DE3675010D1 - Verfahren zur herstellung eines bipolartransistors. - Google Patents

Verfahren zur herstellung eines bipolartransistors.

Info

Publication number
DE3675010D1
DE3675010D1 DE8686200948T DE3675010T DE3675010D1 DE 3675010 D1 DE3675010 D1 DE 3675010D1 DE 8686200948 T DE8686200948 T DE 8686200948T DE 3675010 T DE3675010 T DE 3675010T DE 3675010 D1 DE3675010 D1 DE 3675010D1
Authority
DE
Germany
Prior art keywords
base
bipolar
implant
transistors
comprised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686200948T
Other languages
English (en)
Inventor
Peter Denis Scovell
Peter Fred Blomley
Roger Leslie Baker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Application granted granted Critical
Publication of DE3675010D1 publication Critical patent/DE3675010D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H01L21/8249—Bipolar and MOS technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/01—Bipolar transistors-ion implantation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Recrystallisation Techniques (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Noodles (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
DE8686200948T 1985-03-23 1986-02-17 Verfahren zur herstellung eines bipolartransistors. Expired - Fee Related DE3675010D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858507624A GB8507624D0 (en) 1985-03-23 1985-03-23 Semiconductor devices

Publications (1)

Publication Number Publication Date
DE3675010D1 true DE3675010D1 (de) 1990-11-22

Family

ID=10576545

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8686301052T Expired - Fee Related DE3671326D1 (de) 1985-03-23 1986-02-17 Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung.
DE8686200948T Expired - Fee Related DE3675010D1 (de) 1985-03-23 1986-02-17 Verfahren zur herstellung eines bipolartransistors.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE8686301052T Expired - Fee Related DE3671326D1 (de) 1985-03-23 1986-02-17 Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung.

Country Status (11)

Country Link
US (3) US4849364A (de)
EP (2) EP0196757B1 (de)
JP (2) JPH0799764B2 (de)
KR (2) KR920006752B1 (de)
CN (2) CN1004593B (de)
AT (2) ATE57586T1 (de)
DE (2) DE3671326D1 (de)
GB (3) GB8507624D0 (de)
NO (1) NO173478C (de)
PH (1) PH26112A (de)
SG (1) SG69890G (de)

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EP0316104A3 (de) * 1987-11-03 1991-01-30 Stc Plc Integrierte Schaltungen mit Widerständen und Bipolartransistoren
US5124817A (en) * 1988-01-19 1992-06-23 National Semiconductor Corporation Polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
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FR2626406B1 (fr) * 1988-01-22 1992-01-24 France Etat Transistor bipolaire compatible avec la technologie mos
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US5028973A (en) * 1989-06-19 1991-07-02 Harris Corporation Bipolar transistor with high efficient emitter
US5177582A (en) * 1989-09-22 1993-01-05 Siemens Aktiengesellschaft CMOS-compatible bipolar transistor with reduced collector/substrate capacitance and process for producing the same
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US4987089A (en) * 1990-07-23 1991-01-22 Micron Technology, Inc. BiCMOS process and process for forming bipolar transistors on wafers also containing FETs
JP2842682B2 (ja) * 1990-11-08 1999-01-06 シャープ株式会社 半導体装置の製造方法
US5158900A (en) * 1991-10-18 1992-10-27 Hewlett-Packard Company Method of separately fabricating a base/emitter structure of a BiCMOS device
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JPH08172100A (ja) * 1994-12-16 1996-07-02 Mitsubishi Electric Corp 半導体装置
US5830789A (en) * 1996-11-19 1998-11-03 Integrated Device Technology, Inc. CMOS process forming wells after gate formation
KR100235628B1 (ko) * 1997-06-25 1999-12-15 김영환 반도체 소자의 제조방법
KR20040008485A (ko) * 2002-07-18 2004-01-31 주식회사 하이닉스반도체 반도체소자의 테스트 패턴 형성방법
JP2004311684A (ja) * 2003-04-07 2004-11-04 Sanyo Electric Co Ltd 半導体装置
TW200524139A (en) * 2003-12-24 2005-07-16 Renesas Tech Corp Voltage generating circuit and semiconductor integrated circuit

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Also Published As

Publication number Publication date
KR920006752B1 (ko) 1992-08-17
SG69890G (en) 1990-11-23
JPS61220453A (ja) 1986-09-30
EP0234054B1 (de) 1990-10-17
NO860663L (no) 1986-09-24
ATE52877T1 (de) 1990-06-15
ATE57586T1 (de) 1990-11-15
US4849364A (en) 1989-07-18
EP0234054A1 (de) 1987-09-02
PH26112A (en) 1992-02-06
KR860007746A (ko) 1986-10-17
CN86101789A (zh) 1986-11-19
GB2174244B (en) 1989-07-05
NO173478C (no) 1993-12-15
EP0196757B1 (de) 1990-05-16
GB2174244A (en) 1986-10-29
CN86103793A (zh) 1987-04-08
NO173478B (no) 1993-09-06
KR920010192B1 (ko) 1992-11-19
GB8507624D0 (en) 1985-05-01
CN1007389B (zh) 1990-03-28
KR860007863A (ko) 1986-10-17
JPS6351673A (ja) 1988-03-04
EP0196757A3 (en) 1987-05-27
CN1004593B (zh) 1989-06-21
EP0196757A2 (de) 1986-10-08
GB2173638A (en) 1986-10-15
GB8603322D0 (en) 1986-03-19
GB2173638B (en) 1989-06-28
US4845532A (en) 1989-07-04
US4914048A (en) 1990-04-03
JPH0799764B2 (ja) 1995-10-25
JPH0783024B2 (ja) 1995-09-06
GB8612801D0 (en) 1986-07-02
DE3671326D1 (de) 1990-06-21

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NORTHERN TELECOM LTD., MONTREAL, QUEBEC, CA

8328 Change in the person/name/address of the agent

Free format text: KOCH, G., DIPL.-ING. HAIBACH, T., DIPL.-PHYS. DR.RER.NAT. FELDKAMP, R., DIPL.-ING., PAT.-ANWAELTE, 80339 MUENCHEN

8339 Ceased/non-payment of the annual fee