FR2371522A1 - Procede et appareil pour le controle des solutions de depot par deplacement chimique - Google Patents

Procede et appareil pour le controle des solutions de depot par deplacement chimique

Info

Publication number
FR2371522A1
FR2371522A1 FR7734995A FR7734995A FR2371522A1 FR 2371522 A1 FR2371522 A1 FR 2371522A1 FR 7734995 A FR7734995 A FR 7734995A FR 7734995 A FR7734995 A FR 7734995A FR 2371522 A1 FR2371522 A1 FR 2371522A1
Authority
FR
France
Prior art keywords
control
chemical displacement
bath
mixed potential
deposit solutions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7734995A
Other languages
English (en)
French (fr)
Other versions
FR2371522B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2371522A1 publication Critical patent/FR2371522A1/fr
Application granted granted Critical
Publication of FR2371522B1 publication Critical patent/FR2371522B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
FR7734995A 1976-11-22 1977-11-22 Procede et appareil pour le controle des solutions de depot par deplacement chimique Granted FR2371522A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (2)

Publication Number Publication Date
FR2371522A1 true FR2371522A1 (fr) 1978-06-16
FR2371522B1 FR2371522B1 (enrdf_load_stackoverflow) 1980-02-15

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7734995A Granted FR2371522A1 (fr) 1976-11-22 1977-11-22 Procede et appareil pour le controle des solutions de depot par deplacement chimique

Country Status (14)

Country Link
JP (1) JPS5365226A (enrdf_load_stackoverflow)
AT (1) AT354213B (enrdf_load_stackoverflow)
AU (1) AU512805B2 (enrdf_load_stackoverflow)
CA (1) CA1112523A (enrdf_load_stackoverflow)
CH (1) CH637995A5 (enrdf_load_stackoverflow)
DE (2) DE2751104A1 (enrdf_load_stackoverflow)
ES (1) ES464266A1 (enrdf_load_stackoverflow)
FR (1) FR2371522A1 (enrdf_load_stackoverflow)
GB (1) GB1588758A (enrdf_load_stackoverflow)
IL (1) IL53298A (enrdf_load_stackoverflow)
IT (1) IT1116376B (enrdf_load_stackoverflow)
NL (1) NL7712683A (enrdf_load_stackoverflow)
SE (1) SE442410B (enrdf_load_stackoverflow)
ZA (1) ZA775495B (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144685A1 (en) * 1983-10-31 1985-06-19 International Business Machines Corporation Electroless copper plating process
EP0194530A3 (en) * 1985-03-08 1987-03-25 International Business Machines Corporation Method for controlling the plating rate in an electroless plating process
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
EP0315386A1 (en) * 1987-11-04 1989-05-10 International Business Machines Corporation Method and apparatus for electroless plating

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
DE2911073C2 (de) 1979-03-21 1984-01-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (enrdf_load_stackoverflow) * 1987-03-19 1988-09-30
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法
CN120006271B (zh) * 2025-04-18 2025-08-01 南通赛可特电子有限公司 一种化学镀铜溶液的制备参数调控方法及装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144685A1 (en) * 1983-10-31 1985-06-19 International Business Machines Corporation Electroless copper plating process
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
EP0194530A3 (en) * 1985-03-08 1987-03-25 International Business Machines Corporation Method for controlling the plating rate in an electroless plating process
EP0315386A1 (en) * 1987-11-04 1989-05-10 International Business Machines Corporation Method and apparatus for electroless plating

Also Published As

Publication number Publication date
GB1588758A (en) 1981-04-29
AT354213B (de) 1979-12-27
DE2751104A1 (de) 1978-05-24
DE2759952C2 (de) 1984-03-08
CH637995A5 (en) 1983-08-31
ES464266A1 (es) 1978-08-01
ZA775495B (en) 1978-07-26
CA1112523A (en) 1981-11-17
AU512805B2 (en) 1980-10-30
NL7712683A (nl) 1978-05-24
JPS5365226A (en) 1978-06-10
ATA827777A (de) 1979-05-15
SE7713192L (sv) 1978-05-23
SE442410B (sv) 1985-12-23
FR2371522B1 (enrdf_load_stackoverflow) 1980-02-15
IL53298A (en) 1981-02-27
AU3076077A (en) 1979-05-24
JPS5753857B2 (enrdf_load_stackoverflow) 1982-11-15
IL53298A0 (en) 1978-01-31
IT1116376B (it) 1986-02-10

Similar Documents

Publication Publication Date Title
FR2371522A1 (fr) Procede et appareil pour le controle des solutions de depot par deplacement chimique
BG60260B2 (en) Process and apparatus for metal coating aplication
FR2469443A1 (fr) Compositions pour l'enlevement chimique de depots metalliques a partir d'un substrat, a base d'acide nitrique, d'ion chlorure et d'ion manganeux
FR2436197A1 (fr) Procede et appareil de revetement electrolytique de l'interieur d'un recipient
ES433445A1 (es) Un procedimiento de cobreado o electrolico.
OA05000A (fr) Procédé perfectionné pour l'obtention du cuivre à partir de minéraux cuprifères.
FR2331626A1 (fr) Procede et cathode pour l'electrolyse de chlorure de metaux alcalins
FR2317375A1 (fr) Installation pour le traitement en continu de la surface de pieces metalliques
FR2439825A1 (fr) Procede de traitement continu de toles en acier, notamment pour le decapage chimique
OA04851A (fr) Mesurage continu des paramètres de marche d'une cuve pour électrolyse en bain fondu.
ES436808A1 (es) Metodo de electrochapado de una pieza metalica y equipo parasu realizacion.
BE810719A (fr) Procede d'ecroutage de la surface d'un produit allonge metallique
ES414139A1 (es) Procedimiento para formar revestimientos complejos a base de fosfatos de hierro.
FR2376219A1 (fr) Procede de sensibilisation de surfaces pour un depot chimique de metal
SU1118285A3 (ru) Способ непрерывного производства поверхностно-модифицированного стекла
ES455842A1 (es) Procedimiento de elaboracion de productos metalicos sin de- fectos de superficie, por colada continua centrifuga en una lingotera conductora enfriada.
FR2348728A1 (fr) Procede pour extraire des ions metalliques d'une solution aqueuse
GB1165015A (en) A Process for Cleaning Wire and Like Strip Material.
KR860001395B1 (en) Method for the continuous electrolitic treatment of a metal strip using insoluble horizontal electrodes
ES8304224A1 (es) Un procedimiento para la produccion de depositos de metal de paladio sobre un sustrato.
RO63772A (fr) Procede pour la fabrication des conducteurs electriques en alliages d'alluminium
FR2386619A1 (fr) Procede de formation d'un depot electrolytique de manganese
FR2310425A1 (fr) Procede et appareil de traitement chimique ou electrochimique pour le depot d'un revetement metallique
US2312898A (en) Method of bluing coal
FR2362219A1 (fr) Procede pour la pre-metallisation de surfaces d'acier

Legal Events

Date Code Title Description
ST Notification of lapse