BR8506566A - Placa de circuito impresso em multi-camadas de alta densidade - Google Patents

Placa de circuito impresso em multi-camadas de alta densidade

Info

Publication number
BR8506566A
BR8506566A BR8506566A BR8506566A BR8506566A BR 8506566 A BR8506566 A BR 8506566A BR 8506566 A BR8506566 A BR 8506566A BR 8506566 A BR8506566 A BR 8506566A BR 8506566 A BR8506566 A BR 8506566A
Authority
BR
Brazil
Prior art keywords
circuit board
printed circuit
high density
layer printed
density multi
Prior art date
Application number
BR8506566A
Other languages
English (en)
Inventor
Kiyoshi Kuwabara
Mikio Nishihara
Kazuhisa Tsunoi
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of BR8506566A publication Critical patent/BR8506566A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
BR8506566A 1984-12-28 1985-12-27 Placa de circuito impresso em multi-camadas de alta densidade BR8506566A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984198910U JPH023631Y2 (pt) 1984-12-28 1984-12-28

Publications (1)

Publication Number Publication Date
BR8506566A true BR8506566A (pt) 1986-09-09

Family

ID=16398979

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8506566A BR8506566A (pt) 1984-12-28 1985-12-27 Placa de circuito impresso em multi-camadas de alta densidade

Country Status (6)

Country Link
US (1) US4675789A (pt)
EP (1) EP0186485B1 (pt)
JP (1) JPH023631Y2 (pt)
AU (1) AU569186B2 (pt)
BR (1) BR8506566A (pt)
DE (1) DE3586532T2 (pt)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US5066831A (en) * 1987-10-23 1991-11-19 Honeywell Inc. Universal semiconductor chip package
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US5159536A (en) * 1988-05-13 1992-10-27 Mupac Corporation Panel board
US4928061A (en) * 1989-03-29 1990-05-22 International Business Machines Corporation Multi-layer printed circuit board
ZA905327B (en) * 1989-07-07 1992-03-25 Sandoz Ltd Sustained release formulations of water soluble peptides
JPH05219729A (ja) * 1992-02-07 1993-08-27 Sony Corp 直流電源装置
US5418689A (en) * 1993-02-01 1995-05-23 International Business Machines Corporation Printed circuit board or card for direct chip attachment and fabrication thereof
JPH06268381A (ja) * 1993-03-11 1994-09-22 Hitachi Ltd 多層配線構造体及びその製造方法
US5641988A (en) * 1993-12-22 1997-06-24 Vlsi Technology, Inc. Multi-layered, integrated circuit package having reduced parasitic noise characteristics
US6191475B1 (en) * 1997-11-26 2001-02-20 Intel Corporation Substrate for reducing electromagnetic interference and enclosure
JP3206561B2 (ja) * 1998-10-01 2001-09-10 日本電気株式会社 多層配線基板
US6184477B1 (en) * 1998-12-02 2001-02-06 Kyocera Corporation Multi-layer circuit substrate having orthogonal grid ground and power planes
JP3368870B2 (ja) * 1999-06-25 2003-01-20 日本電気株式会社 パッケージ基板及びこれを備えた半導体装置
JP3562568B2 (ja) * 1999-07-16 2004-09-08 日本電気株式会社 多層配線基板
US6441313B1 (en) * 1999-11-23 2002-08-27 Sun Microsystems, Inc. Printed circuit board employing lossy power distribution network to reduce power plane resonances
US6335494B1 (en) * 2000-06-23 2002-01-01 International Business Machines Corporation Multiple power distribution for delta-I noise reduction
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
US6734369B1 (en) * 2000-08-31 2004-05-11 International Business Machines Corporation Surface laminar circuit board having pad disposed within a through hole
US6326557B1 (en) 2001-03-06 2001-12-04 Mitac International Corp. Multi-layer circuit board
US6417460B1 (en) * 2001-03-06 2002-07-09 Mitac International Corp. Multi-layer circuit board having signal, ground and power layers
US6489570B2 (en) * 2001-03-06 2002-12-03 Mitac International Corp. Multi-layer circuit board
US6384340B1 (en) * 2001-03-06 2002-05-07 Mitac International Corp. Multi-layer circuit board
US6548858B2 (en) 2001-03-06 2003-04-15 Mitac International Corp. Multi-layer circuit board
JP4034046B2 (ja) * 2001-06-07 2008-01-16 日本碍子株式会社 高精度な貫通孔を有する多層板、及び、回路基板
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20050225955A1 (en) * 2004-04-09 2005-10-13 Hewlett-Packard Development Company, L.P. Multi-layer printed circuit boards
JP4916300B2 (ja) * 2006-12-19 2012-04-11 新光電気工業株式会社 多層配線基板
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519959A (en) * 1966-03-24 1970-07-07 Burroughs Corp Integral electrical power distribution network and component mounting plane
US3680005A (en) * 1966-03-24 1972-07-25 Burroughs Corp Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes
FR1552207A (pt) * 1967-11-22 1969-01-03
US3740678A (en) * 1971-03-19 1973-06-19 Ibm Strip transmission line structures
ZA804558B (en) * 1979-08-18 1981-09-30 Int Computers Ltd Multilayer circuit structures
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package

Also Published As

Publication number Publication date
AU5156285A (en) 1986-07-03
US4675789A (en) 1987-06-23
EP0186485A3 (en) 1988-01-07
AU569186B2 (en) 1988-01-21
EP0186485B1 (en) 1992-08-19
JPS61114879U (pt) 1986-07-19
EP0186485A2 (en) 1986-07-02
DE3586532T2 (de) 1993-01-14
JPH023631Y2 (pt) 1990-01-29
DE3586532D1 (de) 1992-09-24

Similar Documents

Publication Publication Date Title
BR8506566A (pt) Placa de circuito impresso em multi-camadas de alta densidade
ES539843A0 (es) Una disposicion de placa de circuito impreso para componen- tes electronicos
EP0147014A3 (en) Multilayer printed circuit board structure
FR2550905B1 (fr) Carte de circuit imprime
DE3475592D1 (en) Printed circuit board
GB8307142D0 (en) Printed circuit boards
KR900702760A (ko) 인쇄회로기판
GB8500906D0 (en) Printed circuit boards
ES529758A0 (es) Perfeccionamientos en placas de circuitos impresos
GB2183189B (en) Printed circuit boards
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
GB2092830B (en) Multilayer printed circuit board
GB8304280D0 (en) Printed circuit boards
GB2137422B (en) Printed circuit board
GB2202094B (en) Multilayer printed circuit board
BR8507079A (pt) Painel de circuito impresso em multi-camadas
GB2145574B (en) Multi-layer printed circuit boards
GB8326169D0 (en) Printed circuit board
GB2139007B (en) Multi-layer printed circuit board
GB8317952D0 (en) Printed circuit board
GB8518861D0 (en) Testing printed circuit board
GB8511861D0 (en) Printed circuit boards
ES254110Y (es) Nueva placa de circuito impreso
GB8405864D0 (en) Multilayer printed circuit board
BR6301623U (pt) Placa de circuito impresso de uso geral tipo wire-wrap

Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)