FR2402015A1 - Nouveau procede de revetement electrolytique en argent - Google Patents

Nouveau procede de revetement electrolytique en argent

Info

Publication number
FR2402015A1
FR2402015A1 FR7824983A FR7824983A FR2402015A1 FR 2402015 A1 FR2402015 A1 FR 2402015A1 FR 7824983 A FR7824983 A FR 7824983A FR 7824983 A FR7824983 A FR 7824983A FR 2402015 A1 FR2402015 A1 FR 2402015A1
Authority
FR
France
Prior art keywords
silver
plating
substrate
new process
silver coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7824983A
Other languages
English (en)
Other versions
FR2402015B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2402015A1 publication Critical patent/FR2402015A1/fr
Application granted granted Critical
Publication of FR2402015B1 publication Critical patent/FR2402015B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/916—Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Procédé de placage d'argent qui comporte une première étape de pré-placage d'un substrat dans une solution aqueuse de pré-placage comprenant 10**-5 à 0,02 mole/1 d'argent et plus de 0,01 mole/1 d'un agent complexant l'argent (ions thiocyaniques) sous une densité de courant substantiellement nulle pour préplaquer une épaisseur suffisante d'argent afin de limiter ou d'empêcher un placage de substitution, et une deuxième étape de placage par électrolyse du substrat préplaqué sous une épaisseur suffisante en fournissant un courant électrique audit substrat dans une solution aqueuse d'argenture à base d'argent, d'ions thiocyaniques et d'un agent améliorateur de pellicule.
FR7824983A 1977-09-02 1978-08-30 Nouveau procede de revetement electrolytique en argent Granted FR2402015A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10488877A JPS5439329A (en) 1977-09-02 1977-09-02 Thiocyanic acid system silver plating solution

Publications (2)

Publication Number Publication Date
FR2402015A1 true FR2402015A1 (fr) 1979-03-30
FR2402015B1 FR2402015B1 (fr) 1982-04-30

Family

ID=14392705

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7824983A Granted FR2402015A1 (fr) 1977-09-02 1978-08-30 Nouveau procede de revetement electrolytique en argent

Country Status (5)

Country Link
US (1) US4177114A (fr)
JP (1) JPS5439329A (fr)
DE (1) DE2834383C2 (fr)
FR (1) FR2402015A1 (fr)
GB (1) GB2003504B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4269671A (en) * 1979-11-05 1981-05-26 Bell Telephone Laboratories, Incorporated Electroplating of silver-palladium alloys and resulting product
JPS57140891A (en) * 1981-02-23 1982-08-31 Sumitomo Electric Ind Ltd Pretreating solution for silver plating
JPH0774475B2 (ja) * 1989-09-20 1995-08-09 株式会社ジャパンエナジー 銀めっきの前処理液
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
JP4806808B2 (ja) * 2005-07-05 2011-11-02 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
CN109371438B (zh) * 2018-12-07 2021-02-05 重庆立道新材料科技有限公司 一种无氰镀银预镀液及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2704553A1 (de) * 1976-02-04 1977-08-11 Hitachi Ltd Silberplattierloesung und plattierverfahren

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3362895A (en) * 1964-11-23 1968-01-09 Sel Rex Corp Electrodeposition of silver
US3984290A (en) * 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2704553A1 (de) * 1976-02-04 1977-08-11 Hitachi Ltd Silberplattierloesung und plattierverfahren

Also Published As

Publication number Publication date
GB2003504B (en) 1982-06-23
GB2003504A (en) 1979-03-14
DE2834383A1 (de) 1979-03-08
FR2402015B1 (fr) 1982-04-30
JPS5439329A (en) 1979-03-26
US4177114A (en) 1979-12-04
DE2834383C2 (de) 1986-08-14

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Legal Events

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