FR2376219A1 - Procede de sensibilisation de surfaces pour un depot chimique de metal - Google Patents

Procede de sensibilisation de surfaces pour un depot chimique de metal

Info

Publication number
FR2376219A1
FR2376219A1 FR7735668A FR7735668A FR2376219A1 FR 2376219 A1 FR2376219 A1 FR 2376219A1 FR 7735668 A FR7735668 A FR 7735668A FR 7735668 A FR7735668 A FR 7735668A FR 2376219 A1 FR2376219 A1 FR 2376219A1
Authority
FR
France
Prior art keywords
metal
ions
acid
sensitizing
sensitization process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7735668A
Other languages
English (en)
Other versions
FR2376219B1 (fr
Inventor
Hans D Kilthau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2376219A1 publication Critical patent/FR2376219A1/fr
Application granted granted Critical
Publication of FR2376219B1 publication Critical patent/FR2376219B1/fr
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Procédé de sensibilisation de surfaces synthétiques pour un dépôt chimique de cuivre. La solution de sensibilisation comporte des ions d'un métal précieux, des ions stanneux en excédent stoéchiométrique et un acide halogénhydrique. Pour obtenir une activité constante lors de l'utilisation de cette solution, on lui ajoute une ou plusieurs fois un composé complexant pour les ions cuivre, de préférence un acide tétra-acétique de diamine éthylène ou un sel de sodium de cet acide. Ce procédé est utilisé pour le placage des panneaux ou des cartes à circuits imprimés.
FR7735668A 1976-12-30 1977-11-21 Procede de sensibilisation de surfaces pour un depot chimique de metal Granted FR2376219A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2659680A DE2659680C2 (de) 1976-12-30 1976-12-30 Verfahren zum Aktivieren von Oberflächen

Publications (2)

Publication Number Publication Date
FR2376219A1 true FR2376219A1 (fr) 1978-07-28
FR2376219B1 FR2376219B1 (fr) 1980-08-22

Family

ID=5997104

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7735668A Granted FR2376219A1 (fr) 1976-12-30 1977-11-21 Procede de sensibilisation de surfaces pour un depot chimique de metal

Country Status (5)

Country Link
US (1) US4153746A (fr)
JP (1) JPS5395132A (fr)
DE (1) DE2659680C2 (fr)
FR (1) FR2376219A1 (fr)
GB (1) GB1580558A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4298636A (en) * 1978-10-12 1981-11-03 Licentia Patent-Verwaltungs-G.M.B.H. Process for activating plastic surfaces for metallization thereof by treatment with a complex forming solution
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4304646A (en) * 1980-10-27 1981-12-08 Enthone, Incorporated Method for selective removal of copper contaminants from activator solutions containing palladium and tin
EP0079975B1 (fr) * 1981-11-20 1989-05-10 LeaRonal, Inc. Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante
EP0109402B1 (fr) * 1982-05-26 1988-06-01 Macdermid, Incorporated Solutions catalytiques permettant d'activer des substrats non conducteurs et procede de placage sans passage de courant electrique
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
GB2249476A (en) * 1990-11-06 1992-05-13 Chung Chin Fu Structure of power-operated toothbrush
GB2253415A (en) * 1991-02-08 1992-09-09 Eid Empresa De Investigacao E Selective process for printed circuit board manufacturing employing noble metal oxide catalyst.
US6261637B1 (en) * 1995-12-15 2001-07-17 Enthone-Omi, Inc. Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
US5843517A (en) * 1997-04-30 1998-12-01 Macdermid, Incorporated Composition and method for selective plating
US6277181B1 (en) * 1999-08-16 2001-08-21 Oliver Sales Company Method to extend the bathlife of alkaline accelerator solutions

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621207A1 (de) * 1967-02-11 1971-06-03 Blasberg Gmbh & Co Kg Friedr Waessrige Loesung und Verfahren zur Aktivierung von dielektrischen Materialien,besonders von Basismaterial fuer gedruckte Schaltungen,zur anschliessenden sogenannten stromlosen Metallabscheidung
FR2239538A1 (fr) * 1973-08-01 1975-02-28 Kollmorgen Corp

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3627558A (en) * 1968-11-27 1971-12-14 Technograph Printed Circuits L Sensitization process for electroless plating
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3650959A (en) * 1970-07-24 1972-03-21 Shipley Co Etchant for cupreous metals
FR2113161A5 (fr) 1970-10-27 1972-06-23 Imasa

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621207A1 (de) * 1967-02-11 1971-06-03 Blasberg Gmbh & Co Kg Friedr Waessrige Loesung und Verfahren zur Aktivierung von dielektrischen Materialien,besonders von Basismaterial fuer gedruckte Schaltungen,zur anschliessenden sogenannten stromlosen Metallabscheidung
FR2239538A1 (fr) * 1973-08-01 1975-02-28 Kollmorgen Corp

Also Published As

Publication number Publication date
GB1580558A (en) 1980-12-03
JPS5543504B2 (fr) 1980-11-06
DE2659680A1 (de) 1978-07-13
FR2376219B1 (fr) 1980-08-22
US4153746A (en) 1979-05-08
DE2659680C2 (de) 1985-01-31
JPS5395132A (en) 1978-08-19

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Legal Events

Date Code Title Description
ST Notification of lapse