DE3200301C2 - - Google Patents
Info
- Publication number
- DE3200301C2 DE3200301C2 DE3200301A DE3200301A DE3200301C2 DE 3200301 C2 DE3200301 C2 DE 3200301C2 DE 3200301 A DE3200301 A DE 3200301A DE 3200301 A DE3200301 A DE 3200301A DE 3200301 C2 DE3200301 C2 DE 3200301C2
- Authority
- DE
- Germany
- Prior art keywords
- polysulfone
- range
- radiation
- sulfone
- polysulfones
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
- B29C2071/022—Annealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
- B29K2081/06—PSU, i.e. polysulfones; PES, i.e. polyethersulfones or derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Eine Polysulfon-Folie oder ein Polysulfon-Film wird ausgewählter elektromagnetischer Strahlung ausgesetzt, und zwar in einem oder mehreren Frequenzbereichen, welche vom Material absorbiert werden und zu dessen Entspannung führen, ohne daß eine wesentliche Wärmeentwicklung entsteht, unter deren Einfluß sich das Material verformt und/oder erweicht. Die Bestrahlung wird solange fortgesetzt, bis das Material gegenüber chemischen und mechanischen Einflüssen stabil ist und nicht mehr zur Rißbildung neigt. Die Strahlung wird aus dem Infrarot-, UV- oder Mikrowellen-Bereich ausgewählt.
Claims (1)
- Verfahren zur Herstellung von gedruckten Schaltungen nach dem Semi- oder Volladditiv-Verfahren unter Verwendung eines Isolierstoffträgers mit auflaminiertem Polysulfonmaterial sowie an sich bekannten Verfahrensschritten, wobei nach mechanischen Prozeßschritten übliche Entspannungsprozesse vorgenommen werden, dadurch gekennzeichnet, daß folgende Verfahrensschritte vorgenommen werden:
- a) Bestrahlung der Polysulfonschicht einer Dicke
größer 70 µm mit elektromagnetischer Strahlung im
- - Mikrowellenbereich größer als 1860 MHz
- - IR-Bereich zwischen 2,5 und 40 µm und/oder
- - UV-Bereich zwischen 0,23 und 0,28 µm
- b) Auflaminieren der behandelten Polysulfonschicht
- c) Bohren bzw. Stanzen des Basismaterials
- d) Behandlung des Zwischenprodukts gemäß Punkt a).
- a) Bestrahlung der Polysulfonschicht einer Dicke
größer 70 µm mit elektromagnetischer Strahlung im
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/223,944 US4339303A (en) | 1981-01-12 | 1981-01-12 | Radiation stress relieving of sulfone polymer articles |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3200301A1 DE3200301A1 (de) | 1982-07-29 |
DE3200301C2 true DE3200301C2 (de) | 1989-03-23 |
Family
ID=22838645
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823200301 Granted DE3200301A1 (de) | 1981-01-12 | 1982-01-05 | Entspannung durch elektromagnetische strahlungseinwirkung fuer aus polysulfonen bestehende gegenstaende |
DE3249736A Expired DE3249736C2 (de) | 1981-01-12 | 1982-01-05 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3249736A Expired DE3249736C2 (de) | 1981-01-12 | 1982-01-05 |
Country Status (17)
Country | Link |
---|---|
US (1) | US4339303A (de) |
JP (1) | JPS57117540A (de) |
AT (1) | AT384992B (de) |
AU (1) | AU546467B2 (de) |
BE (1) | BE891753A (de) |
CA (1) | CA1189019A (de) |
CH (1) | CH656809A5 (de) |
DE (2) | DE3200301A1 (de) |
DK (1) | DK7782A (de) |
ES (2) | ES508632A0 (de) |
FR (1) | FR2497813B1 (de) |
GB (1) | GB2094320B (de) |
IL (1) | IL64754A (de) |
IT (1) | IT1172200B (de) |
NL (1) | NL8200082A (de) |
SE (2) | SE453582B (de) |
ZA (1) | ZA815415B (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4424095A (en) | 1981-01-12 | 1984-01-03 | Kollmorgen Technologies Corporation | Radiation stress relieving of polymer articles |
ZA823981B (en) * | 1982-05-21 | 1983-06-29 | Kollmorgen Tech Corp | Radiation stress relieving of polymer articles |
US4520067A (en) * | 1982-06-23 | 1985-05-28 | Union Carbide Corporation | Composition useful for making circuit board substrates and electrical connectors |
US4861640A (en) * | 1982-09-03 | 1989-08-29 | John Fluke Mfg. Co., Inc. | Molded circuit board and manufacturing method therefor |
US4447471A (en) * | 1982-12-30 | 1984-05-08 | Gould Inc. | Method of treating thermoplastic surfaces |
KR840009026A (ko) * | 1983-03-02 | 1984-12-20 | 아아르 미첼(외2) 데니스 | 전기 전도체를 절연 기판에 접착하는 방법 |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
US4585502A (en) * | 1984-04-27 | 1986-04-29 | Hitachi Condenser Co., Ltd. | Process for producing printed circuit board |
US4641222A (en) * | 1984-05-29 | 1987-02-03 | Motorola, Inc. | Mounting system for stress relief in surface mounted components |
US4626309A (en) * | 1984-07-02 | 1986-12-02 | Motorola, Inc. | Selective bonding interconnection mask |
US5047114A (en) * | 1984-11-02 | 1991-09-10 | Amp-Akzo Corporation | Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials |
BR8601393A (pt) * | 1985-03-26 | 1986-12-02 | Illinois Tool Works | Metodo para processamento de um substrato flexivel |
DE3515109A1 (de) * | 1985-04-26 | 1986-10-30 | Bayer Ag, 5090 Leverkusen | Kunststoffteile mit quasi dielektrisch isotropem aufbau |
US4777564A (en) * | 1986-10-16 | 1988-10-11 | Motorola, Inc. | Leadform for use with surface mounted components |
US4859805A (en) * | 1987-09-19 | 1989-08-22 | Nippon Cmk Corp. | Printed wiring board |
JPH0798870B2 (ja) * | 1987-12-11 | 1995-10-25 | 帝人株式会社 | 高分子の光加工方法 |
US5017311A (en) * | 1988-07-21 | 1991-05-21 | Idemitsu Kosan Co., Ltd. | Method for injection molding into a resonating mold |
DE4027169C2 (de) * | 1989-08-31 | 1994-05-05 | Aisin Seiki | Außen-Rückspiegel für ein Kraftfahrzeug |
US5259999A (en) * | 1990-04-04 | 1993-11-09 | Mitsubishi Gas Chemical Co., Inc. | Process for producing resin molded article having diminished residual stress |
US5245751A (en) * | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
FR2671513B1 (fr) * | 1991-01-14 | 1993-04-23 | Sextant Avionique | Procede pour rendre etanches des pieces comprenant des inserts metalliques surmoules. |
JP2875438B2 (ja) * | 1992-09-24 | 1999-03-31 | 日本ペイント株式会社 | 熱可塑性樹脂製品の表面処理方法 |
GB2279364B (en) * | 1993-06-29 | 1997-03-26 | Hitech Pop Limited | Sheilding of polymer casings |
US5753134A (en) * | 1994-01-04 | 1998-05-19 | Siemens Aktiengesellschaft | Method for producing a layer with reduced mechanical stresses |
US5840402A (en) * | 1994-06-24 | 1998-11-24 | Sheldahl, Inc. | Metallized laminate material having ordered distribution of conductive through holes |
US5489404A (en) * | 1994-08-08 | 1996-02-06 | General Electric Company | Process for annealing thermoplastics |
WO1996005970A1 (en) * | 1994-08-25 | 1996-02-29 | Parlex Corporation | A printed circuit board and method of manufacture thereof |
US5522954A (en) * | 1994-09-12 | 1996-06-04 | Ford Motor Company | Non-contact bonding of plastics |
JP3885280B2 (ja) * | 1997-04-25 | 2007-02-21 | 東レ株式会社 | 金属蒸着フィルム、その製造方法及びそれを用いたコンデンサ |
US6015520A (en) * | 1997-05-15 | 2000-01-18 | International Business Machines Corporation | Method for filling holes in printed wiring boards |
DE19723854A1 (de) * | 1997-06-06 | 1998-12-10 | Hoechst Ag | Verfahren zur Herstellung von Lösungen mit Säuregruppen funktionalisierter Polymere durch Mikrowellenbestrahlung |
US6557977B1 (en) * | 1997-07-15 | 2003-05-06 | Silverbrook Research Pty Ltd | Shape memory alloy ink jet printing mechanism |
US7527357B2 (en) | 1997-07-15 | 2009-05-05 | Silverbrook Research Pty Ltd | Inkjet nozzle array with individual feed channel for each nozzle |
AUPR245001A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | A method (WSM03) |
US6630743B2 (en) * | 2001-02-27 | 2003-10-07 | International Business Machines Corporation | Copper plated PTH barrels and methods for fabricating |
DE10260137B4 (de) * | 2002-12-20 | 2004-11-18 | Schroeter, Johannes, Dr. | Verfahren zur plastischen Verformung von Polymeren |
JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
AU2006292463B2 (en) * | 2005-09-16 | 2011-03-24 | Covidien Lp | Methods for relaxing stress in polymeric materials |
CN101522590A (zh) * | 2006-08-07 | 2009-09-02 | 马塞尔-布加蒂股份有限公司 | 多孔制品致密化的方法 |
US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1065971A (en) * | 1964-03-07 | 1967-04-19 | Elliott Electronic Tubes Ltd | Extruded material heater and heating process |
JPS494829B1 (de) * | 1964-09-05 | 1974-02-04 | ||
US3606677A (en) * | 1967-12-26 | 1971-09-21 | Rca Corp | Multilayer circuit board techniques |
FR2014790A1 (en) * | 1968-07-31 | 1970-04-17 | Shoe & Allied Trades Res Ass | Thermal treatment for informing the properties of - synthetic polymer material especially microcellulor |
GB1357113A (en) * | 1970-12-22 | 1974-06-19 | Ici Ltd | Aromatic polymers |
US3930963A (en) * | 1971-07-29 | 1976-01-06 | Photocircuits Division Of Kollmorgen Corporation | Method for the production of radiant energy imaged printed circuit boards |
GB1383253A (en) * | 1972-01-25 | 1974-02-12 | Ici Ltd | Shaped articles formed from aromatic polysulphones |
JPS5748874B2 (de) * | 1972-07-11 | 1982-10-19 | ||
JPS5034066A (de) * | 1973-07-26 | 1975-04-02 | ||
DE2364257C2 (de) * | 1973-12-22 | 1975-06-12 | Aeg Isolier- Und Kunststoff-Gmbh, 3500 Kassel | Basismaterial für die Herstellung von gedruckten Schaltungen |
JPS5857205B2 (ja) * | 1976-02-02 | 1983-12-19 | 住友化学工業株式会社 | 半透膜の製造方法 |
DE3012889C2 (de) * | 1979-04-30 | 1984-01-12 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Basismaterial für die Herstellung gedruckter Schaltungen |
-
1981
- 1981-01-12 US US06/223,944 patent/US4339303A/en not_active Expired - Fee Related
- 1981-08-06 ZA ZA815415A patent/ZA815415B/xx unknown
- 1981-09-04 JP JP56141625A patent/JPS57117540A/ja active Granted
- 1981-10-23 CA CA000388614A patent/CA1189019A/en not_active Expired
- 1981-11-12 AU AU77428/81A patent/AU546467B2/en not_active Ceased
- 1981-12-30 IT IT50031/81A patent/IT1172200B/it active
- 1981-12-31 GB GB8139176A patent/GB2094320B/en not_active Expired
-
1982
- 1982-01-05 DE DE19823200301 patent/DE3200301A1/de active Granted
- 1982-01-05 DE DE3249736A patent/DE3249736C2/de not_active Expired
- 1982-01-07 SE SE8200038A patent/SE453582B/sv not_active IP Right Cessation
- 1982-01-11 CH CH130/82A patent/CH656809A5/de not_active IP Right Cessation
- 1982-01-11 AT AT0005482A patent/AT384992B/de not_active IP Right Cessation
- 1982-01-11 DK DK7782A patent/DK7782A/da not_active Application Discontinuation
- 1982-01-11 BE BE0/207033A patent/BE891753A/fr not_active IP Right Cessation
- 1982-01-11 ES ES508632A patent/ES508632A0/es active Granted
- 1982-01-11 NL NL8200082A patent/NL8200082A/nl not_active Application Discontinuation
- 1982-01-11 IL IL64754A patent/IL64754A/xx unknown
- 1982-01-12 FR FR8200345A patent/FR2497813B1/fr not_active Expired
- 1982-02-12 ES ES509563A patent/ES8302402A1/es not_active Expired
-
1987
- 1987-09-10 SE SE8703514A patent/SE8703514L/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CA1189019A (en) | 1985-06-18 |
BE891753A (fr) | 1982-07-12 |
CH656809A5 (de) | 1986-07-31 |
SE8703514D0 (sv) | 1987-09-10 |
SE8703514L (sv) | 1987-09-10 |
US4339303A (en) | 1982-07-13 |
FR2497813A1 (fr) | 1982-07-16 |
SE453582B (sv) | 1988-02-15 |
ES509563A0 (es) | 1983-01-01 |
ES8302401A1 (es) | 1983-02-01 |
AU7742881A (en) | 1982-07-22 |
GB2094320A (en) | 1982-09-15 |
IL64754A (en) | 1986-01-31 |
AT384992B (de) | 1988-02-10 |
NL8200082A (nl) | 1982-08-02 |
IL64754A0 (en) | 1982-03-31 |
FR2497813B1 (fr) | 1986-05-16 |
ES508632A0 (es) | 1983-02-01 |
ATA5482A (de) | 1987-07-15 |
DE3200301A1 (de) | 1982-07-29 |
DE3249736C2 (de) | 1989-04-27 |
AU546467B2 (en) | 1985-09-05 |
IT1172200B (it) | 1987-06-18 |
JPH0114858B2 (de) | 1989-03-14 |
ZA815415B (en) | 1983-02-23 |
GB2094320B (en) | 1985-08-14 |
ES8302402A1 (es) | 1983-01-01 |
DK7782A (da) | 1982-07-13 |
IT8150031A0 (it) | 1981-12-30 |
SE8200038L (sv) | 1982-07-13 |
JPS57117540A (en) | 1982-07-22 |
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