ZA775495B - Method and apparatus for control of electroless plating solutions - Google Patents

Method and apparatus for control of electroless plating solutions

Info

Publication number
ZA775495B
ZA775495B ZA00775495A ZA775495A ZA775495B ZA 775495 B ZA775495 B ZA 775495B ZA 00775495 A ZA00775495 A ZA 00775495A ZA 775495 A ZA775495 A ZA 775495A ZA 775495 B ZA775495 B ZA 775495B
Authority
ZA
South Africa
Prior art keywords
control
electroless plating
plating solutions
solutions
electroless
Prior art date
Application number
ZA00775495A
Inventor
C Funk
J Karas
R Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ZA775495B publication Critical patent/ZA775495B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
ZA00775495A 1976-11-22 1977-09-13 Method and apparatus for control of electroless plating solutions ZA775495B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (1)

Publication Number Publication Date
ZA775495B true ZA775495B (en) 1978-07-26

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00775495A ZA775495B (en) 1976-11-22 1977-09-13 Method and apparatus for control of electroless plating solutions

Country Status (14)

Country Link
JP (1) JPS5365226A (en)
AT (1) AT354213B (en)
AU (1) AU512805B2 (en)
CA (1) CA1112523A (en)
CH (1) CH637995A5 (en)
DE (2) DE2759952C2 (en)
ES (1) ES464266A1 (en)
FR (1) FR2371522A1 (en)
GB (1) GB1588758A (en)
IL (1) IL53298A (en)
IT (1) IT1116376B (en)
NL (1) NL7712683A (en)
SE (1) SE442410B (en)
ZA (1) ZA775495B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (en) * 1977-12-16 1984-12-24 株式会社日立製作所 Automatic management method and device for main components of chemical copper plating solution
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS6096767A (en) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Copper plating process
JPS61110799A (en) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Controller of metal plating cell
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
ES2039403T3 (en) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (en) * 1987-03-19 1988-09-30
DE3718584A1 (en) * 1987-06-03 1988-12-15 Norddeutsche Affinerie METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (en) * 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd Method for producing metal powder
JP5116068B2 (en) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 Method for stabilizing electroless gold plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Non-galvanic deposit of metals
JPS5921386B2 (en) * 1976-04-13 1984-05-19 株式会社東芝 Automatic plating speed control method for electroless plating

Also Published As

Publication number Publication date
CA1112523A (en) 1981-11-17
DE2759952C2 (en) 1984-03-08
AU512805B2 (en) 1980-10-30
IL53298A0 (en) 1978-01-31
AU3076077A (en) 1979-05-24
SE7713192L (en) 1978-05-23
FR2371522B1 (en) 1980-02-15
JPS5753857B2 (en) 1982-11-15
FR2371522A1 (en) 1978-06-16
IL53298A (en) 1981-02-27
CH637995A5 (en) 1983-08-31
ES464266A1 (en) 1978-08-01
ATA827777A (en) 1979-05-15
NL7712683A (en) 1978-05-24
GB1588758A (en) 1981-04-29
AT354213B (en) 1979-12-27
JPS5365226A (en) 1978-06-10
IT1116376B (en) 1986-02-10
DE2751104A1 (en) 1978-05-24
SE442410B (en) 1985-12-23

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