JPS57159027A - Wafer cleaning device - Google Patents

Wafer cleaning device

Info

Publication number
JPS57159027A
JPS57159027A JP4386581A JP4386581A JPS57159027A JP S57159027 A JPS57159027 A JP S57159027A JP 4386581 A JP4386581 A JP 4386581A JP 4386581 A JP4386581 A JP 4386581A JP S57159027 A JPS57159027 A JP S57159027A
Authority
JP
Japan
Prior art keywords
solution
tank
wafer
exit
prescribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4386581A
Other languages
Japanese (ja)
Inventor
Hiroshi Nakamura
Hiroto Nagatomo
Tetsuya Takagaki
Masakuni Akiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4386581A priority Critical patent/JPS57159027A/en
Publication of JPS57159027A publication Critical patent/JPS57159027A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To obtain high etching accuracy by placing a wafer in parallel with the flow of medicine solution, thereby treating it with the solution at the prescribed temperature and uniformalizing the etching velocity. CONSTITUTION:When etching medicine solution 14 is stored in an auxiliary tank 15 and a pump 16 is operated, the solution 14 is let from the tank 15 to a pump 16, and is forcibly fed to a supply port 12. The solution 14 supplied to a cleaning tank 11 is returned through an exit 13 to the tank 15, and is circulated. The solution 14 in the tank 11 is controlled by a valve 17 to set in the prescribed height from the bottom surface of the cleaning tank to direct the solution 14 of the prescribed velocity and flow rate to the exit 13, and the solution 14 reached to the exit 13 is all exhausted. A wafer 10 is dipped in this state in the solution 14 in parallel with the bottom surface of the cleaning tank at the surface of the wafer, is thus treated, and is then washed with water.
JP4386581A 1981-03-27 1981-03-27 Wafer cleaning device Pending JPS57159027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4386581A JPS57159027A (en) 1981-03-27 1981-03-27 Wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4386581A JPS57159027A (en) 1981-03-27 1981-03-27 Wafer cleaning device

Publications (1)

Publication Number Publication Date
JPS57159027A true JPS57159027A (en) 1982-10-01

Family

ID=12675584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4386581A Pending JPS57159027A (en) 1981-03-27 1981-03-27 Wafer cleaning device

Country Status (1)

Country Link
JP (1) JPS57159027A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04136869U (en) * 1991-06-13 1992-12-21 住友電装株式会社 IDC connector
DE102007058876A1 (en) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing
US9850946B2 (en) 2014-07-28 2017-12-26 Oiles Corporation Bearing bush for use in toggle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04136869U (en) * 1991-06-13 1992-12-21 住友電装株式会社 IDC connector
DE102007058876A1 (en) * 2007-12-06 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing
US9850946B2 (en) 2014-07-28 2017-12-26 Oiles Corporation Bearing bush for use in toggle

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