FR2376219A1 - Procede de sensibilisation de surfaces pour un depot chimique de metal - Google Patents
Procede de sensibilisation de surfaces pour un depot chimique de metalInfo
- Publication number
- FR2376219A1 FR2376219A1 FR7735668A FR7735668A FR2376219A1 FR 2376219 A1 FR2376219 A1 FR 2376219A1 FR 7735668 A FR7735668 A FR 7735668A FR 7735668 A FR7735668 A FR 7735668A FR 2376219 A1 FR2376219 A1 FR 2376219A1
- Authority
- FR
- France
- Prior art keywords
- metal
- ions
- acid
- sensitizing
- sensitization process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Procédé de sensibilisation de surfaces synthétiques pour un dépôt chimique de cuivre. La solution de sensibilisation comporte des ions d'un métal précieux, des ions stanneux en excédent stoéchiométrique et un acide halogénhydrique. Pour obtenir une activité constante lors de l'utilisation de cette solution, on lui ajoute une ou plusieurs fois un composé complexant pour les ions cuivre, de préférence un acide tétra-acétique de diamine éthylène ou un sel de sodium de cet acide. Ce procédé est utilisé pour le placage des panneaux ou des cartes à circuits imprimés.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2659680A DE2659680C2 (de) | 1976-12-30 | 1976-12-30 | Verfahren zum Aktivieren von Oberflächen |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2376219A1 true FR2376219A1 (fr) | 1978-07-28 |
FR2376219B1 FR2376219B1 (fr) | 1980-08-22 |
Family
ID=5997104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7735668A Granted FR2376219A1 (fr) | 1976-12-30 | 1977-11-21 | Procede de sensibilisation de surfaces pour un depot chimique de metal |
Country Status (5)
Country | Link |
---|---|
US (1) | US4153746A (fr) |
JP (1) | JPS5395132A (fr) |
DE (1) | DE2659680C2 (fr) |
FR (1) | FR2376219A1 (fr) |
GB (1) | GB1580558A (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4298636A (en) * | 1978-10-12 | 1981-11-03 | Licentia Patent-Verwaltungs-G.M.B.H. | Process for activating plastic surfaces for metallization thereof by treatment with a complex forming solution |
US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
US4304646A (en) * | 1980-10-27 | 1981-12-08 | Enthone, Incorporated | Method for selective removal of copper contaminants from activator solutions containing palladium and tin |
EP0079975B1 (fr) * | 1981-11-20 | 1989-05-10 | LeaRonal, Inc. | Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante |
EP0109402B1 (fr) * | 1982-05-26 | 1988-06-01 | Macdermid, Incorporated | Solutions catalytiques permettant d'activer des substrats non conducteurs et procede de placage sans passage de courant electrique |
US4863758A (en) * | 1982-05-26 | 1989-09-05 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
US5405656A (en) * | 1990-04-02 | 1995-04-11 | Nippondenso Co., Ltd. | Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor |
GB2249476A (en) * | 1990-11-06 | 1992-05-13 | Chung Chin Fu | Structure of power-operated toothbrush |
GB2253415A (en) * | 1991-02-08 | 1992-09-09 | Eid Empresa De Investigacao E | Selective process for printed circuit board manufacturing employing noble metal oxide catalyst. |
US6261637B1 (en) * | 1995-12-15 | 2001-07-17 | Enthone-Omi, Inc. | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
US5843517A (en) * | 1997-04-30 | 1998-12-01 | Macdermid, Incorporated | Composition and method for selective plating |
US6277181B1 (en) * | 1999-08-16 | 2001-08-21 | Oliver Sales Company | Method to extend the bathlife of alkaline accelerator solutions |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1621207A1 (de) * | 1967-02-11 | 1971-06-03 | Blasberg Gmbh & Co Kg Friedr | Waessrige Loesung und Verfahren zur Aktivierung von dielektrischen Materialien,besonders von Basismaterial fuer gedruckte Schaltungen,zur anschliessenden sogenannten stromlosen Metallabscheidung |
FR2239538A1 (fr) * | 1973-08-01 | 1975-02-28 | Kollmorgen Corp |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3627558A (en) * | 1968-11-27 | 1971-12-14 | Technograph Printed Circuits L | Sensitization process for electroless plating |
US3672938A (en) * | 1969-02-20 | 1972-06-27 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3650959A (en) * | 1970-07-24 | 1972-03-21 | Shipley Co | Etchant for cupreous metals |
FR2113161A5 (fr) | 1970-10-27 | 1972-06-23 | Imasa |
-
1976
- 1976-12-30 DE DE2659680A patent/DE2659680C2/de not_active Expired
-
1977
- 1977-11-16 GB GB47694/77A patent/GB1580558A/en not_active Expired
- 1977-11-21 FR FR7735668A patent/FR2376219A1/fr active Granted
- 1977-12-16 US US05/861,332 patent/US4153746A/en not_active Expired - Lifetime
- 1977-12-16 JP JP15071577A patent/JPS5395132A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1621207A1 (de) * | 1967-02-11 | 1971-06-03 | Blasberg Gmbh & Co Kg Friedr | Waessrige Loesung und Verfahren zur Aktivierung von dielektrischen Materialien,besonders von Basismaterial fuer gedruckte Schaltungen,zur anschliessenden sogenannten stromlosen Metallabscheidung |
FR2239538A1 (fr) * | 1973-08-01 | 1975-02-28 | Kollmorgen Corp |
Also Published As
Publication number | Publication date |
---|---|
GB1580558A (en) | 1980-12-03 |
JPS5543504B2 (fr) | 1980-11-06 |
DE2659680A1 (de) | 1978-07-13 |
FR2376219B1 (fr) | 1980-08-22 |
US4153746A (en) | 1979-05-08 |
DE2659680C2 (de) | 1985-01-31 |
JPS5395132A (en) | 1978-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |