BR8601393A - Metodo para processamento de um substrato flexivel - Google Patents

Metodo para processamento de um substrato flexivel

Info

Publication number
BR8601393A
BR8601393A BR8601393A BR8601393A BR8601393A BR 8601393 A BR8601393 A BR 8601393A BR 8601393 A BR8601393 A BR 8601393A BR 8601393 A BR8601393 A BR 8601393A BR 8601393 A BR8601393 A BR 8601393A
Authority
BR
Brazil
Prior art keywords
processing
flexible substrate
flexible
substrate
Prior art date
Application number
BR8601393A
Other languages
English (en)
Inventor
George T Valaoras
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of BR8601393A publication Critical patent/BR8601393A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
BR8601393A 1985-03-26 1986-03-26 Metodo para processamento de um substrato flexivel BR8601393A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71627285A 1985-03-26 1985-03-26

Publications (1)

Publication Number Publication Date
BR8601393A true BR8601393A (pt) 1986-12-02

Family

ID=24877396

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8601393A BR8601393A (pt) 1985-03-26 1986-03-26 Metodo para processamento de um substrato flexivel

Country Status (5)

Country Link
EP (1) EP0196874A3 (pt)
JP (1) JPS61263726A (pt)
KR (1) KR860007856A (pt)
BR (1) BR8601393A (pt)
FI (1) FI861296A (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6489184B1 (en) 1999-08-04 2002-12-03 Honeywell International Inc. Removing inherent stress via high temperature annealing
JP4073618B2 (ja) * 1999-12-02 2008-04-09 シャープ株式会社 フレキシブル液晶表示パネルの製造方法並びにそれに用いるフレキシブル液晶表示パネルの製造システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339303A (en) * 1981-01-12 1982-07-13 Kollmorgen Technologies Corporation Radiation stress relieving of sulfone polymer articles
JPS5832489A (ja) * 1981-08-20 1983-02-25 日東電工株式会社 印刷回路用ポリエステルフイルム
JPS5874324A (ja) * 1981-10-30 1983-05-04 Toray Ind Inc 二軸延伸ポリエステルフィルムの熱処理方法

Also Published As

Publication number Publication date
EP0196874A2 (en) 1986-10-08
FI861296A (fi) 1986-09-27
JPS61263726A (ja) 1986-11-21
KR860007856A (ko) 1986-10-17
EP0196874A3 (en) 1987-09-16
FI861296A0 (fi) 1986-03-26

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H05K 3/00 (2006.01), H05K 1/03 (2006.0