SE442410B - Forfarande for driftsstyrning av ett stromlost arbetande forkoppringbad - Google Patents
Forfarande for driftsstyrning av ett stromlost arbetande forkoppringbadInfo
- Publication number
- SE442410B SE442410B SE7713192A SE7713192A SE442410B SE 442410 B SE442410 B SE 442410B SE 7713192 A SE7713192 A SE 7713192A SE 7713192 A SE7713192 A SE 7713192A SE 442410 B SE442410 B SE 442410B
- Authority
- SE
- Sweden
- Prior art keywords
- copper
- bath
- electrode
- potential
- setpoint
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 21
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 115
- 238000002156 mixing Methods 0.000 claims description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 239000010949 copper Substances 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 54
- 239000011248 coating agent Substances 0.000 claims description 46
- 238000000576 coating method Methods 0.000 claims description 46
- 238000007747 plating Methods 0.000 claims description 32
- 239000003381 stabilizer Substances 0.000 claims description 27
- 239000003638 chemical reducing agent Substances 0.000 claims description 14
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 claims description 12
- 229940075397 calomel Drugs 0.000 claims description 10
- 238000003287 bathing Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 description 79
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- 230000000694 effects Effects 0.000 description 21
- 230000001105 regulatory effect Effects 0.000 description 19
- 238000007792 addition Methods 0.000 description 18
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 14
- 229910001431 copper ion Inorganic materials 0.000 description 13
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 12
- 229910021607 Silver chloride Inorganic materials 0.000 description 11
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 11
- 238000005259 measurement Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 8
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000008139 complexing agent Substances 0.000 description 7
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 230000002269 spontaneous effect Effects 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 235000010265 sodium sulphite Nutrition 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- -1 2-hydroxypropyl Chemical group 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- VIQAOIGVRNWUDN-UHFFFAOYSA-N ethane-1,2-diamine formaldehyde Chemical compound C=O.C(CN)N VIQAOIGVRNWUDN-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- WHNXAQZPEBNFBC-UHFFFAOYSA-K trisodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(2-hydroxyethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].OCCN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O WHNXAQZPEBNFBC-UHFFFAOYSA-K 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- VEMHQNXVHVAHDN-UHFFFAOYSA-J [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O Chemical compound [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VEMHQNXVHVAHDN-UHFFFAOYSA-J 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 238000004769 chrono-potentiometry Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- DGABOMPBVQQCOB-UHFFFAOYSA-L disilver;dichloride Chemical compound [Cl-].[Cl-].[Ag+].[Ag+] DGABOMPBVQQCOB-UHFFFAOYSA-L 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ICMWWNHDUZJFDW-DHODBPELSA-N oxymetholone Chemical compound C([C@@H]1CC2)C(=O)\C(=C/O)C[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@](C)(O)[C@@]2(C)CC1 ICMWWNHDUZJFDW-DHODBPELSA-N 0.000 description 1
- 238000001139 pH measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000005375 photometry Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- ZKTKNAXWCMIKLK-UHFFFAOYSA-M potassium;1,3-benzothiazole-2-thiolate Chemical compound [K+].C1=CC=C2SC([S-])=NC2=C1 ZKTKNAXWCMIKLK-UHFFFAOYSA-M 0.000 description 1
- 230000036647 reaction Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74411076A | 1976-11-22 | 1976-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7713192L SE7713192L (sv) | 1978-05-23 |
| SE442410B true SE442410B (sv) | 1985-12-23 |
Family
ID=24991471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7713192A SE442410B (sv) | 1976-11-22 | 1977-11-22 | Forfarande for driftsstyrning av ett stromlost arbetande forkoppringbad |
Country Status (14)
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953348B2 (ja) * | 1977-12-16 | 1984-12-24 | 株式会社日立製作所 | 化学銅めつき液の主成分自動管理方法並びにその装置 |
| DE2911073C2 (de) | 1979-03-21 | 1984-01-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer |
| US4276323A (en) * | 1979-12-21 | 1981-06-30 | Hitachi, Ltd. | Process for controlling of chemical copper plating solution |
| JPS6096767A (ja) * | 1983-10-31 | 1985-05-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 銅めつき方法 |
| US4707377A (en) * | 1983-10-31 | 1987-11-17 | International Business Machines Corporation | Copper plating |
| JPS61110799A (ja) * | 1984-10-30 | 1986-05-29 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属めつき槽の制御装置 |
| US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| EP0265895B1 (en) * | 1986-10-31 | 1993-02-10 | AMP-AKZO CORPORATION (a Delaware corp.) | Method for electrolessly depositing high quality copper |
| US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
| JPS63149278U (enrdf_load_stackoverflow) * | 1987-03-19 | 1988-09-30 | ||
| DE3718584A1 (de) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten |
| US4842886A (en) * | 1987-11-04 | 1989-06-27 | International Business Machines Corporation | Method for electroless plating |
| AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| GB2225026A (en) * | 1988-11-22 | 1990-05-23 | American Chem & Refining Co | Electroless gold plating composition |
| JP2005206931A (ja) | 2003-12-26 | 2005-08-04 | Sumitomo Electric Ind Ltd | 金属粉末の製造方法 |
| JP5116068B2 (ja) * | 2004-09-07 | 2013-01-09 | Ｊｘ日鉱日石金属株式会社 | 無電解金めっき液の安定化方法 |
| CN120006271B (zh) * | 2025-04-18 | 2025-08-01 | 南通赛可特电子有限公司 | 一种化学镀铜溶液的制备参数调控方法及装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3375178A (en) * | 1964-05-28 | 1968-03-26 | Continental Oil Co | Method of confirming the occurrence of plating in electroless nickel-plating |
| FR1522048A (fr) * | 1966-05-06 | 1968-04-19 | Photocircuits Corp | Dépôt non galvanique de métaux |
| JPS5921386B2 (ja) * | 1976-04-13 | 1984-05-19 | 株式会社東芝 | 無電解メツキのメツキ速度自動制御方法 |
-
1977
- 1977-09-13 ZA ZA00775495A patent/ZA775495B/xx unknown
- 1977-11-03 IL IL53298A patent/IL53298A/xx unknown
- 1977-11-11 DE DE19772751104 patent/DE2751104A1/de not_active Ceased
- 1977-11-11 DE DE2759952A patent/DE2759952C2/de not_active Expired
- 1977-11-17 NL NL7712683A patent/NL7712683A/xx not_active Application Discontinuation
- 1977-11-18 ES ES464266A patent/ES464266A1/es not_active Expired
- 1977-11-18 CA CA291,214A patent/CA1112523A/en not_active Expired
- 1977-11-18 AU AU30760/77A patent/AU512805B2/en not_active Expired
- 1977-11-18 AT AT827777A patent/AT354213B/de not_active IP Right Cessation
- 1977-11-21 CH CH1419677A patent/CH637995A5/de not_active IP Right Cessation
- 1977-11-21 GB GB48323/77A patent/GB1588758A/en not_active Expired
- 1977-11-22 SE SE7713192A patent/SE442410B/sv not_active IP Right Cessation
- 1977-11-22 IT IT51901/77A patent/IT1116376B/it active
- 1977-11-22 FR FR7734995A patent/FR2371522A1/fr active Granted
- 1977-11-22 JP JP14147477A patent/JPS5365226A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB1588758A (en) | 1981-04-29 |
| FR2371522A1 (fr) | 1978-06-16 |
| AT354213B (de) | 1979-12-27 |
| DE2751104A1 (de) | 1978-05-24 |
| DE2759952C2 (de) | 1984-03-08 |
| CH637995A5 (en) | 1983-08-31 |
| ES464266A1 (es) | 1978-08-01 |
| ZA775495B (en) | 1978-07-26 |
| CA1112523A (en) | 1981-11-17 |
| AU512805B2 (en) | 1980-10-30 |
| NL7712683A (nl) | 1978-05-24 |
| JPS5365226A (en) | 1978-06-10 |
| ATA827777A (de) | 1979-05-15 |
| SE7713192L (sv) | 1978-05-23 |
| FR2371522B1 (enrdf_load_stackoverflow) | 1980-02-15 |
| IL53298A (en) | 1981-02-27 |
| AU3076077A (en) | 1979-05-24 |
| JPS5753857B2 (enrdf_load_stackoverflow) | 1982-11-15 |
| IL53298A0 (en) | 1978-01-31 |
| IT1116376B (it) | 1986-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE442410B (sv) | Forfarande for driftsstyrning av ett stromlost arbetande forkoppringbad | |
| Jimenez-Prieto et al. | Analyte pulse perturbation technique: a tool for analytical determinations in far-from-equilibrium dynamic systems | |
| US4324621A (en) | Method and apparatus for controlling the quality of electrolytes | |
| CA1277370C (en) | Method of measuring the effective inhibitor concentration during a deposition of metal from aqueous electrolytes and an apparatus therefor | |
| JPS61199069A (ja) | めっき液濃度自動連続管理装置 | |
| EP0180090A2 (en) | System and method for automatically monitoring and maintaining desired concentrations of metal plating baths | |
| US5393400A (en) | Component sensor for molten metals | |
| US4443301A (en) | Controlling metal electro-deposition using electrolyte containing two polarizing agents | |
| Donahue et al. | A study of the mechanism of the electroless deposition of nickel | |
| EP0253942B1 (en) | Tartrate-containing alloy bath for electroplating brass on steel wires and procedure for employing the same | |
| US3716333A (en) | Process of and apparatus for thermometric analysis | |
| Mishra et al. | Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations | |
| US5200047A (en) | Plating solution automatic control | |
| RU2023058C1 (ru) | Способ управления процессом электролитического получения алюминия в электролизере | |
| EP4144885A1 (en) | Etching method for resin molded article and etching process system for resin molded article | |
| Neshkova et al. | Real-time stoichiometry monitoring of electrodeposited chalcogenide films via coulometry and electrochemical quartz-crystal microgravimetry with hydrodynamic control. Ag2+ δSe case | |
| Rumpel et al. | The anodic dissolution of tin | |
| Kuznetsov et al. | Electrochemical study of the electroless copper plating process | |
| JP2010243200A (ja) | 過酸化水素含有水溶液中の過酸化水素濃度の測定方法 | |
| JPH0331800B2 (enrdf_load_stackoverflow) | ||
| CA1174200A (en) | Method and apparatus for controlling the quality of zinc sulfate electrolyte | |
| Markovic et al. | Electrorefining Process of the Non-Commercial Copper Anodes. Metals 2021, 11, 1187 | |
| KR950013597B1 (ko) | 무전해 도금장치에서의 도금액 자동조절 장치 | |
| JPH04276082A (ja) | 無電解錫、鉛又はそれらの合金めっき浴中の銅イオン濃度の分析方法 | |
| Takeuchi et al. | Electroless gold plating using L-cysteine as reducing agent & its deposition mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7713192-8 Effective date: 19880322 Format of ref document f/p: F |