JPS5494274A - Liquid terating device of semiconductor wafers - Google Patents

Liquid terating device of semiconductor wafers

Info

Publication number
JPS5494274A
JPS5494274A JP88978A JP88978A JPS5494274A JP S5494274 A JPS5494274 A JP S5494274A JP 88978 A JP88978 A JP 88978A JP 88978 A JP88978 A JP 88978A JP S5494274 A JPS5494274 A JP S5494274A
Authority
JP
Japan
Prior art keywords
substrates
vessel
liquid
terating
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP88978A
Other languages
Japanese (ja)
Inventor
Hitoshi Tateiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP88978A priority Critical patent/JPS5494274A/en
Publication of JPS5494274A publication Critical patent/JPS5494274A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To treat substrates by vertically moving a vessel which has resistance to treating liquid and permeates the liquid within a treating liquid vessel.
CONSTITUTION: Pure water is introduced through the pipe 1a on the bottom and is overflown in a vessel 1. A net 1b is provided near the bottom. A vessel 2 is constituted by a material of not eluting into water and contaminating substrates 3 and by a porous material or netting. The substrates 3 of such constitution are vertically moved by a driving device 4 via handle 2 and hook 4a. Cleaning the substrates in this way reduces the substrate treatment time and lets the substrates be evenly treated.
COPYRIGHT: (C)1979,JPO&Japio
JP88978A 1978-01-10 1978-01-10 Liquid terating device of semiconductor wafers Pending JPS5494274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP88978A JPS5494274A (en) 1978-01-10 1978-01-10 Liquid terating device of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP88978A JPS5494274A (en) 1978-01-10 1978-01-10 Liquid terating device of semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS5494274A true JPS5494274A (en) 1979-07-25

Family

ID=11486235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP88978A Pending JPS5494274A (en) 1978-01-10 1978-01-10 Liquid terating device of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5494274A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158440U (en) * 1982-04-16 1983-10-22 沖電気工業株式会社 Wafer cleaning equipment
JPS6043834A (en) * 1983-08-20 1985-03-08 Mitsubishi Electric Corp Washing device for semiconductor wafer
JPS61171244U (en) * 1985-04-12 1986-10-24

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158440U (en) * 1982-04-16 1983-10-22 沖電気工業株式会社 Wafer cleaning equipment
JPS6043834A (en) * 1983-08-20 1985-03-08 Mitsubishi Electric Corp Washing device for semiconductor wafer
JPS61171244U (en) * 1985-04-12 1986-10-24
JPH0234823Y2 (en) * 1985-04-12 1990-09-19

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