing of resist

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