ES533132A0 - Un procedimiento para preparar un panel de circuito impreso - Google Patents

Un procedimiento para preparar un panel de circuito impreso

Info

Publication number
ES533132A0
ES533132A0 ES533132A ES533132A ES533132A0 ES 533132 A0 ES533132 A0 ES 533132A0 ES 533132 A ES533132 A ES 533132A ES 533132 A ES533132 A ES 533132A ES 533132 A0 ES533132 A0 ES 533132A0
Authority
ES
Spain
Prior art keywords
preparing
procedure
printed circuit
circuit panel
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES533132A
Other languages
English (en)
Other versions
ES8608268A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynachem Corp
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23992505&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES533132(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of ES533132A0 publication Critical patent/ES533132A0/es
Publication of ES8608268A1 publication Critical patent/ES8608268A1/es
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/118—Initiator containing with inhibitor or stabilizer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
ES533132A 1983-06-06 1984-06-05 Un procedimiento para preparar un panel de circuito impreso Expired ES8608268A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/501,199 US4539286A (en) 1983-06-06 1983-06-06 Flexible, fast processing, photopolymerizable composition

Publications (2)

Publication Number Publication Date
ES533132A0 true ES533132A0 (es) 1986-06-01
ES8608268A1 ES8608268A1 (es) 1986-06-01

Family

ID=23992505

Family Applications (2)

Application Number Title Priority Date Filing Date
ES533132A Expired ES8608268A1 (es) 1983-06-06 1984-06-05 Un procedimiento para preparar un panel de circuito impreso
ES546967A Expired ES8606775A1 (es) 1983-06-06 1985-09-13 Un procedimiento de mecanizado quimico,aplicable particular-mente a paneles de circuito impreso

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES546967A Expired ES8606775A1 (es) 1983-06-06 1985-09-13 Un procedimiento de mecanizado quimico,aplicable particular-mente a paneles de circuito impreso

Country Status (17)

Country Link
US (1) US4539286A (es)
EP (1) EP0128014B2 (es)
JP (1) JPS6011840A (es)
KR (1) KR870000750B1 (es)
AR (1) AR242045A1 (es)
AT (1) ATE32956T1 (es)
AU (1) AU566653B2 (es)
BR (1) BR8402712A (es)
CA (1) CA1213092A (es)
DE (1) DE3469809D1 (es)
DK (1) DK277284A (es)
ES (2) ES8608268A1 (es)
IL (1) IL72040A (es)
NO (1) NO169923C (es)
NZ (1) NZ208262A (es)
PT (1) PT78695B (es)
ZA (1) ZA843909B (es)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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NZ212161A (en) * 1984-06-08 1988-06-30 Ishikawa Katsukiyo Photo-polymerisable composition and printing plate prepared therefrom
US4876384A (en) * 1985-04-22 1989-10-24 Diamond Shamrock Chemicals Co. Radiation-hardenable diluents
US5110889A (en) * 1985-11-13 1992-05-05 Diamond Shamrock Chemical Co. Radiation hardenable compositions containing low viscosity diluents
DE3540480A1 (de) * 1985-11-15 1987-05-21 Hoechst Ag Durch strahlung polymerisierbares gemisch, daraus hergestelltes aufzeichnungsmaterial und verfahren zur herstellung von reliefaufzeichnungen
AU587876B2 (en) * 1985-11-15 1989-08-31 Hoechst Aktiengesellschaft Radiation-polymerizable mixture, recording material prepared from it and process for the production of relief recordings
DE3706561A1 (de) * 1987-02-28 1988-09-08 Basf Ag Lichtempfindliches aufzeichnungsmaterial mit erhoehter flexibilitaet
US4902605A (en) * 1987-07-24 1990-02-20 Eastman Kodak Company Photoresist composition comprising cyclohexyleneoxyalkyl acrylates
US4885229A (en) * 1987-12-22 1989-12-05 501 Daicel Chemical Industries Ltd. Photopolymerizable compositions
DE3808952A1 (de) * 1988-03-17 1989-10-05 Basf Ag Lichtempfindliche, photopolymerisierbare druckplatte
DE3808951A1 (de) * 1988-03-17 1989-10-05 Basf Ag Photopolymerisierbare, zur herstellung von druckformen geeignete druckplatte
US4819489A (en) * 1988-05-09 1989-04-11 Rca Licensing Corp. Device and method for testing the adherence of a coating layer to a material
US4912019A (en) * 1988-05-31 1990-03-27 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable ceramic coating composition
DE3844451A1 (de) * 1988-12-31 1990-07-05 Basf Ag Photopolymerisierbares system
US4985343A (en) * 1989-02-09 1991-01-15 Mitsubishi Rayon Co., Ltd. Crosslinking-curable resin composition
CA2025198A1 (en) * 1989-10-25 1991-04-26 Daniel F. Varnell Liquid solder mask composition
US5217847A (en) * 1989-10-25 1993-06-08 Hercules Incorporated Liquid solder mask composition
JP2782909B2 (ja) * 1990-04-05 1998-08-06 日本油脂株式会社 光重合性樹脂組成物
US5068168A (en) * 1990-12-20 1991-11-26 Monsanto Company Styrene/maleates terpolymers
CA2076727A1 (en) * 1991-08-30 1993-03-01 Richard T. Mayes Alkaline-etch resistant dry film photoresist
US5332650A (en) * 1991-09-06 1994-07-26 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive composition
JPH07235755A (ja) * 1994-02-25 1995-09-05 Hitachi Ltd プリント配線基板の製法
CA2158915A1 (en) 1994-09-30 1996-03-31 Dekai Loo Liquid photoimageable resist
US6004725A (en) * 1997-12-01 1999-12-21 Morton International, Inc. Photoimageable compositions
US5922509A (en) * 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
KR100485853B1 (ko) * 1999-03-03 2005-04-28 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이를 사용한 감광성 소자, 레지스트패턴의 제조 방법 및 프린트 배선판의 제조 방법
WO2003077035A1 (fr) * 2002-03-12 2003-09-18 Asahi Kasei Kabushiki Kaisha Composition de resine photosensible et utilisation de celle-ci
US7342075B2 (en) * 2002-10-31 2008-03-11 Basf Corporation Carbamate functional addition polymers and method for their preparation
US8236485B2 (en) * 2002-12-20 2012-08-07 Advanced Technology Materials, Inc. Photoresist removal
CN101535900B (zh) * 2006-08-30 2013-09-04 斯蒂茨丁荷兰聚合物学会 一种制备聚合浮雕结构的方法
CN102393604B (zh) * 2006-09-13 2013-06-12 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法
CN102799070B (zh) * 2012-08-27 2014-03-05 珠海市能动科技光学产业有限公司 双层涂布的负性光致抗蚀干膜
JP2018074102A (ja) 2016-11-04 2018-05-10 富士通株式会社 電子装置

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CA750324A (en) * 1967-01-10 R. Celeste Jack Photopolymerizable compositions and elements
CA614181A (en) * 1961-02-07 J. Mcgraw William Photopolymerizable compositions, elements and processes
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BE559609A (es) * 1954-04-05
US2852379A (en) * 1955-05-04 1958-09-16 Eastman Kodak Co Azide resin photolithographic composition
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US3887450A (en) * 1971-02-04 1975-06-03 Dynachem Corp Photopolymerizable compositions containing polymeric binding agents
US3833384A (en) * 1972-04-26 1974-09-03 Eastman Kodak Co Photopolymerizable compositions and elements and uses thereof
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DE2429636C3 (de) * 1973-06-28 1986-05-07 Teijin Ltd., Osaka Lichtempfindliche Harzmasse
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JPS5492723A (en) * 1977-12-30 1979-07-23 Somar Mfg Photosensitive material and use
US4239849A (en) * 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
JPS5633640A (en) * 1979-08-28 1981-04-04 Arai Tokuji Photopolymerizable photosensitive resin composition and photosensitive sheet structure containing layer of such composition

Also Published As

Publication number Publication date
AU2872684A (en) 1984-12-13
BR8402712A (pt) 1985-05-14
NO842237L (no) 1984-12-07
AU566653B2 (en) 1987-10-29
NO169923C (no) 1992-08-19
PT78695A (pt) 1985-01-01
DK277284A (da) 1984-12-07
PT78695B (en) 1986-07-11
EP0128014A2 (en) 1984-12-12
IL72040A (en) 1988-03-31
IL72040A0 (en) 1984-10-31
EP0128014A3 (en) 1985-05-29
KR850000496A (ko) 1985-02-27
KR870000750B1 (ko) 1987-04-13
ES546967A0 (es) 1986-04-16
ZA843909B (en) 1984-12-24
EP0128014B1 (en) 1988-03-09
JPS6011840A (ja) 1985-01-22
ATE32956T1 (de) 1988-03-15
EP0128014B2 (en) 1991-08-21
NZ208262A (en) 1986-10-08
JPH0422508B2 (es) 1992-04-17
DE3469809D1 (en) 1988-04-14
DK277284D0 (da) 1984-06-04
NO169923B (no) 1992-05-11
US4539286A (en) 1985-09-03
CA1213092A (en) 1986-10-21
AR242045A1 (es) 1993-02-26
ES8606775A1 (es) 1986-04-16
ES8608268A1 (es) 1986-06-01

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