ATE52877T1 - Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung. - Google Patents

Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung.

Info

Publication number
ATE52877T1
ATE52877T1 AT86301052T AT86301052T ATE52877T1 AT E52877 T1 ATE52877 T1 AT E52877T1 AT 86301052 T AT86301052 T AT 86301052T AT 86301052 T AT86301052 T AT 86301052T AT E52877 T1 ATE52877 T1 AT E52877T1
Authority
AT
Austria
Prior art keywords
base
bipolar
implant
transistors
production
Prior art date
Application number
AT86301052T
Other languages
English (en)
Inventor
Peter Denis Scovell
Roger Leslie Baker
Peter Fred Blomley
Original Assignee
Stc Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stc Plc filed Critical Stc Plc
Application granted granted Critical
Publication of ATE52877T1 publication Critical patent/ATE52877T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0107Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401Combinations of FETs or IGBTs with BJTs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/01Bipolar transistors-ion implantation

Landscapes

  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Recrystallisation Techniques (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Noodles (AREA)
  • Thin Film Transistor (AREA)
AT86301052T 1985-03-23 1986-02-17 Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung. ATE52877T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB858507624A GB8507624D0 (en) 1985-03-23 1985-03-23 Semiconductor devices
EP86301052A EP0196757B1 (de) 1985-03-23 1986-02-17 Halbleiteranordnung mit einem bipolaren Transistor und einem MOS-Transistor und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
ATE52877T1 true ATE52877T1 (de) 1990-06-15

Family

ID=10576545

Family Applications (2)

Application Number Title Priority Date Filing Date
AT86301052T ATE52877T1 (de) 1985-03-23 1986-02-17 Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung.
AT86200948T ATE57586T1 (de) 1985-03-23 1986-02-17 Verfahren zur herstellung eines bipolartransistors.

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT86200948T ATE57586T1 (de) 1985-03-23 1986-02-17 Verfahren zur herstellung eines bipolartransistors.

Country Status (11)

Country Link
US (3) US4914048A (de)
EP (2) EP0234054B1 (de)
JP (2) JPH0799764B2 (de)
KR (2) KR920006752B1 (de)
CN (2) CN1004593B (de)
AT (2) ATE52877T1 (de)
DE (2) DE3671326D1 (de)
GB (3) GB8507624D0 (de)
NO (1) NO173478C (de)
PH (1) PH26112A (de)
SG (1) SG69890G (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188479B (en) * 1986-03-26 1990-05-23 Stc Plc Semiconductor devices
JPS63239856A (ja) * 1987-03-27 1988-10-05 Hitachi Ltd 半導体集積回路装置及びその製造方法
KR900001062B1 (ko) * 1987-09-15 1990-02-26 강진구 반도체 바이 씨 모오스 장치의 제조방법
EP0316104A3 (de) * 1987-11-03 1991-01-30 Stc Plc Integrierte Schaltungen mit Widerständen und Bipolartransistoren
US5124817A (en) * 1988-01-19 1992-06-23 National Semiconductor Corporation Polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
EP0325181B1 (de) * 1988-01-19 1995-04-05 National Semiconductor Corporation Verfahren zum Herstellen eines Polysiliciumemitters und eines Polysiliciumgates durch gleichzeitiges Ätzen von Polysilicium auf einem dünnen Gateoxid
FR2626406B1 (fr) * 1988-01-22 1992-01-24 France Etat Transistor bipolaire compatible avec la technologie mos
GB2214870B (en) * 1988-02-20 1991-09-11 Stc Plc Plasma etching process
DE3914910C2 (de) * 1988-05-10 1999-11-25 Northern Telecom Ltd Verfahren zur Herstellung einer integrierten Schaltung
GB8810973D0 (en) * 1988-05-10 1988-06-15 Stc Plc Improvements in integrated circuits
US5091760A (en) * 1989-04-14 1992-02-25 Kabushiki Kaisha Toshiba Semiconductor device
JPH0348457A (ja) * 1989-04-14 1991-03-01 Toshiba Corp 半導体装置およびその製造方法
US5028973A (en) * 1989-06-19 1991-07-02 Harris Corporation Bipolar transistor with high efficient emitter
US5177582A (en) * 1989-09-22 1993-01-05 Siemens Aktiengesellschaft CMOS-compatible bipolar transistor with reduced collector/substrate capacitance and process for producing the same
US4983531A (en) * 1990-02-12 1991-01-08 Motorola, Inc. Method of fabricating a single polysilicon bipolar transistor which is compatible with a method of fabricating CMOS transistors
US4987089A (en) * 1990-07-23 1991-01-22 Micron Technology, Inc. BiCMOS process and process for forming bipolar transistors on wafers also containing FETs
JP2842682B2 (ja) * 1990-11-08 1999-01-06 シャープ株式会社 半導体装置の製造方法
US5158900A (en) * 1991-10-18 1992-10-27 Hewlett-Packard Company Method of separately fabricating a base/emitter structure of a BiCMOS device
WO1993016494A1 (en) * 1992-01-31 1993-08-19 Analog Devices, Inc. Complementary bipolar polysilicon emitter devices
JPH08172100A (ja) * 1994-12-16 1996-07-02 Mitsubishi Electric Corp 半導体装置
US5830789A (en) * 1996-11-19 1998-11-03 Integrated Device Technology, Inc. CMOS process forming wells after gate formation
KR100235628B1 (ko) * 1997-06-25 1999-12-15 김영환 반도체 소자의 제조방법
KR20040008485A (ko) * 2002-07-18 2004-01-31 주식회사 하이닉스반도체 반도체소자의 테스트 패턴 형성방법
JP2004311684A (ja) * 2003-04-07 2004-11-04 Sanyo Electric Co Ltd 半導体装置
TW200524139A (en) * 2003-12-24 2005-07-16 Renesas Tech Corp Voltage generating circuit and semiconductor integrated circuit
WO2006117712A1 (en) * 2005-04-29 2006-11-09 Nxp B.V. Method of fabricating a bipolar transistor

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA969290A (en) * 1971-10-20 1975-06-10 Alfred C. Ipri Fabrication of semiconductor devices incorporating polycrystalline silicon
US3753807A (en) * 1972-02-24 1973-08-21 Bell Canada Northern Electric Manufacture of bipolar semiconductor devices
US4041518A (en) * 1973-02-24 1977-08-09 Hitachi, Ltd. MIS semiconductor device and method of manufacturing the same
US3940288A (en) * 1973-05-16 1976-02-24 Fujitsu Limited Method of making a semiconductor device
JPS539469A (en) * 1976-07-15 1978-01-27 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device having electrode of stepped structure and its production
US4120707A (en) * 1977-03-30 1978-10-17 Harris Corporation Process of fabricating junction isolated IGFET and bipolar transistor integrated circuit by diffusion
US4099987A (en) * 1977-07-25 1978-07-11 International Business Machines Corporation Fabricating integrated circuits incorporating high-performance bipolar transistors
JPS5846863B2 (ja) * 1977-08-25 1983-10-19 松下電器産業株式会社 半導体集積回路装置
JPS54101290A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Semiconductor integtated circuit unit and its manufacture
GB2023340B (en) * 1978-06-01 1982-09-02 Mitsubishi Electric Corp Integrated circuits
US4289550A (en) * 1979-05-25 1981-09-15 Raytheon Company Method of forming closely spaced device regions utilizing selective etching and diffusion
US4452645A (en) * 1979-11-13 1984-06-05 International Business Machines Corporation Method of making emitter regions by implantation through a non-monocrystalline layer
DE2946963A1 (de) * 1979-11-21 1981-06-04 Siemens AG, 1000 Berlin und 8000 München Schnelle bipolare transistoren
US4534806A (en) * 1979-12-03 1985-08-13 International Business Machines Corporation Method for manufacturing vertical PNP transistor with shallow emitter
JPS5696860A (en) * 1979-12-29 1981-08-05 Sony Corp Semiconductor device
US4301588A (en) * 1980-02-01 1981-11-24 International Business Machines Corporation Consumable amorphous or polysilicon emitter process
JPS5710969A (en) * 1980-06-25 1982-01-20 Nec Corp Semiconductor device and manufacture thereof
US4391650A (en) * 1980-12-22 1983-07-05 Ncr Corporation Method for fabricating improved complementary metal oxide semiconductor devices
JPS57206063A (en) * 1981-06-15 1982-12-17 Toshiba Corp Semiconductor substrate and manufacture therefor
US4483726A (en) * 1981-06-30 1984-11-20 International Business Machines Corporation Double self-aligned fabrication process for making a bipolar transistor structure having a small polysilicon-to-extrinsic base contact area
US4498223A (en) * 1982-04-23 1985-02-12 Gte Laboratories Incorporated Method of fabrication of monolithic integrated circuit structure
EP0093786B1 (de) * 1982-05-06 1986-08-06 Deutsche ITT Industries GmbH Verfahren zum Herstellen einer planaren monolithisch integrierten Festkörperschaltung mit mindestens einem Isolierschicht-Feldeffekttransistor und mit mindestens einem Bipolartransistor
US4437897A (en) * 1982-05-18 1984-03-20 International Business Machines Corporation Fabrication process for a shallow emitter/base transistor using same polycrystalline layer
US4507847A (en) * 1982-06-22 1985-04-02 Ncr Corporation Method of making CMOS by twin-tub process integrated with a vertical bipolar transistor
JPS58225663A (ja) * 1982-06-23 1983-12-27 Toshiba Corp 半導体装置の製造方法
JPS5931052A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 半導体集積回路装置の製造方法
JPS59117150A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 半導体集積回路装置とその製造法
JPS59138363A (ja) * 1983-01-28 1984-08-08 Hitachi Ltd 半導体装置及びその製造方法
US4673965A (en) * 1983-02-22 1987-06-16 General Motors Corporation Uses for buried contacts in integrated circuits
IT1162836B (it) * 1983-03-04 1987-04-01 Cselt Centro Studi Lab Telecom Ricestrasmettitore numerico per trasmissione bidirezionale simultanea di segnali logici su una linea unica
US4631568A (en) * 1983-03-08 1986-12-23 Trw Inc. Bipolar transistor construction
EP0122004A3 (de) * 1983-03-08 1986-12-17 Trw Inc. Aufbau eines Bipolartransistors
JPS59186367A (ja) * 1983-04-06 1984-10-23 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6010776A (ja) * 1983-06-30 1985-01-19 Fujitsu Ltd バイポーラトランジスタの製造方法
GB2143083B (en) * 1983-07-06 1987-11-25 Standard Telephones Cables Ltd Semiconductor structures
US4574467A (en) * 1983-08-31 1986-03-11 Solid State Scientific, Inc. N- well CMOS process on a P substrate with double field guard rings and a PMOS buried channel
US4637125A (en) * 1983-09-22 1987-01-20 Kabushiki Kaisha Toshiba Method for making a semiconductor integrated device including bipolar transistor and CMOS transistor
US4523370A (en) * 1983-12-05 1985-06-18 Ncr Corporation Process for fabricating a bipolar transistor with a thin base and an abrupt base-collector junction
US4647958A (en) * 1984-04-16 1987-03-03 Trw Inc. Bipolar transistor construction
JPS6153762A (ja) * 1984-08-24 1986-03-17 Hitachi Ltd 半導体集積回路装置
GB2172744B (en) * 1985-03-23 1989-07-19 Stc Plc Semiconductor devices
US4604790A (en) * 1985-04-01 1986-08-12 Advanced Micro Devices, Inc. Method of fabricating integrated circuit structure having CMOS and bipolar devices
US4929992A (en) * 1985-09-18 1990-05-29 Advanced Micro Devices, Inc. MOS transistor construction with self aligned silicided contacts to gate, source, and drain regions
JPH0638856A (ja) * 1992-07-21 1994-02-15 Tokyo Seat Kk アームレストの取付装置
JP3930944B2 (ja) * 1997-06-16 2007-06-13 株式会社Neomax 画像形成方法

Also Published As

Publication number Publication date
JPH0799764B2 (ja) 1995-10-25
US4849364A (en) 1989-07-18
KR920010192B1 (ko) 1992-11-19
NO173478C (no) 1993-12-15
EP0196757A2 (de) 1986-10-08
CN86103793A (zh) 1987-04-08
NO173478B (no) 1993-09-06
KR860007746A (ko) 1986-10-17
EP0234054B1 (de) 1990-10-17
GB8612801D0 (en) 1986-07-02
GB2174244A (en) 1986-10-29
GB2174244B (en) 1989-07-05
KR920006752B1 (ko) 1992-08-17
US4845532A (en) 1989-07-04
CN1004593B (zh) 1989-06-21
DE3671326D1 (de) 1990-06-21
EP0196757B1 (de) 1990-05-16
EP0234054A1 (de) 1987-09-02
PH26112A (en) 1992-02-06
GB8603322D0 (en) 1986-03-19
KR860007863A (ko) 1986-10-17
ATE57586T1 (de) 1990-11-15
CN86101789A (zh) 1986-11-19
CN1007389B (zh) 1990-03-28
NO860663L (no) 1986-09-24
US4914048A (en) 1990-04-03
EP0196757A3 (en) 1987-05-27
JPH0783024B2 (ja) 1995-09-06
GB2173638A (en) 1986-10-15
GB2173638B (en) 1989-06-28
SG69890G (en) 1990-11-23
DE3675010D1 (de) 1990-11-22
JPS61220453A (ja) 1986-09-30
GB8507624D0 (en) 1985-05-01
JPS6351673A (ja) 1988-03-04

Similar Documents

Publication Publication Date Title
ATE52877T1 (de) Halbleiteranordnung mit einem bipolaren transistor und einem mos-transistor und verfahren zu deren herstellung.
ATE94306T1 (de) Verfahren zum herstellen von bipolaren transistoren und komplementaeren mos-transistoren auf einem gemeinsamen siliziumsubstrat.
DE3676781D1 (de) Integrierte bipolar- und komplementaere mos-transistoren auf einem gemeinsamen substrat enthaltende schaltung und verfahren zu ihrer herstellung.
ATE55511T1 (de) Verfahren zum gleichzeitigen herstellen von selbstjustierten bipolaren transistoren und komplementaeren mos-transistoren auf einem gemeinsamen siliziumsubstrat.
EP0388000A3 (de) Verfahren zum Herstellen bipolarer vertikaler Transistoren und von Hochspannungs-CMOS-Transistoren in einer einzigen integrierten Schaltung
JPS5546504A (en) Semiconductor device
HK44286A (en) A semiconductor device and a process for producing the same
DE3778311D1 (de) Mos-feldeffekt-transistorstruktur mit extrem flachen source/- drain-zonen und silizid-anschlussbereichen, sowie verfahren zu ihrer herstellung in einer integrierten schaltung.
KR910001993A (ko) 반도체장치의 제조방법
EP0241059A3 (de) Verfahren zum Herstellen eines MOS-Leistungstransistors
DE3787407D1 (de) Integrierte Bipolar- und komplementäre MOS-Transistoren auf einem gemeinsamen Substrat enthaltende Schaltung und Verfahren zu ihrer Herstellung.
KR900017184A (ko) 반도체장치 및 그 제조방법
DE3687973D1 (de) Verfahren zum gleichzeitigen herstellen von bipolaren und komplementaeren mos-transistoren auf einem gemeinsamen siliziumsubstrat.
EP0768709A3 (de) BiCMOS-Verfahren mit Bipolartransistor mit geringem Basis-Rekombinationsstrom
KR870009491A (ko) 반도체 디바이스(device)
DE3684555D1 (de) Verfahren zur herstellung von halbleiterschaltungen um einen bipolaren transistor mit extrinsischen basengebieten zu bilden.
KR910003834A (ko) 반도체장치의 제조방법
KR900017202A (ko) 반도체장치와 그 제조방법
JPS55157257A (en) Manufacture of mos integrated circuit
JPS63240058A (ja) 半導体装置の製造方法
ATE43204T1 (de) Verfahren zum herstellen von integrierten schaltungen durch mos- und cmos-technologie und entsprechende cmos-struktur.
JPS54159880A (en) Semiconductor
JPH08213471A (ja) 半導体装置およびその製造方法
KR900008695A (ko) 바이폴라 및 mos 트랜지스터를 사용한 인버터 회로 및 그 제조방법
JPS6484747A (en) Manufacture of semiconductor device