ATE57586T1 - Verfahren zur herstellung eines bipolartransistors. - Google Patents
Verfahren zur herstellung eines bipolartransistors.Info
- Publication number
- ATE57586T1 ATE57586T1 AT86200948T AT86200948T ATE57586T1 AT E57586 T1 ATE57586 T1 AT E57586T1 AT 86200948 T AT86200948 T AT 86200948T AT 86200948 T AT86200948 T AT 86200948T AT E57586 T1 ATE57586 T1 AT E57586T1
- Authority
- AT
- Austria
- Prior art keywords
- base
- bipolar
- implant
- transistors
- comprised
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
- H10D84/0109—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/01—Bipolar transistors-ion implantation
Landscapes
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Recrystallisation Techniques (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Noodles (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB858507624A GB8507624D0 (en) | 1985-03-23 | 1985-03-23 | Semiconductor devices |
| EP86200948A EP0234054B1 (de) | 1985-03-23 | 1986-02-17 | Verfahren zur Herstellung eines Bipolartransistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE57586T1 true ATE57586T1 (de) | 1990-11-15 |
Family
ID=10576545
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT86301052T ATE52877T1 (de) | 1985-03-23 | 1986-02-17 | Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung. |
| AT86200948T ATE57586T1 (de) | 1985-03-23 | 1986-02-17 | Verfahren zur herstellung eines bipolartransistors. |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT86301052T ATE52877T1 (de) | 1985-03-23 | 1986-02-17 | Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung. |
Country Status (11)
| Country | Link |
|---|---|
| US (3) | US4914048A (de) |
| EP (2) | EP0234054B1 (de) |
| JP (2) | JPH0799764B2 (de) |
| KR (2) | KR920006752B1 (de) |
| CN (2) | CN1004593B (de) |
| AT (2) | ATE52877T1 (de) |
| DE (2) | DE3671326D1 (de) |
| GB (3) | GB8507624D0 (de) |
| NO (1) | NO173478C (de) |
| PH (1) | PH26112A (de) |
| SG (1) | SG69890G (de) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2188479B (en) * | 1986-03-26 | 1990-05-23 | Stc Plc | Semiconductor devices |
| JPS63239856A (ja) * | 1987-03-27 | 1988-10-05 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
| KR900001062B1 (ko) * | 1987-09-15 | 1990-02-26 | 강진구 | 반도체 바이 씨 모오스 장치의 제조방법 |
| EP0316104A3 (de) * | 1987-11-03 | 1991-01-30 | Stc Plc | Integrierte Schaltungen mit Widerständen und Bipolartransistoren |
| US5124817A (en) * | 1988-01-19 | 1992-06-23 | National Semiconductor Corporation | Polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide |
| EP0325181B1 (de) * | 1988-01-19 | 1995-04-05 | National Semiconductor Corporation | Verfahren zum Herstellen eines Polysiliciumemitters und eines Polysiliciumgates durch gleichzeitiges Ätzen von Polysilicium auf einem dünnen Gateoxid |
| FR2626406B1 (fr) * | 1988-01-22 | 1992-01-24 | France Etat | Transistor bipolaire compatible avec la technologie mos |
| GB2214870B (en) * | 1988-02-20 | 1991-09-11 | Stc Plc | Plasma etching process |
| DE3914910C2 (de) * | 1988-05-10 | 1999-11-25 | Northern Telecom Ltd | Verfahren zur Herstellung einer integrierten Schaltung |
| GB8810973D0 (en) * | 1988-05-10 | 1988-06-15 | Stc Plc | Improvements in integrated circuits |
| US5091760A (en) * | 1989-04-14 | 1992-02-25 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JPH0348457A (ja) * | 1989-04-14 | 1991-03-01 | Toshiba Corp | 半導体装置およびその製造方法 |
| US5028973A (en) * | 1989-06-19 | 1991-07-02 | Harris Corporation | Bipolar transistor with high efficient emitter |
| US5177582A (en) * | 1989-09-22 | 1993-01-05 | Siemens Aktiengesellschaft | CMOS-compatible bipolar transistor with reduced collector/substrate capacitance and process for producing the same |
| US4983531A (en) * | 1990-02-12 | 1991-01-08 | Motorola, Inc. | Method of fabricating a single polysilicon bipolar transistor which is compatible with a method of fabricating CMOS transistors |
| US4987089A (en) * | 1990-07-23 | 1991-01-22 | Micron Technology, Inc. | BiCMOS process and process for forming bipolar transistors on wafers also containing FETs |
| JP2842682B2 (ja) * | 1990-11-08 | 1999-01-06 | シャープ株式会社 | 半導体装置の製造方法 |
| US5158900A (en) * | 1991-10-18 | 1992-10-27 | Hewlett-Packard Company | Method of separately fabricating a base/emitter structure of a BiCMOS device |
| WO1993016494A1 (en) * | 1992-01-31 | 1993-08-19 | Analog Devices, Inc. | Complementary bipolar polysilicon emitter devices |
| JPH08172100A (ja) * | 1994-12-16 | 1996-07-02 | Mitsubishi Electric Corp | 半導体装置 |
| US5830789A (en) * | 1996-11-19 | 1998-11-03 | Integrated Device Technology, Inc. | CMOS process forming wells after gate formation |
| KR100235628B1 (ko) * | 1997-06-25 | 1999-12-15 | 김영환 | 반도체 소자의 제조방법 |
| KR20040008485A (ko) * | 2002-07-18 | 2004-01-31 | 주식회사 하이닉스반도체 | 반도체소자의 테스트 패턴 형성방법 |
| JP2004311684A (ja) * | 2003-04-07 | 2004-11-04 | Sanyo Electric Co Ltd | 半導体装置 |
| TW200524139A (en) * | 2003-12-24 | 2005-07-16 | Renesas Tech Corp | Voltage generating circuit and semiconductor integrated circuit |
| WO2006117712A1 (en) * | 2005-04-29 | 2006-11-09 | Nxp B.V. | Method of fabricating a bipolar transistor |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA969290A (en) * | 1971-10-20 | 1975-06-10 | Alfred C. Ipri | Fabrication of semiconductor devices incorporating polycrystalline silicon |
| US3753807A (en) * | 1972-02-24 | 1973-08-21 | Bell Canada Northern Electric | Manufacture of bipolar semiconductor devices |
| US4041518A (en) * | 1973-02-24 | 1977-08-09 | Hitachi, Ltd. | MIS semiconductor device and method of manufacturing the same |
| US3940288A (en) * | 1973-05-16 | 1976-02-24 | Fujitsu Limited | Method of making a semiconductor device |
| JPS539469A (en) * | 1976-07-15 | 1978-01-27 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device having electrode of stepped structure and its production |
| US4120707A (en) * | 1977-03-30 | 1978-10-17 | Harris Corporation | Process of fabricating junction isolated IGFET and bipolar transistor integrated circuit by diffusion |
| US4099987A (en) * | 1977-07-25 | 1978-07-11 | International Business Machines Corporation | Fabricating integrated circuits incorporating high-performance bipolar transistors |
| JPS5846863B2 (ja) * | 1977-08-25 | 1983-10-19 | 松下電器産業株式会社 | 半導体集積回路装置 |
| JPS54101290A (en) * | 1978-01-27 | 1979-08-09 | Hitachi Ltd | Semiconductor integtated circuit unit and its manufacture |
| GB2023340B (en) * | 1978-06-01 | 1982-09-02 | Mitsubishi Electric Corp | Integrated circuits |
| US4289550A (en) * | 1979-05-25 | 1981-09-15 | Raytheon Company | Method of forming closely spaced device regions utilizing selective etching and diffusion |
| US4452645A (en) * | 1979-11-13 | 1984-06-05 | International Business Machines Corporation | Method of making emitter regions by implantation through a non-monocrystalline layer |
| DE2946963A1 (de) * | 1979-11-21 | 1981-06-04 | Siemens AG, 1000 Berlin und 8000 München | Schnelle bipolare transistoren |
| US4534806A (en) * | 1979-12-03 | 1985-08-13 | International Business Machines Corporation | Method for manufacturing vertical PNP transistor with shallow emitter |
| JPS5696860A (en) * | 1979-12-29 | 1981-08-05 | Sony Corp | Semiconductor device |
| US4301588A (en) * | 1980-02-01 | 1981-11-24 | International Business Machines Corporation | Consumable amorphous or polysilicon emitter process |
| JPS5710969A (en) * | 1980-06-25 | 1982-01-20 | Nec Corp | Semiconductor device and manufacture thereof |
| US4391650A (en) * | 1980-12-22 | 1983-07-05 | Ncr Corporation | Method for fabricating improved complementary metal oxide semiconductor devices |
| JPS57206063A (en) * | 1981-06-15 | 1982-12-17 | Toshiba Corp | Semiconductor substrate and manufacture therefor |
| US4483726A (en) * | 1981-06-30 | 1984-11-20 | International Business Machines Corporation | Double self-aligned fabrication process for making a bipolar transistor structure having a small polysilicon-to-extrinsic base contact area |
| US4498223A (en) * | 1982-04-23 | 1985-02-12 | Gte Laboratories Incorporated | Method of fabrication of monolithic integrated circuit structure |
| EP0093786B1 (de) * | 1982-05-06 | 1986-08-06 | Deutsche ITT Industries GmbH | Verfahren zum Herstellen einer planaren monolithisch integrierten Festkörperschaltung mit mindestens einem Isolierschicht-Feldeffekttransistor und mit mindestens einem Bipolartransistor |
| US4437897A (en) * | 1982-05-18 | 1984-03-20 | International Business Machines Corporation | Fabrication process for a shallow emitter/base transistor using same polycrystalline layer |
| US4507847A (en) * | 1982-06-22 | 1985-04-02 | Ncr Corporation | Method of making CMOS by twin-tub process integrated with a vertical bipolar transistor |
| JPS58225663A (ja) * | 1982-06-23 | 1983-12-27 | Toshiba Corp | 半導体装置の製造方法 |
| JPS5931052A (ja) * | 1982-08-13 | 1984-02-18 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| JPS59117150A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | 半導体集積回路装置とその製造法 |
| JPS59138363A (ja) * | 1983-01-28 | 1984-08-08 | Hitachi Ltd | 半導体装置及びその製造方法 |
| US4673965A (en) * | 1983-02-22 | 1987-06-16 | General Motors Corporation | Uses for buried contacts in integrated circuits |
| IT1162836B (it) * | 1983-03-04 | 1987-04-01 | Cselt Centro Studi Lab Telecom | Ricestrasmettitore numerico per trasmissione bidirezionale simultanea di segnali logici su una linea unica |
| US4631568A (en) * | 1983-03-08 | 1986-12-23 | Trw Inc. | Bipolar transistor construction |
| EP0122004A3 (de) * | 1983-03-08 | 1986-12-17 | Trw Inc. | Aufbau eines Bipolartransistors |
| JPS59186367A (ja) * | 1983-04-06 | 1984-10-23 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPS6010776A (ja) * | 1983-06-30 | 1985-01-19 | Fujitsu Ltd | バイポーラトランジスタの製造方法 |
| GB2143083B (en) * | 1983-07-06 | 1987-11-25 | Standard Telephones Cables Ltd | Semiconductor structures |
| US4574467A (en) * | 1983-08-31 | 1986-03-11 | Solid State Scientific, Inc. | N- well CMOS process on a P substrate with double field guard rings and a PMOS buried channel |
| US4637125A (en) * | 1983-09-22 | 1987-01-20 | Kabushiki Kaisha Toshiba | Method for making a semiconductor integrated device including bipolar transistor and CMOS transistor |
| US4523370A (en) * | 1983-12-05 | 1985-06-18 | Ncr Corporation | Process for fabricating a bipolar transistor with a thin base and an abrupt base-collector junction |
| US4647958A (en) * | 1984-04-16 | 1987-03-03 | Trw Inc. | Bipolar transistor construction |
| JPS6153762A (ja) * | 1984-08-24 | 1986-03-17 | Hitachi Ltd | 半導体集積回路装置 |
| GB2172744B (en) * | 1985-03-23 | 1989-07-19 | Stc Plc | Semiconductor devices |
| US4604790A (en) * | 1985-04-01 | 1986-08-12 | Advanced Micro Devices, Inc. | Method of fabricating integrated circuit structure having CMOS and bipolar devices |
| US4929992A (en) * | 1985-09-18 | 1990-05-29 | Advanced Micro Devices, Inc. | MOS transistor construction with self aligned silicided contacts to gate, source, and drain regions |
| JPH0638856A (ja) * | 1992-07-21 | 1994-02-15 | Tokyo Seat Kk | アームレストの取付装置 |
| JP3930944B2 (ja) * | 1997-06-16 | 2007-06-13 | 株式会社Neomax | 画像形成方法 |
-
1985
- 1985-03-23 GB GB858507624A patent/GB8507624D0/en active Pending
-
1986
- 1986-02-11 GB GB8603322A patent/GB2173638B/en not_active Expired
- 1986-02-17 EP EP86200948A patent/EP0234054B1/de not_active Expired - Lifetime
- 1986-02-17 AT AT86301052T patent/ATE52877T1/de active
- 1986-02-17 DE DE8686301052T patent/DE3671326D1/de not_active Expired - Fee Related
- 1986-02-17 AT AT86200948T patent/ATE57586T1/de not_active IP Right Cessation
- 1986-02-17 DE DE8686200948T patent/DE3675010D1/de not_active Expired - Fee Related
- 1986-02-17 EP EP86301052A patent/EP0196757B1/de not_active Expired - Lifetime
- 1986-02-21 NO NO860663A patent/NO173478C/no unknown
- 1986-03-14 JP JP61057996A patent/JPH0799764B2/ja not_active Expired - Lifetime
- 1986-03-18 KR KR1019860001982A patent/KR920006752B1/ko not_active Expired
- 1986-03-18 PH PH33548A patent/PH26112A/en unknown
- 1986-03-19 CN CN86101789.7A patent/CN1004593B/zh not_active Expired
- 1986-05-27 GB GB8612801A patent/GB2174244B/en not_active Expired
- 1986-05-29 JP JP61122381A patent/JPH0783024B2/ja not_active Expired - Lifetime
- 1986-05-30 KR KR1019860004253A patent/KR920010192B1/ko not_active Expired
- 1986-05-31 CN CN86103793A patent/CN1007389B/zh not_active Expired
-
1987
- 1987-12-16 US US07/133,269 patent/US4914048A/en not_active Expired - Lifetime
- 1987-12-16 US US07/133,270 patent/US4849364A/en not_active Expired - Lifetime
-
1988
- 1988-12-13 US US07/284,796 patent/US4845532A/en not_active Expired - Lifetime
-
1990
- 1990-08-23 SG SG698/90A patent/SG69890G/en unknown
Also Published As
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |