ES509563A0 - "metodo para preparar un panel de circuito de capas multiples". - Google Patents

"metodo para preparar un panel de circuito de capas multiples".

Info

Publication number
ES509563A0
ES509563A0 ES509563A ES509563A ES509563A0 ES 509563 A0 ES509563 A0 ES 509563A0 ES 509563 A ES509563 A ES 509563A ES 509563 A ES509563 A ES 509563A ES 509563 A0 ES509563 A0 ES 509563A0
Authority
ES
Spain
Prior art keywords
preparing
layer circuit
multiple layer
circuit panel
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES509563A
Other languages
English (en)
Other versions
ES8302402A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of ES509563A0 publication Critical patent/ES509563A0/es
Publication of ES8302402A1 publication Critical patent/ES8302402A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B29C2071/022—Annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B29K2081/06—PSU, i.e. polysulfones; PES, i.e. polyethersulfones or derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ES509563A 1981-01-12 1982-02-12 "metodo para preparar un panel de circuito de capas multiples". Expired ES8302402A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/223,944 US4339303A (en) 1981-01-12 1981-01-12 Radiation stress relieving of sulfone polymer articles

Publications (2)

Publication Number Publication Date
ES509563A0 true ES509563A0 (es) 1983-01-01
ES8302402A1 ES8302402A1 (es) 1983-01-01

Family

ID=22838645

Family Applications (2)

Application Number Title Priority Date Filing Date
ES508632A Granted ES508632A0 (es) 1981-01-12 1982-01-11 Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona.
ES509563A Expired ES8302402A1 (es) 1981-01-12 1982-02-12 "metodo para preparar un panel de circuito de capas multiples".

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES508632A Granted ES508632A0 (es) 1981-01-12 1982-01-11 Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona.

Country Status (17)

Country Link
US (1) US4339303A (es)
JP (1) JPS57117540A (es)
AT (1) AT384992B (es)
AU (1) AU546467B2 (es)
BE (1) BE891753A (es)
CA (1) CA1189019A (es)
CH (1) CH656809A5 (es)
DE (2) DE3249736C2 (es)
DK (1) DK7782A (es)
ES (2) ES508632A0 (es)
FR (1) FR2497813B1 (es)
GB (1) GB2094320B (es)
IL (1) IL64754A (es)
IT (1) IT1172200B (es)
NL (1) NL8200082A (es)
SE (2) SE453582B (es)
ZA (1) ZA815415B (es)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424095A (en) 1981-01-12 1984-01-03 Kollmorgen Technologies Corporation Radiation stress relieving of polymer articles
ZA823981B (en) * 1982-05-21 1983-06-29 Kollmorgen Tech Corp Radiation stress relieving of polymer articles
US4520067A (en) * 1982-06-23 1985-05-28 Union Carbide Corporation Composition useful for making circuit board substrates and electrical connectors
US4861640A (en) * 1982-09-03 1989-08-29 John Fluke Mfg. Co., Inc. Molded circuit board and manufacturing method therefor
US4447471A (en) * 1982-12-30 1984-05-08 Gould Inc. Method of treating thermoplastic surfaces
KR840009026A (ko) * 1983-03-02 1984-12-20 아아르 미첼(외2) 데니스 전기 전도체를 절연 기판에 접착하는 방법
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4585502A (en) * 1984-04-27 1986-04-29 Hitachi Condenser Co., Ltd. Process for producing printed circuit board
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
US4626309A (en) * 1984-07-02 1986-12-02 Motorola, Inc. Selective bonding interconnection mask
US5047114A (en) * 1984-11-02 1991-09-10 Amp-Akzo Corporation Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
EP0196874A3 (en) * 1985-03-26 1987-09-16 Illinois Tool Works Inc. Processing a flexible substrate
DE3515109A1 (de) * 1985-04-26 1986-10-30 Bayer Ag, 5090 Leverkusen Kunststoffteile mit quasi dielektrisch isotropem aufbau
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
US4859805A (en) * 1987-09-19 1989-08-22 Nippon Cmk Corp. Printed wiring board
JPH0798870B2 (ja) * 1987-12-11 1995-10-25 帝人株式会社 高分子の光加工方法
US5017311A (en) * 1988-07-21 1991-05-21 Idemitsu Kosan Co., Ltd. Method for injection molding into a resonating mold
DE4027169C2 (de) * 1989-08-31 1994-05-05 Aisin Seiki Außen-Rückspiegel für ein Kraftfahrzeug
US5259999A (en) * 1990-04-04 1993-11-09 Mitsubishi Gas Chemical Co., Inc. Process for producing resin molded article having diminished residual stress
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
FR2671513B1 (fr) * 1991-01-14 1993-04-23 Sextant Avionique Procede pour rendre etanches des pieces comprenant des inserts metalliques surmoules.
JP2875438B2 (ja) * 1992-09-24 1999-03-31 日本ペイント株式会社 熱可塑性樹脂製品の表面処理方法
GB2279364B (en) * 1993-06-29 1997-03-26 Hitech Pop Limited Sheilding of polymer casings
US5753134A (en) * 1994-01-04 1998-05-19 Siemens Aktiengesellschaft Method for producing a layer with reduced mechanical stresses
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US5489404A (en) * 1994-08-08 1996-02-06 General Electric Company Process for annealing thermoplastics
WO1996005970A1 (en) * 1994-08-25 1996-02-29 Parlex Corporation A printed circuit board and method of manufacture thereof
US5522954A (en) * 1994-09-12 1996-06-04 Ford Motor Company Non-contact bonding of plastics
JP3885280B2 (ja) * 1997-04-25 2007-02-21 東レ株式会社 金属蒸着フィルム、その製造方法及びそれを用いたコンデンサ
US6015520A (en) * 1997-05-15 2000-01-18 International Business Machines Corporation Method for filling holes in printed wiring boards
DE19723854A1 (de) * 1997-06-06 1998-12-10 Hoechst Ag Verfahren zur Herstellung von Lösungen mit Säuregruppen funktionalisierter Polymere durch Mikrowellenbestrahlung
US6557977B1 (en) * 1997-07-15 2003-05-06 Silverbrook Research Pty Ltd Shape memory alloy ink jet printing mechanism
US7527357B2 (en) 1997-07-15 2009-05-05 Silverbrook Research Pty Ltd Inkjet nozzle array with individual feed channel for each nozzle
AUPR245001A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd A method (WSM03)
US6630743B2 (en) * 2001-02-27 2003-10-07 International Business Machines Corporation Copper plated PTH barrels and methods for fabricating
DE10260137B4 (de) * 2002-12-20 2004-11-18 Schroeter, Johannes, Dr. Verfahren zur plastischen Verformung von Polymeren
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法
EP1926587B1 (en) * 2005-09-16 2013-07-31 Covidien LP Method for relaxing stress in polymeric materials
CA2660203A1 (en) * 2006-08-07 2008-02-14 Messier-Bugatti Apparatus for porous material densification
US8172627B2 (en) * 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1065971A (en) * 1964-03-07 1967-04-19 Elliott Electronic Tubes Ltd Extruded material heater and heating process
JPS494829B1 (es) * 1964-09-05 1974-02-04
US3606677A (en) * 1967-12-26 1971-09-21 Rca Corp Multilayer circuit board techniques
FR2014790A1 (en) * 1968-07-31 1970-04-17 Shoe & Allied Trades Res Ass Thermal treatment for informing the properties of - synthetic polymer material especially microcellulor
GB1357113A (en) * 1970-12-22 1974-06-19 Ici Ltd Aromatic polymers
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
GB1383253A (en) * 1972-01-25 1974-02-12 Ici Ltd Shaped articles formed from aromatic polysulphones
JPS5748874B2 (es) * 1972-07-11 1982-10-19
JPS5034066A (es) * 1973-07-26 1975-04-02
DE2364257C2 (de) * 1973-12-22 1975-06-12 Aeg Isolier- Und Kunststoff-Gmbh, 3500 Kassel Basismaterial für die Herstellung von gedruckten Schaltungen
JPS5857205B2 (ja) * 1976-02-02 1983-12-19 住友化学工業株式会社 半透膜の製造方法
DE3012889C2 (de) * 1979-04-30 1984-01-12 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Basismaterial für die Herstellung gedruckter Schaltungen

Also Published As

Publication number Publication date
JPS57117540A (en) 1982-07-22
CA1189019A (en) 1985-06-18
FR2497813A1 (fr) 1982-07-16
AT384992B (de) 1988-02-10
DE3200301C2 (es) 1989-03-23
SE8703514D0 (sv) 1987-09-10
CH656809A5 (de) 1986-07-31
ZA815415B (en) 1983-02-23
IT1172200B (it) 1987-06-18
IT8150031A0 (it) 1981-12-30
BE891753A (fr) 1982-07-12
DE3200301A1 (de) 1982-07-29
FR2497813B1 (fr) 1986-05-16
SE8200038L (sv) 1982-07-13
US4339303A (en) 1982-07-13
ES8302401A1 (es) 1983-02-01
GB2094320B (en) 1985-08-14
AU7742881A (en) 1982-07-22
JPH0114858B2 (es) 1989-03-14
IL64754A (en) 1986-01-31
ATA5482A (de) 1987-07-15
SE8703514L (sv) 1987-09-10
IL64754A0 (en) 1982-03-31
AU546467B2 (en) 1985-09-05
ES8302402A1 (es) 1983-01-01
NL8200082A (nl) 1982-08-02
ES508632A0 (es) 1983-02-01
SE453582B (sv) 1988-02-15
DK7782A (da) 1982-07-13
DE3249736C2 (es) 1989-04-27
GB2094320A (en) 1982-09-15

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