DE3687389T2 - Hoch thermisch leitendes keramiksubstrat. - Google Patents

Hoch thermisch leitendes keramiksubstrat.

Info

Publication number
DE3687389T2
DE3687389T2 DE8686307092T DE3687389T DE3687389T2 DE 3687389 T2 DE3687389 T2 DE 3687389T2 DE 8686307092 T DE8686307092 T DE 8686307092T DE 3687389 T DE3687389 T DE 3687389T DE 3687389 T2 DE3687389 T2 DE 3687389T2
Authority
DE
Germany
Prior art keywords
ceramic substrate
electrically conductive
conductive coating
thermally conductive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686307092T
Other languages
German (de)
English (en)
Other versions
DE3687389D1 (de
Inventor
Hiroyuki Ishizuka
Akio Sayano
Yasuyuki Sugiura
Shunichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3687389D1 publication Critical patent/DE3687389D1/de
Publication of DE3687389T2 publication Critical patent/DE3687389T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5177—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal characterised by the non-metallic part of the metallising composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H10W40/259—
    • H10W70/05—
    • H10W70/692—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10W72/5524—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Thin Film Transistor (AREA)
DE8686307092T 1985-09-13 1986-09-15 Hoch thermisch leitendes keramiksubstrat. Expired - Lifetime DE3687389T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60203104A JPS6265991A (ja) 1985-09-13 1985-09-13 高熱伝導性セラミツクス基板

Publications (2)

Publication Number Publication Date
DE3687389D1 DE3687389D1 (de) 1993-02-11
DE3687389T2 true DE3687389T2 (de) 1993-05-19

Family

ID=16468454

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686307092T Expired - Lifetime DE3687389T2 (de) 1985-09-13 1986-09-15 Hoch thermisch leitendes keramiksubstrat.

Country Status (5)

Country Link
US (1) US5164246A (cg-RX-API-DMAC10.html)
EP (1) EP0217584B1 (cg-RX-API-DMAC10.html)
JP (1) JPS6265991A (cg-RX-API-DMAC10.html)
KR (1) KR900001838B1 (cg-RX-API-DMAC10.html)
DE (1) DE3687389T2 (cg-RX-API-DMAC10.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197374A (ja) * 1986-02-20 1987-09-01 株式会社東芝 導電性メタライズ層を有する窒化アルミニウム焼結体の製造方法
CA1333241C (en) * 1987-01-26 1994-11-29 Akira Sasame Aluminum nitride sintered body formed with metallized layer and method of manufacturing the same
US4965659A (en) * 1987-06-30 1990-10-23 Sumitomo Electric Industries, Ltd. Member for a semiconductor structure
JPH0676790B2 (ja) * 1987-07-30 1994-09-28 株式会社東芝 イグナイタ
DE69013310T2 (de) * 1989-12-22 1995-04-27 Westinghouse Electric Corp Gehäuse für Leistungshalbleiterbauelemente.
DE4017181C2 (de) * 1990-05-29 1998-08-27 Daimler Benz Aerospace Ag Elektrisches Bauelement
US6207288B1 (en) 1991-02-05 2001-03-27 Cts Corporation Copper ink for aluminum nitride
US5306389A (en) * 1991-09-04 1994-04-26 Osram Sylvania Inc. Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment
JPH06296084A (ja) * 1993-02-12 1994-10-21 Ngk Spark Plug Co Ltd 高熱伝導体及びこれを備えた配線基板とこれらの製造方法
US5485333A (en) * 1993-04-23 1996-01-16 Eastman Kodak Company Shorted DMR reproduce head
DE4320910C1 (de) * 1993-06-18 1994-09-08 Siemens Ag Verfahren zur Herstellung einer gasdichten Lötverbindung und Anwendung des Verfahrens bei der Herstellung von Bauelementen mit vakuumdichten Gehäuse
US5705261A (en) * 1993-10-28 1998-01-06 Saint-Gobain/Norton Industrial Ceramics Corporation Active metal metallization of mini-igniters by silk screening
JP3927250B2 (ja) * 1995-08-16 2007-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 窒化アルミニウム基板用厚膜導体ペースト組成物
US5783113A (en) * 1997-03-27 1998-07-21 International Business Machines Corporation Conductive paste for large greensheet screening including high thixotropic agent content
SE515856C2 (sv) 1999-05-19 2001-10-22 Ericsson Telefon Ab L M Bärare för elektronikkomponenter
JP3969987B2 (ja) * 2001-10-01 2007-09-05 Ｄｏｗａホールディングス株式会社 セラミックスと合金の接合体
KR100585909B1 (ko) * 2001-10-09 2006-06-07 이 아이 듀폰 디 네모아 앤드 캄파니 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물
DE10227658B4 (de) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat
US20040226696A1 (en) * 2003-02-28 2004-11-18 Hong Huang Surface mount resistors as heat transfer augmentation devices
JP5455468B2 (ja) * 2009-06-30 2014-03-26 矢崎総業株式会社 メタルコア基板用基材及び該メタルコア基板用基材を用いたメタルコア基板の製造方法
JP2013536316A (ja) * 2010-07-09 2013-09-19 クライマックス・エンジニアード・マテリアルズ・エルエルシー カリウム／モリブデン複合金属粉末、粉末ブレンド、その生成物、及び光電池セルを製造する方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB967452A (en) * 1960-07-20 1964-08-19 Plessey Co Ltd Improvements in or relating to the sealing of high-purity alumina to metal
US3197290A (en) * 1964-03-02 1965-07-27 Eitel Mccullough Inc Metalized ceramic structures
US3197790A (en) * 1964-05-06 1965-08-03 Cotton Producers Inst Of The N Process for imparting durable loft and warmth to cellulosic fabrics
AT350285B (de) * 1974-08-07 1979-05-25 Plansee Metallwerk Mit einem ueberzug versehene, metallische gebrauchsgegenstaende
JPS53116285A (en) * 1977-03-22 1978-10-11 Mitsubishi Metal Corp Coated super hard alloy product and its manufacture
US4153518A (en) * 1977-11-18 1979-05-08 Tektronix, Inc. Method of making a metalized substrate having a thin film barrier layer
JPS57160984A (en) * 1981-03-26 1982-10-04 Ngk Spark Plug Co Silicon nitride ceramic having metallized surface and manufacture
CA1217109A (en) * 1982-09-20 1987-01-27 Mary E. Turney Liquid skin cleanser composition
JPS59182283A (ja) * 1983-03-29 1984-10-17 株式会社東芝 導電性セラミツクス焼結体の製造方法
JPS59203784A (ja) * 1983-04-28 1984-11-17 株式会社東芝 非酸化物系セラミックス焼結体のモリブデンシリサイド被膜の形成方法
JPS6077185A (ja) * 1983-09-30 1985-05-01 株式会社東芝 セラミツクス焼結体およびその製造方法
JPH0810710B2 (ja) * 1984-02-24 1996-01-31 株式会社東芝 良熱伝導性基板の製造方法
US4659611A (en) * 1984-02-27 1987-04-21 Kabushiki Kaisha Toshiba Circuit substrate having high thermal conductivity
JPS60200871A (ja) * 1984-03-27 1985-10-11 住友金属工業株式会社 金属とセラミツクスの接合方法
JPS6140871A (ja) * 1984-07-25 1986-02-27 住友電気工業株式会社 鑞付け可能なＳｉ↓３Ｎ↓４系セラミツクス複合組成物及びその製造法
JPS6177681A (ja) * 1984-09-21 1986-04-21 住友電気工業株式会社 窒化物セラミツクスの接合方法
JPS61291480A (ja) * 1985-06-17 1986-12-22 日本特殊陶業株式会社 窒化アルミニウム製基材の表面処理組成物
US4695517A (en) * 1985-05-31 1987-09-22 Ngk Spark Plug Co., Ltd. Composite layer aluminum nitride base sintered body
KR890003856B1 (ko) * 1985-09-10 1989-10-05 가부시끼 가이샤 도시바 세라믹스 소결체용 금속화 조성물
US4770953A (en) * 1986-02-20 1988-09-13 Kabushiki Kaisha Toshiba Aluminum nitride sintered body having conductive metallized layer

Also Published As

Publication number Publication date
JPH0510310B2 (cg-RX-API-DMAC10.html) 1993-02-09
EP0217584B1 (en) 1992-12-30
KR900001838B1 (ko) 1990-03-24
EP0217584A2 (en) 1987-04-08
KR870003678A (ko) 1987-04-18
JPS6265991A (ja) 1987-03-25
EP0217584A3 (en) 1989-03-22
DE3687389D1 (de) 1993-02-11
US5164246A (en) 1992-11-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)