JPS53140698A - Method and device for wafer lapping - Google Patents

Method and device for wafer lapping

Info

Publication number
JPS53140698A
JPS53140698A JP5993478A JP5993478A JPS53140698A JP S53140698 A JPS53140698 A JP S53140698A JP 5993478 A JP5993478 A JP 5993478A JP 5993478 A JP5993478 A JP 5993478A JP S53140698 A JPS53140698 A JP S53140698A
Authority
JP
Japan
Prior art keywords
wafer lapping
lapping
wafer
enable
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5993478A
Other languages
Japanese (ja)
Inventor
Masaru Tsukahara
Kazuhiko Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5993478A priority Critical patent/JPS53140698A/en
Publication of JPS53140698A publication Critical patent/JPS53140698A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable an increased number of semiconductor wafers to be lapped uniformly at one time.
JP5993478A 1978-05-22 1978-05-22 Method and device for wafer lapping Pending JPS53140698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5993478A JPS53140698A (en) 1978-05-22 1978-05-22 Method and device for wafer lapping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5993478A JPS53140698A (en) 1978-05-22 1978-05-22 Method and device for wafer lapping

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4224974A Division JPS545870B2 (en) 1974-04-17 1974-04-17

Publications (1)

Publication Number Publication Date
JPS53140698A true JPS53140698A (en) 1978-12-07

Family

ID=13127449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5993478A Pending JPS53140698A (en) 1978-05-22 1978-05-22 Method and device for wafer lapping

Country Status (1)

Country Link
JP (1) JPS53140698A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383910A1 (en) * 1988-02-17 1990-08-29 Gruzinsky Politekhnichesky Institut Imeni V.I. Lenina Method and cassette for abrasive machining of the surface of parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0383910A1 (en) * 1988-02-17 1990-08-29 Gruzinsky Politekhnichesky Institut Imeni V.I. Lenina Method and cassette for abrasive machining of the surface of parts

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