FR1522048A - Dépôt non galvanique de métaux - Google Patents

Dépôt non galvanique de métaux

Info

Publication number
FR1522048A
FR1522048A FR105549A FR105549A FR1522048A FR 1522048 A FR1522048 A FR 1522048A FR 105549 A FR105549 A FR 105549A FR 105549 A FR105549 A FR 105549A FR 1522048 A FR1522048 A FR 1522048A
Authority
FR
France
Prior art keywords
metals
galvanic deposit
galvanic
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR105549A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Priority to FR105549A priority Critical patent/FR1522048A/fr
Application granted granted Critical
Publication of FR1522048A publication Critical patent/FR1522048A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
FR105549A 1966-05-06 1967-05-08 Dépôt non galvanique de métaux Expired FR1522048A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR105549A FR1522048A (fr) 1966-05-06 1967-05-08 Dépôt non galvanique de métaux

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54807166A 1966-05-06 1966-05-06
FR105549A FR1522048A (fr) 1966-05-06 1967-05-08 Dépôt non galvanique de métaux

Publications (1)

Publication Number Publication Date
FR1522048A true FR1522048A (fr) 1968-04-19

Family

ID=26176258

Family Applications (1)

Application Number Title Priority Date Filing Date
FR105549A Expired FR1522048A (fr) 1966-05-06 1967-05-08 Dépôt non galvanique de métaux

Country Status (1)

Country Link
FR (1) FR1522048A (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114453B1 (fr) * 1968-08-13 1976-05-10
FR2371522A1 (fr) * 1976-11-22 1978-06-16 Kollmorgen Tech Corp Procede et appareil pour le controle des solutions de depot par deplacement chimique
FR2489848A1 (fr) * 1980-09-05 1982-03-12 Philips Nv Procede pour la realisation de couches et de configurations en alliages de cuivre, produits ainsi obtenus et solution pour la mise en oeuvre de ce procede
EP0088465A1 (fr) * 1982-03-09 1983-09-14 ALFACHIMICI S.p.A. Mélange stabilisant pour un bain de cuivrage chimique
EP0140575A2 (fr) * 1983-09-28 1985-05-08 C. Uyemura & Co Ltd Bain et procédé pour le dépôt de cuivre sans courant
EP0340649A1 (fr) * 1988-04-29 1989-11-08 AMP-AKZO CORPORATION (a Delaware corp.) Procédé et bain pour effectuer un dépôt chimique de cuivre exempt de fissures

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5114453B1 (fr) * 1968-08-13 1976-05-10
FR2371522A1 (fr) * 1976-11-22 1978-06-16 Kollmorgen Tech Corp Procede et appareil pour le controle des solutions de depot par deplacement chimique
FR2489848A1 (fr) * 1980-09-05 1982-03-12 Philips Nv Procede pour la realisation de couches et de configurations en alliages de cuivre, produits ainsi obtenus et solution pour la mise en oeuvre de ce procede
EP0088465A1 (fr) * 1982-03-09 1983-09-14 ALFACHIMICI S.p.A. Mélange stabilisant pour un bain de cuivrage chimique
EP0140575A2 (fr) * 1983-09-28 1985-05-08 C. Uyemura & Co Ltd Bain et procédé pour le dépôt de cuivre sans courant
EP0140575A3 (en) * 1983-09-28 1985-07-03 C Uyemura & Co Ltd Electroless copper plating bath and method
EP0340649A1 (fr) * 1988-04-29 1989-11-08 AMP-AKZO CORPORATION (a Delaware corp.) Procédé et bain pour effectuer un dépôt chimique de cuivre exempt de fissures

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