JPS57110674A - Surface treating device - Google Patents

Surface treating device

Info

Publication number
JPS57110674A
JPS57110674A JP18783680A JP18783680A JPS57110674A JP S57110674 A JPS57110674 A JP S57110674A JP 18783680 A JP18783680 A JP 18783680A JP 18783680 A JP18783680 A JP 18783680A JP S57110674 A JPS57110674 A JP S57110674A
Authority
JP
Japan
Prior art keywords
laminar flow
developing
developing soln
chuck
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18783680A
Other languages
Japanese (ja)
Other versions
JPS6253591B2 (en
Inventor
Masafumi Suzuki
Masayasu Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18783680A priority Critical patent/JPS57110674A/en
Publication of JPS57110674A publication Critical patent/JPS57110674A/en
Publication of JPS6253591B2 publication Critical patent/JPS6253591B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To perform treatment uniformly over the entire surface without any irregularity by facing the surface to be treated downward, and acting the same to the laminar flow part of treating liquid.
CONSTITUTION: A semiconductor wafer 15 with its surface 15a to be coated faced downward is attracted to a chuck 13. On the other hand, a developing soln. is supplied through a supply pipe 7 into a vessel 2, ejects through a hole 6 in a way as to gush out, flows like laminar flow in the outside circumferential direction as shown by arrows on a table surface 5 and is discharged through a drain 10 past the grooves 9 in the circumference. Here, the turning arm 12 of the chuck 13 is turned to horizontal to bring the surface 15a to be coated into contact with the laminar flow of the developing soln., thereby developing the same uniformly over the entire surface. Upon completion of the development, the developing soln. is withdrawn through the drain 10, and this time, stopping liquid is fed into the vessel 2 through a supply pipe 8, and is acted upon the surface 15a in the same manner as with the developing soln.
COPYRIGHT: (C)1982,JPO&Japio
JP18783680A 1980-12-29 1980-12-29 Surface treating device Granted JPS57110674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18783680A JPS57110674A (en) 1980-12-29 1980-12-29 Surface treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18783680A JPS57110674A (en) 1980-12-29 1980-12-29 Surface treating device

Publications (2)

Publication Number Publication Date
JPS57110674A true JPS57110674A (en) 1982-07-09
JPS6253591B2 JPS6253591B2 (en) 1987-11-11

Family

ID=16213077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18783680A Granted JPS57110674A (en) 1980-12-29 1980-12-29 Surface treating device

Country Status (1)

Country Link
JP (1) JPS57110674A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015637A (en) * 1983-07-07 1985-01-26 Fujitsu Ltd Resist film developing method
JPS6088944A (en) * 1983-10-21 1985-05-18 Fujitsu Ltd Resist film developing method
JPS6192053U (en) * 1984-11-21 1986-06-14
US5778913A (en) * 1997-02-20 1998-07-14 Lucent Technologies Inc. Cleaning solder-bonded flip-chip assemblies
DE19505981C2 (en) * 1995-02-21 1998-11-05 Siemens Ag Method and arrangement for one-sided, wet chemical etching of a substrate wafer
DE10313127B4 (en) * 2003-03-24 2006-10-12 Rena Sondermaschinen Gmbh Process for the treatment of substrate surfaces
FR2971065A1 (en) * 2011-01-28 2012-08-03 Commissariat Energie Atomique Device for developing patterns in thin layer of substrate for producing microstructure utilized in e.g. microfluid system, has circulating pump to create circulation movement to move front face of thin layer parallel to plane of face
US9318358B2 (en) 2011-04-28 2016-04-19 Infineon Technologies Ag Etching device and a method for etching a material of a workpiece

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03165486A (en) * 1989-11-24 1991-07-17 Tokyo Erekutoron Kyushu Kk Temperature regulating device for treatment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509891U (en) * 1973-05-24 1975-01-31
JPS5417572A (en) * 1977-07-11 1979-02-08 Fuji Fuirutaa Kougiyou Kk Filter for melted fluid

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509891U (en) * 1973-05-24 1975-01-31
JPS5417572A (en) * 1977-07-11 1979-02-08 Fuji Fuirutaa Kougiyou Kk Filter for melted fluid

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015637A (en) * 1983-07-07 1985-01-26 Fujitsu Ltd Resist film developing method
JPS6088944A (en) * 1983-10-21 1985-05-18 Fujitsu Ltd Resist film developing method
JPH0428299B2 (en) * 1983-10-21 1992-05-14 Fujitsu Ltd
JPS6192053U (en) * 1984-11-21 1986-06-14
JPS645884Y2 (en) * 1984-11-21 1989-02-14
DE19505981C2 (en) * 1995-02-21 1998-11-05 Siemens Ag Method and arrangement for one-sided, wet chemical etching of a substrate wafer
US5778913A (en) * 1997-02-20 1998-07-14 Lucent Technologies Inc. Cleaning solder-bonded flip-chip assemblies
DE10313127B4 (en) * 2003-03-24 2006-10-12 Rena Sondermaschinen Gmbh Process for the treatment of substrate surfaces
FR2971065A1 (en) * 2011-01-28 2012-08-03 Commissariat Energie Atomique Device for developing patterns in thin layer of substrate for producing microstructure utilized in e.g. microfluid system, has circulating pump to create circulation movement to move front face of thin layer parallel to plane of face
US9318358B2 (en) 2011-04-28 2016-04-19 Infineon Technologies Ag Etching device and a method for etching a material of a workpiece

Also Published As

Publication number Publication date
JPS6253591B2 (en) 1987-11-11

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