JPS57159027A - Wafer cleaning device - Google Patents
Wafer cleaning deviceInfo
- Publication number
- JPS57159027A JPS57159027A JP4386581A JP4386581A JPS57159027A JP S57159027 A JPS57159027 A JP S57159027A JP 4386581 A JP4386581 A JP 4386581A JP 4386581 A JP4386581 A JP 4386581A JP S57159027 A JPS57159027 A JP S57159027A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- tank
- wafer
- exit
- prescribed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To obtain high etching accuracy by placing a wafer in parallel with the flow of medicine solution, thereby treating it with the solution at the prescribed temperature and uniformalizing the etching velocity. CONSTITUTION:When etching medicine solution 14 is stored in an auxiliary tank 15 and a pump 16 is operated, the solution 14 is let from the tank 15 to a pump 16, and is forcibly fed to a supply port 12. The solution 14 supplied to a cleaning tank 11 is returned through an exit 13 to the tank 15, and is circulated. The solution 14 in the tank 11 is controlled by a valve 17 to set in the prescribed height from the bottom surface of the cleaning tank to direct the solution 14 of the prescribed velocity and flow rate to the exit 13, and the solution 14 reached to the exit 13 is all exhausted. A wafer 10 is dipped in this state in the solution 14 in parallel with the bottom surface of the cleaning tank at the surface of the wafer, is thus treated, and is then washed with water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4386581A JPS57159027A (en) | 1981-03-27 | 1981-03-27 | Wafer cleaning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4386581A JPS57159027A (en) | 1981-03-27 | 1981-03-27 | Wafer cleaning device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57159027A true JPS57159027A (en) | 1982-10-01 |
Family
ID=12675584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4386581A Pending JPS57159027A (en) | 1981-03-27 | 1981-03-27 | Wafer cleaning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57159027A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04136869U (en) * | 1991-06-13 | 1992-12-21 | 住友電装株式会社 | IDC connector |
DE102007058876A1 (en) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing |
US9850946B2 (en) | 2014-07-28 | 2017-12-26 | Oiles Corporation | Bearing bush for use in toggle |
-
1981
- 1981-03-27 JP JP4386581A patent/JPS57159027A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04136869U (en) * | 1991-06-13 | 1992-12-21 | 住友電装株式会社 | IDC connector |
DE102007058876A1 (en) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing |
US9850946B2 (en) | 2014-07-28 | 2017-12-26 | Oiles Corporation | Bearing bush for use in toggle |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK150725C (en) | DISHWASHER | |
JPS5696065A (en) | Electroless plating controlling method | |
JPS57159027A (en) | Wafer cleaning device | |
JPH0231785Y2 (en) | ||
GB1508469A (en) | Liquid dispenser | |
JPS5510072A (en) | Metered liquid feeding apparatus | |
JPS6481230A (en) | Treatment device | |
JPS6467227A (en) | Waste gas treating apparatus | |
JPS55152135A (en) | Recovering method and apparatus for silver from photographic treating procedure | |
JPS57204132A (en) | Washing method for silicon wafer | |
JPS647622A (en) | Device for treatment of semiconductor substrate | |
JPS5623371A (en) | Soldering device | |
JPS5494274A (en) | Liquid terating device of semiconductor wafers | |
JPS5444472A (en) | Cleaning unit of semiconductor substrate | |
JPS57209662A (en) | Method and apparatus for supplying tank for replenishing conductive liquid paint and multi-color replacing type electrostatic painting apparatus | |
JPS55119199A (en) | Surface treatment apparatus for metal, etc. | |
US3058478A (en) | Fluid treatment apparatus | |
FR2453404A1 (en) | Washing unit for metal parts with pumped recirculation - has device continuously monitoring specific weight of washing fluid which is converted into voltage coupled across display indicator | |
JPS54103266A (en) | Ultrasonic cleaner | |
JPS55124232A (en) | Application method of substrate treatment solution and the device therefor | |
JPS5622112A (en) | Control device for water level of distributing reservoir | |
JPS5579953A (en) | Heater | |
JPS57207180A (en) | Device and method for continuous chemical conversion treatment of strip surface | |
JPS55151337A (en) | Chemically polishing apparatus for semiconductor wafer | |
JPS5332973A (en) | Water supplying device for washer |