DE3535791A1 - Karte mit eingebautem chip - Google Patents

Karte mit eingebautem chip

Info

Publication number
DE3535791A1
DE3535791A1 DE19853535791 DE3535791A DE3535791A1 DE 3535791 A1 DE3535791 A1 DE 3535791A1 DE 19853535791 DE19853535791 DE 19853535791 DE 3535791 A DE3535791 A DE 3535791A DE 3535791 A1 DE3535791 A1 DE 3535791A1
Authority
DE
Germany
Prior art keywords
pellet
insulating film
card
card according
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853535791
Other languages
German (de)
English (en)
Other versions
DE3535791C2 (OSRAM
Inventor
Kazuya Tokio/Tokyo Hara
Kenji Tanashi Tokio/Tokyo Rikuna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of DE3535791A1 publication Critical patent/DE3535791A1/de
Application granted granted Critical
Publication of DE3535791C2 publication Critical patent/DE3535791C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W70/611—
    • H10W70/699—
    • H10W74/114—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/22—Nonparticulate element embedded or inlaid in substrate and visible
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
DE19853535791 1984-11-05 1985-10-07 Karte mit eingebautem chip Granted DE3535791A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59232834A JPS61123990A (ja) 1984-11-05 1984-11-05 Ｉｃカ−ド

Publications (2)

Publication Number Publication Date
DE3535791A1 true DE3535791A1 (de) 1986-05-07
DE3535791C2 DE3535791C2 (OSRAM) 1989-02-23

Family

ID=16945516

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853535791 Granted DE3535791A1 (de) 1984-11-05 1985-10-07 Karte mit eingebautem chip

Country Status (6)

Country Link
US (1) US4719140A (OSRAM)
JP (1) JPS61123990A (OSRAM)
KR (1) KR900001698B1 (OSRAM)
DE (1) DE3535791A1 (OSRAM)
FR (1) FR2572826B1 (OSRAM)
GB (2) GB2166589B (OSRAM)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3741925A1 (de) * 1986-12-11 1988-06-23 Mitsubishi Electric Corp Ic-karten und verfahren zu ihrer herstellung
DE4028966A1 (de) * 1990-09-12 1992-03-19 Rudolf Dr Goedecke Anschluesse an ic - speicherkarten und steckmodule, ueber die analoge oder digitale signale in ein datenverarbeitungsgeraet ein- und ausgegeben werden koennen
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
EP0209791B1 (en) * 1985-07-10 1993-04-14 Casio Computer Company Limited Electronic memory card
DE4223371A1 (de) * 1992-07-16 1994-01-20 Thomson Brandt Gmbh Verfahren und Platine zur Montage von Bauelementen
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig, Wolfgang, Dr.-Ing., 90542 Eckental Chipkarten aus Metall
DE29515521U1 (de) * 1995-09-28 1996-01-18 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Multi-Chip-Modul
WO1996037917A1 (en) * 1995-05-23 1996-11-28 Hitachi, Ltd. Semiconductor assembly
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
EP0688051B1 (fr) * 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
US6008993A (en) * 1994-12-11 1999-12-28 Angeuandte Digital Electronik Gmbh Chip card with chip support element and coil support element
US6400006B2 (en) 1998-07-28 2002-06-04 Infineon Technologies Ag Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
US6992898B2 (en) 1999-12-02 2006-01-31 Infineon Technologies Ag Smart-card module with an anisotropically conductive substrate film

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524551Y2 (OSRAM) * 1985-07-26 1993-06-22
US4841134A (en) * 1985-07-27 1989-06-20 Dai Nippon Insatsu Kabushika Kaisha IC card
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6387064U (OSRAM) * 1986-11-27 1988-06-07
JP2796625B2 (ja) * 1988-01-09 1998-09-10 カシオ計算機株式会社 電子桟器
JPH0780371B2 (ja) * 1987-05-13 1995-08-30 株式会社トクヤマ エレクトロクロミツクデイスプレイカ−ド
FR2641102B1 (OSRAM) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
DE3941070A1 (de) * 1989-12-08 1991-06-13 Dirk Lehnartz Informations- und werbetraeger, insbesondere praesentations- und / oder geschaeftskarte
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
EP0569401A1 (de) * 1991-01-28 1993-11-18 Siemens Aktiengesellschaft Verfahren zur herstellung einer tragbaren datenträgeranordnung
DE9113565U1 (de) * 1991-08-27 1992-01-02 Pelzer, Guido, 50374 Erftstadt Mobiler Datenträger
EP0618083B1 (en) * 1992-08-12 1997-10-08 Oki Electric Industry Company, Limited IC Card
JPH06122297A (ja) * 1992-08-31 1994-05-06 Sony Chem Corp Ｉｃカード及びその製造方法
DE4234158A1 (de) * 1992-10-10 1994-04-14 Walter Holzer Duale Datenträgerkarte
DE69431023T2 (de) * 1993-09-01 2003-02-06 Kabushiki Kaisha Toshiba, Kawasaki Halbleiteraufbau und Verfahren zur Herstellung
JPH07101188A (ja) * 1993-10-05 1995-04-18 Canon Inc 複合カード
JPH07221590A (ja) * 1994-01-31 1995-08-18 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
US5588678A (en) * 1994-06-27 1996-12-31 Great Western Press, Inc. Talking trading card
US5451763A (en) * 1994-07-05 1995-09-19 Alto Corporation Personal medical IC card and read/write unit
DE69506285D1 (de) * 1995-01-27 1999-01-07 Interprint Formularios Ltd Speicherkarte und verfahren zu ihrer herstellung
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
EP0836155A3 (en) * 1996-10-09 1999-03-31 Canon Kabushiki Kaisha Information recording medium
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
DE19735171A1 (de) * 1997-08-13 1999-01-07 Siemens Ag Halbleitermodul
US6124546A (en) * 1997-12-03 2000-09-26 Advanced Micro Devices, Inc. Integrated circuit chip package and method of making the same
JP2000099678A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd Ｉｃカード及びその製造方法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
SG80077A1 (en) 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
JP4470242B2 (ja) * 1999-04-23 2010-06-02 ソニー株式会社 半導体メモリカード
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres
DE10042312A1 (de) * 2000-08-29 2002-03-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
JP4873776B2 (ja) * 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
DE10139395A1 (de) * 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
JP2008541441A (ja) * 2005-05-11 2008-11-20 ストミクロエレクトロニクス・ソシエテ・アノニム 傾斜コンタクトパッドを有するシリコンチップ及びそのようなチップを備えた電子モジュール
CN203894790U (zh) * 2013-04-11 2014-10-22 德昌电机(深圳)有限公司 智能卡、身份识别卡、银行卡及智能卡触板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2920012B1 (de) * 1979-05-17 1980-11-20 Gao Ges Automation Org Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592179B2 (ja) * 1975-03-03 1984-01-17 セイコーエプソン株式会社 電気的部材の製造方法
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
US4447716A (en) * 1982-03-01 1984-05-08 Seiichiro Aigo Information card
JPS58213160A (ja) * 1982-06-04 1983-12-12 株式会社東芝 冷凍サイクル装置
CA1204213A (en) * 1982-09-09 1986-05-06 Masahiro Takeda Memory card having static electricity protection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2920012B1 (de) * 1979-05-17 1980-11-20 Gao Ges Automation Org Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209791B1 (en) * 1985-07-10 1993-04-14 Casio Computer Company Limited Electronic memory card
DE3741925A1 (de) * 1986-12-11 1988-06-23 Mitsubishi Electric Corp Ic-karten und verfahren zu ihrer herstellung
DE4028966A1 (de) * 1990-09-12 1992-03-19 Rudolf Dr Goedecke Anschluesse an ic - speicherkarten und steckmodule, ueber die analoge oder digitale signale in ein datenverarbeitungsgeraet ein- und ausgegeben werden koennen
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
DE4223371A1 (de) * 1992-07-16 1994-01-20 Thomson Brandt Gmbh Verfahren und Platine zur Montage von Bauelementen
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
EP0688051B1 (fr) * 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
US6008993A (en) * 1994-12-11 1999-12-28 Angeuandte Digital Electronik Gmbh Chip card with chip support element and coil support element
WO1996037917A1 (en) * 1995-05-23 1996-11-28 Hitachi, Ltd. Semiconductor assembly
US6166911A (en) * 1995-05-23 2000-12-26 Hitachi, Ltd. Semiconductor integrated circuit card assembly
DE29515521U1 (de) * 1995-09-28 1996-01-18 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Multi-Chip-Modul
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig, Wolfgang, Dr.-Ing., 90542 Eckental Chipkarten aus Metall
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
US6305609B1 (en) 1996-01-26 2001-10-23 Infineon Technologies Ag Data card, process for manufacturing a data card and apparatus for manufacturing a data card
US6400006B2 (en) 1998-07-28 2002-06-04 Infineon Technologies Ag Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
US6992898B2 (en) 1999-12-02 2006-01-31 Infineon Technologies Ag Smart-card module with an anisotropically conductive substrate film

Also Published As

Publication number Publication date
GB2204182B (en) 1989-04-19
GB2166589B (en) 1989-04-26
DE3535791C2 (OSRAM) 1989-02-23
GB8813471D0 (en) 1988-07-13
GB8524271D0 (en) 1985-11-06
FR2572826B1 (fr) 1991-02-22
FR2572826A1 (fr) 1986-05-09
KR860004370A (ko) 1986-06-20
KR900001698B1 (ko) 1990-03-19
GB2204182A (en) 1988-11-02
GB2166589A (en) 1986-05-08
US4719140A (en) 1988-01-12
JPS61123990A (ja) 1986-06-11

Similar Documents

Publication Publication Date Title
DE3535791C2 (OSRAM)
DE2659573C2 (de) Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte
DE68921179T2 (de) Elektronisches Modul mit einer integrierten Schaltung für ein kleines tragbares Objekt, z.B. eine Karte oder ein Schlüssel und Herstellungsverfahren für solche Module.
DE60005671T9 (de) Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg
DE3307356C2 (de) Plattenförmiges elektronisches Gerät
DE19710144C2 (de) Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
DE3586666T2 (de) Karte mit ic-baustein und verfahren zur herstellung derselben.
DE69614726T2 (de) Datenspeicheranordnung und diese verwendende Datenverarbeitungsanordnung
EP0946926B1 (de) Kontaktlose chipkarte mit transponderspule
DE3118298C2 (OSRAM)
DE69529202T2 (de) Notizblock
EP0902973B1 (de) Trägerelement für einen halbleiterchip
DE3130206A1 (de) Tragbare karte zur informationsverarbeitung
CH659800A5 (de) Ausweiskarte mit ic-baustein.
DE2942422A1 (de) Traegerplatte fuer integrierte schaltkreise
EP0116148A1 (de) Ausweiskarte mit integriertem Schaltkreis
DE69929981T2 (de) Verfahren zum herstellen einer kontaktlosen chipkarte
WO1985002046A1 (fr) Support d'informations muni d'un circuit integre et procede pour la fabrication
CH656471A5 (de) Tragbares, aus mehreren schichten aufgebautes ausweiselement.
EP0232705A2 (de) Elektronische Datenträger und Verfahren zu seiner Herstellung
EP1924947B1 (de) Manipulations- und durchbohrschutz für eine an eine elektrische schaltung anzuschliessende vorrichtung
DE69905288T2 (de) Verfahren zur herstellung einer kontaktlosen chipkarte
EP1028388B1 (de) Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
DE3111516A1 (de) "ausweiskarte mit ic-baustein"
DE602004004647T2 (de) Verfahren zum zusammenbauen eines elektronischen komponent auf einem substrat

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee