DE68916180T2 - Verfahren zur Herstellung von mit Kupfer plattierten Kunststoffartikeln. - Google Patents

Verfahren zur Herstellung von mit Kupfer plattierten Kunststoffartikeln.

Info

Publication number
DE68916180T2
DE68916180T2 DE68916180T DE68916180T DE68916180T2 DE 68916180 T2 DE68916180 T2 DE 68916180T2 DE 68916180 T DE68916180 T DE 68916180T DE 68916180 T DE68916180 T DE 68916180T DE 68916180 T2 DE68916180 T2 DE 68916180T2
Authority
DE
Germany
Prior art keywords
copper
production
plastic articles
clad plastic
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68916180T
Other languages
English (en)
Other versions
DE68916180D1 (de
Inventor
Takamasa C O Mitsubis Kawakami
Rieko C O Mitsubishi Ga Nakano
Kazuhiro C O Mitsubishi G Ando
Ryuji C O Mitsubishi G Fujiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP27939488A external-priority patent/JP2734020B2/ja
Priority claimed from JP1052095A external-priority patent/JP2751335B2/ja
Priority claimed from JP12293689A external-priority patent/JP2745677B2/ja
Priority claimed from JP12293889A external-priority patent/JP2707720B2/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE68916180D1 publication Critical patent/DE68916180D1/de
Publication of DE68916180T2 publication Critical patent/DE68916180T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/927—Polyolefin, e.g. polyethylene, polypropylene
DE68916180T 1988-11-07 1989-11-07 Verfahren zur Herstellung von mit Kupfer plattierten Kunststoffartikeln. Expired - Fee Related DE68916180T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP27939488A JP2734020B2 (ja) 1988-11-07 1988-11-07 銅メッキ樹脂成形品の製造法
JP1052095A JP2751335B2 (ja) 1989-03-06 1989-03-06 銅メッキ樹脂成形品の製造法
JP12293689A JP2745677B2 (ja) 1989-05-18 1989-05-18 銅張基板の製造法
JP12293889A JP2707720B2 (ja) 1989-05-18 1989-05-18 スルーホール基板の製造法

Publications (2)

Publication Number Publication Date
DE68916180D1 DE68916180D1 (de) 1994-07-21
DE68916180T2 true DE68916180T2 (de) 1994-11-17

Family

ID=27462729

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68916180T Expired - Fee Related DE68916180T2 (de) 1988-11-07 1989-11-07 Verfahren zur Herstellung von mit Kupfer plattierten Kunststoffartikeln.

Country Status (4)

Country Link
US (1) US5106462A (de)
EP (1) EP0368231B1 (de)
KR (1) KR0137370B1 (de)
DE (1) DE68916180T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153023A (en) * 1990-12-03 1992-10-06 Xerox Corporation Process for catalysis of electroless metal plating on plastic
EP0508399A2 (de) * 1991-04-08 1992-10-14 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Herstellung von Substraten mit dünner Film-Beschichtung
US5176744A (en) * 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
DE10360046A1 (de) 2003-12-18 2005-07-21 Basf Ag Kupfer(l)formiatkomplexe
US7829793B2 (en) * 2005-09-09 2010-11-09 Magnecomp Corporation Additive disk drive suspension manufacturing using tie layers for vias and product thereof
US8553364B1 (en) 2005-09-09 2013-10-08 Magnecomp Corporation Low impedance, high bandwidth disk drive suspension circuit
JP4936928B2 (ja) * 2006-05-16 2012-05-23 東京エレクトロン株式会社 成膜方法および成膜装置、ならびに記憶媒体
JP5145052B2 (ja) * 2008-01-07 2013-02-13 東京エレクトロン株式会社 成膜方法および成膜装置、ならびに記憶媒体
CH699576A1 (de) * 2008-09-29 2010-03-31 Alstom Technology Ltd Roebelstab für rotierende elektrische maschinen.
US9153449B2 (en) * 2012-03-19 2015-10-06 Lam Research Corporation Electroless gap fill
BR112015000524B1 (pt) * 2012-07-09 2021-03-30 Shikoku Chemicals Corporation Método para formar uma película de cobre e método para fabricar uma placa de fiação
US11236436B2 (en) * 2020-01-23 2022-02-01 Rockwell Collins, Inc. Controlled induced warping of electronic substrates via electroplating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU523963A1 (ru) * 1974-07-05 1976-08-05 Институт Коллоидной Химии И Химии Воды Композици дл получени металлополимерных покрытий
SU621801A1 (ru) * 1976-10-19 1978-07-21 Предприятие П/Я Г-4598 Способ нанесени металлических покрытий
DE3879441T2 (de) * 1987-12-24 1993-09-09 Mitsubishi Gas Chemical Co Verfahren zur herstellung von koerpern mit einem kupferueberzug.

Also Published As

Publication number Publication date
KR900007923A (ko) 1990-06-02
EP0368231A3 (en) 1990-10-31
KR0137370B1 (ko) 1998-04-27
EP0368231B1 (de) 1994-06-15
US5106462A (en) 1992-04-21
EP0368231A2 (de) 1990-05-16
DE68916180D1 (de) 1994-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee