BR8507079A - Painel de circuito impresso em multi-camadas - Google Patents

Painel de circuito impresso em multi-camadas

Info

Publication number
BR8507079A
BR8507079A BR8507079A BR8507079A BR8507079A BR 8507079 A BR8507079 A BR 8507079A BR 8507079 A BR8507079 A BR 8507079A BR 8507079 A BR8507079 A BR 8507079A BR 8507079 A BR8507079 A BR 8507079A
Authority
BR
Brazil
Prior art keywords
printed circuit
layer printed
circuit panel
panel
layer
Prior art date
Application number
BR8507079A
Other languages
English (en)
Inventor
Kiyoshi Kuwabara
Mikio Nishihara
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of BR8507079A publication Critical patent/BR8507079A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR8507079A 1984-11-29 1985-11-28 Painel de circuito impresso em multi-camadas BR8507079A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59253561A JPS61131497A (ja) 1984-11-29 1984-11-29 多層プリント基板
PCT/JP1985/000660 WO1986003364A1 (en) 1984-11-29 1985-11-28 Multi-layer substrate for printed circuit

Publications (1)

Publication Number Publication Date
BR8507079A true BR8507079A (pt) 1987-03-31

Family

ID=17253076

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8507079A BR8507079A (pt) 1984-11-29 1985-11-28 Painel de circuito impresso em multi-camadas

Country Status (6)

Country Link
EP (1) EP0203203A4 (pt)
JP (1) JPS61131497A (pt)
KR (1) KR880700616A (pt)
AU (2) AU5193786A (pt)
BR (1) BR8507079A (pt)
WO (1) WO1986003364A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
JPS62239596A (ja) * 1986-04-11 1987-10-20 株式会社日立製作所 配線基板
JPS6310591A (ja) * 1986-07-02 1988-01-18 株式会社日立製作所 論理配線基板
JPH0648906Y2 (ja) * 1988-08-04 1994-12-12 富士通株式会社 多層基板のパターン構造
JP4063796B2 (ja) 2004-06-30 2008-03-19 日本電気株式会社 積層型半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5276680A (en) * 1976-10-26 1977-06-28 Fujitsu Ltd Multiilayer printed board
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS59769Y2 (ja) * 1979-12-21 1984-01-10 富士通株式会社 多層プリント基板
JPS59198747A (ja) * 1983-04-26 1984-11-10 Nec Corp 高密度多層配線基板

Also Published As

Publication number Publication date
EP0203203A4 (en) 1987-08-03
AU2562688A (en) 1989-02-23
KR880700616A (ko) 1988-03-15
WO1986003364A1 (en) 1986-06-05
JPH0226398B2 (pt) 1990-06-08
EP0203203A1 (en) 1986-12-03
JPS61131497A (ja) 1986-06-19
AU5193786A (en) 1986-06-18

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