ES464266A1 - Method and apparatus for control of electroless plating solutions - Google Patents

Method and apparatus for control of electroless plating solutions

Info

Publication number
ES464266A1
ES464266A1 ES464266A ES464266A ES464266A1 ES 464266 A1 ES464266 A1 ES 464266A1 ES 464266 A ES464266 A ES 464266A ES 464266 A ES464266 A ES 464266A ES 464266 A1 ES464266 A1 ES 464266A1
Authority
ES
Spain
Prior art keywords
control
electroless plating
plating solutions
electrodes
serves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES464266A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of ES464266A1 publication Critical patent/ES464266A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Abstract

A copper-plating bath operating without an external power supply can be controlled automatically by measuring, with the aid of two electrodes, of which one is positioned in bath fluid and serves as the deposition electrode and the other serves as the reference electrode, the mixed potential arising between the electrodes and employing this measurement for controlling and/or regulating one or more bath parameters.
ES464266A 1976-11-22 1977-11-18 Method and apparatus for control of electroless plating solutions Expired ES464266A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (1)

Publication Number Publication Date
ES464266A1 true ES464266A1 (en) 1978-08-01

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
ES464266A Expired ES464266A1 (en) 1976-11-22 1977-11-18 Method and apparatus for control of electroless plating solutions

Country Status (14)

Country Link
JP (1) JPS5365226A (en)
AT (1) AT354213B (en)
AU (1) AU512805B2 (en)
CA (1) CA1112523A (en)
CH (1) CH637995A5 (en)
DE (2) DE2759952C2 (en)
ES (1) ES464266A1 (en)
FR (1) FR2371522A1 (en)
GB (1) GB1588758A (en)
IL (1) IL53298A (en)
IT (1) IT1116376B (en)
NL (1) NL7712683A (en)
SE (1) SE442410B (en)
ZA (1) ZA775495B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (en) * 1977-12-16 1984-12-24 株式会社日立製作所 Automatic management method and device for main components of chemical copper plating solution
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS6096767A (en) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Copper plating process
JPS61110799A (en) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Controller of metal plating cell
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
ES2039403T3 (en) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (en) * 1987-03-19 1988-09-30
DE3718584A1 (en) * 1987-06-03 1988-12-15 Norddeutsche Affinerie METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (en) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd Method for producing metal powder
JP5116068B2 (en) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 Method for stabilizing electroless gold plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Non-galvanic deposit of metals
JPS5921386B2 (en) * 1976-04-13 1984-05-19 株式会社東芝 Automatic plating speed control method for electroless plating

Also Published As

Publication number Publication date
ZA775495B (en) 1978-07-26
JPS5753857B2 (en) 1982-11-15
SE442410B (en) 1985-12-23
FR2371522B1 (en) 1980-02-15
DE2751104A1 (en) 1978-05-24
FR2371522A1 (en) 1978-06-16
AU512805B2 (en) 1980-10-30
DE2759952C2 (en) 1984-03-08
AU3076077A (en) 1979-05-24
NL7712683A (en) 1978-05-24
GB1588758A (en) 1981-04-29
IT1116376B (en) 1986-02-10
SE7713192L (en) 1978-05-23
AT354213B (en) 1979-12-27
CA1112523A (en) 1981-11-17
IL53298A0 (en) 1978-01-31
IL53298A (en) 1981-02-27
JPS5365226A (en) 1978-06-10
CH637995A5 (en) 1983-08-31
ATA827777A (en) 1979-05-15

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