DE2751104A1 - Verfahren zum steuern stromlos arbeitender metallisierungsbaeder - Google Patents

Verfahren zum steuern stromlos arbeitender metallisierungsbaeder

Info

Publication number
DE2751104A1
DE2751104A1 DE19772751104 DE2751104A DE2751104A1 DE 2751104 A1 DE2751104 A1 DE 2751104A1 DE 19772751104 DE19772751104 DE 19772751104 DE 2751104 A DE2751104 A DE 2751104A DE 2751104 A1 DE2751104 A1 DE 2751104A1
Authority
DE
Germany
Prior art keywords
bath
mixed potential
electrode
potential
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19772751104
Other languages
German (de)
English (en)
Inventor
Charles Rowland Funk
John Paul Karas
Rudolph John Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of DE2751104A1 publication Critical patent/DE2751104A1/de
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
DE19772751104 1976-11-22 1977-11-11 Verfahren zum steuern stromlos arbeitender metallisierungsbaeder Ceased DE2751104A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (1)

Publication Number Publication Date
DE2751104A1 true DE2751104A1 (de) 1978-05-24

Family

ID=24991471

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19772751104 Ceased DE2751104A1 (de) 1976-11-22 1977-11-11 Verfahren zum steuern stromlos arbeitender metallisierungsbaeder
DE2759952A Expired DE2759952C2 (de) 1976-11-22 1977-11-11 Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE2759952A Expired DE2759952C2 (de) 1976-11-22 1977-11-11 Verfahren zur Betriebssteuerung eines ohne äußere Stromzufuhr arbeitenden Verkupferungsbades

Country Status (14)

Country Link
JP (1) JPS5365226A (enrdf_load_stackoverflow)
AT (1) AT354213B (enrdf_load_stackoverflow)
AU (1) AU512805B2 (enrdf_load_stackoverflow)
CA (1) CA1112523A (enrdf_load_stackoverflow)
CH (1) CH637995A5 (enrdf_load_stackoverflow)
DE (2) DE2751104A1 (enrdf_load_stackoverflow)
ES (1) ES464266A1 (enrdf_load_stackoverflow)
FR (1) FR2371522A1 (enrdf_load_stackoverflow)
GB (1) GB1588758A (enrdf_load_stackoverflow)
IL (1) IL53298A (enrdf_load_stackoverflow)
IT (1) IT1116376B (enrdf_load_stackoverflow)
NL (1) NL7712683A (enrdf_load_stackoverflow)
SE (1) SE442410B (enrdf_load_stackoverflow)
ZA (1) ZA775495B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4286965A (en) 1979-03-21 1981-09-01 Siemens Aktiengesellschaft Control apparatus for automatically maintaining bath component concentration in an electroless copper plating bath
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (enrdf_load_stackoverflow) * 1987-03-19 1988-09-30
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法
CN120006271B (zh) * 2025-04-18 2025-08-01 南通赛可特电子有限公司 一种化学镀铜溶液的制备参数调控方法及装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Dissertation v. G. Herrmann, 1972, TU Clausthal *
J. electrochem. Soc., 120, 1974, S. 887-888 *
Plating 55, 1968, S. 1161-1167 *
Stromloses Dickvernickeln, 1971, S. 9-10 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286965A (en) 1979-03-21 1981-09-01 Siemens Aktiengesellschaft Control apparatus for automatically maintaining bath component concentration in an electroless copper plating bath
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten

Also Published As

Publication number Publication date
GB1588758A (en) 1981-04-29
FR2371522A1 (fr) 1978-06-16
AT354213B (de) 1979-12-27
DE2759952C2 (de) 1984-03-08
CH637995A5 (en) 1983-08-31
ES464266A1 (es) 1978-08-01
ZA775495B (en) 1978-07-26
CA1112523A (en) 1981-11-17
AU512805B2 (en) 1980-10-30
NL7712683A (nl) 1978-05-24
JPS5365226A (en) 1978-06-10
ATA827777A (de) 1979-05-15
SE7713192L (sv) 1978-05-23
SE442410B (sv) 1985-12-23
FR2371522B1 (enrdf_load_stackoverflow) 1980-02-15
IL53298A (en) 1981-02-27
AU3076077A (en) 1979-05-24
JPS5753857B2 (enrdf_load_stackoverflow) 1982-11-15
IL53298A0 (en) 1978-01-31
IT1116376B (it) 1986-02-10

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