DE2334427A1 - Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren - Google Patents
Baugruppe fuer ein lsi-plaettchen und herstellungsverfahrenInfo
- Publication number
- DE2334427A1 DE2334427A1 DE19732334427 DE2334427A DE2334427A1 DE 2334427 A1 DE2334427 A1 DE 2334427A1 DE 19732334427 DE19732334427 DE 19732334427 DE 2334427 A DE2334427 A DE 2334427A DE 2334427 A1 DE2334427 A1 DE 2334427A1
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- conductor pattern
- conductors
- assembly according
- planar surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27044872A | 1972-07-10 | 1972-07-10 | |
| US348239A US3872583A (en) | 1972-07-10 | 1973-04-05 | LSI chip package and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2334427A1 true DE2334427A1 (de) | 1974-01-31 |
Family
ID=26954305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19732334427 Ceased DE2334427A1 (de) | 1972-07-10 | 1973-07-06 | Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3872583A (enExample) |
| AU (1) | AU468119B2 (enExample) |
| BE (1) | BE801910A (enExample) |
| CA (1) | CA1001324A (enExample) |
| CH (2) | CH590558A5 (enExample) |
| DE (1) | DE2334427A1 (enExample) |
| FR (1) | FR2192376B1 (enExample) |
| GB (2) | GB1443364A (enExample) |
| NL (1) | NL7309189A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3026183A1 (de) * | 1979-07-10 | 1981-02-19 | Nippon Electric Co | Gehaeuse fuer integrierte logikschaltkreise |
| DE3146796A1 (de) * | 1980-11-28 | 1982-06-16 | Western Electric Co., Inc., 10038 New York, N.Y. | "verkapselung fuer ein halbleiterchip mit integrierter schaltung" |
| DE3511722A1 (de) * | 1984-04-02 | 1985-10-03 | Burroughs Corp. (n.d. Ges. des Staates Delaware), Detroit, Mich. | Elektromechanische baugruppe fuer integrierte schaltkreismatrizen |
| US4680075A (en) * | 1986-01-21 | 1987-07-14 | Unisys Corporation | Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1514595A (en) * | 1975-03-03 | 1978-06-14 | Hughes Aircraft Co | Package for hermetically sealing electronic circuits |
| JPS5210678A (en) * | 1975-07-15 | 1977-01-27 | Kyocera Corp | Ic package |
| JPS5756527Y2 (enExample) * | 1977-02-25 | 1982-12-04 | ||
| EP0001890B1 (en) * | 1977-10-12 | 1981-07-22 | The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and | Improvements in or relating to microwave integrated circuit packages |
| DE2857170A1 (de) * | 1977-11-18 | 1980-12-04 | Fujitsu Ltd | Semiconductor device |
| US4285002A (en) * | 1978-01-19 | 1981-08-18 | International Computers Limited | Integrated circuit package |
| US4246697A (en) * | 1978-04-06 | 1981-01-27 | Motorola, Inc. | Method of manufacturing RF power semiconductor package |
| JPS5615059U (enExample) * | 1979-07-11 | 1981-02-09 | ||
| DE3030763A1 (de) * | 1979-08-17 | 1981-03-26 | Amdahl Corp., Sunnyvale, Calif. | Packung fuer eine integrierte schaltung in plaettchenform |
| US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| FR2476960A1 (fr) * | 1980-02-26 | 1981-08-28 | Thomson Csf | Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede |
| WO1981003734A1 (en) * | 1980-06-19 | 1981-12-24 | Digital Equipment Corp | Heat pin integrated circuit packaging |
| US4387388A (en) * | 1980-07-14 | 1983-06-07 | Ncr Corporation | Package and connector receptacle |
| AU87287S (en) | 1982-01-14 | 1983-07-01 | Fujitsu Ltd | Integrated circuit |
| US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
| JPS58186951A (ja) * | 1982-04-24 | 1983-11-01 | Toshiba Corp | 電子部品のパッケ−ジング方法 |
| EP0348017B1 (en) * | 1982-06-30 | 1993-12-15 | Fujitsu Limited | Semiconductor integrated-circuit apparatus |
| US4608592A (en) * | 1982-07-09 | 1986-08-26 | Nec Corporation | Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
| JPS5987893A (ja) * | 1982-11-12 | 1984-05-21 | 株式会社日立製作所 | 配線基板とその製造方法およびそれを用いた半導体装置 |
| US4513355A (en) * | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4631572A (en) * | 1983-09-27 | 1986-12-23 | Trw Inc. | Multiple path signal distribution to large scale integration chips |
| US4716124A (en) * | 1984-06-04 | 1987-12-29 | General Electric Company | Tape automated manufacture of power semiconductor devices |
| US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
| US4758927A (en) * | 1987-01-21 | 1988-07-19 | Tektronix, Inc. | Method of mounting a substrate structure to a circuit board |
| US5008734A (en) * | 1989-12-20 | 1991-04-16 | National Semiconductor Corporation | Stadium-stepped package for an integrated circuit with air dielectric |
| US5371321A (en) * | 1992-07-22 | 1994-12-06 | Vlsi Technology, Inc. | Package structure and method for reducing bond wire inductance |
| US5280413A (en) * | 1992-09-17 | 1994-01-18 | Ceridian Corporation | Hermetically sealed circuit modules having conductive cap anchors |
| US5325268A (en) * | 1993-01-28 | 1994-06-28 | National Semiconductor Corporation | Interconnector for a multi-chip module or package |
| US5465008A (en) * | 1993-10-08 | 1995-11-07 | Stratedge Corporation | Ceramic microelectronics package |
| US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
| US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
| US6172412B1 (en) * | 1993-10-08 | 2001-01-09 | Stratedge Corporation | High frequency microelectronics package |
| US5508888A (en) * | 1994-05-09 | 1996-04-16 | At&T Global Information Solutions Company | Electronic component lead protector |
| US5808875A (en) * | 1996-03-29 | 1998-09-15 | Intel Corporation | Integrated circuit solder-rack interconnect module |
| US6301122B1 (en) * | 1996-06-13 | 2001-10-09 | Matsushita Electric Industrial Co., Ltd. | Radio frequency module with thermally and electrically coupled metal film on insulating substrate |
| CN114407513B (zh) * | 2022-01-06 | 2023-08-01 | Tcl华星光电技术有限公司 | 印刷网及其制备方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863897A (en) * | 1958-05-15 | 1961-03-29 | Gen Electric Co Ltd | Improvements in or relating to rectifier assemblies |
| DE1900539A1 (de) * | 1968-01-10 | 1969-07-17 | Western Electric Co | Leistungsverstaerker |
| DE1956501A1 (de) * | 1968-11-06 | 1970-06-11 | Olivetti & Co Spa | Gehaeuse fuer integrierte Halbleiter-Schaltungen |
| DE1958175A1 (de) * | 1969-03-03 | 1970-09-10 | North American Rockwell | Elektronische Baugruppe |
| DE1949731A1 (de) * | 1969-10-02 | 1971-04-15 | Bbc Brown Boveri & Cie | Halbleiterelement mit kombinierten Loet-Druckkontakten |
| DE1690292B1 (de) * | 1966-07-29 | 1971-06-09 | Texas Instruments Inc | Verfahren zum einbauen einer mit vielen zuleitungen versehenen halbleitervorrichtung und eine nach diesem hergestellte einbauvorric htung |
| DE1764263A1 (de) * | 1968-05-06 | 1971-06-16 | Siemens Ag | Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme |
| US3665592A (en) * | 1970-03-18 | 1972-05-30 | Vernitron Corp | Ceramic package for an integrated circuit |
| DE1904118B2 (de) * | 1968-01-29 | 1972-06-22 | Hitachi, Ltd , Tokio | Elektrodenanschluss fuer ein integriertes halbleiterbauelement |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3549784A (en) * | 1968-02-01 | 1970-12-22 | American Lava Corp | Ceramic-metallic composite substrate |
| US3608197A (en) * | 1968-07-17 | 1971-09-28 | David Lloyd Mcivor | Carpet knife and guide |
| US3566958A (en) * | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
| JPS4810904B1 (enExample) * | 1969-03-12 | 1973-04-09 | ||
| US3566959A (en) * | 1969-07-17 | 1971-03-02 | Controlled Power Corp | Heat sink |
| US3601522A (en) * | 1970-06-18 | 1971-08-24 | American Lava Corp | Composite ceramic package breakaway notch |
| US3683241A (en) * | 1971-03-08 | 1972-08-08 | Communications Transistor Corp | Radio frequency transistor package |
| US3760090A (en) * | 1971-08-19 | 1973-09-18 | Globe Union Inc | Electronic circuit package and method for making same |
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
-
1973
- 1973-04-05 US US348239A patent/US3872583A/en not_active Expired - Lifetime
- 1973-06-15 CA CA174,133A patent/CA1001324A/en not_active Expired
- 1973-06-25 GB GB235576A patent/GB1443364A/en not_active Expired
- 1973-06-25 GB GB2996773A patent/GB1443362A/en not_active Expired
- 1973-07-02 NL NL7309189A patent/NL7309189A/xx not_active Application Discontinuation
- 1973-07-04 BE BE133114A patent/BE801910A/xx not_active IP Right Cessation
- 1973-07-05 FR FR7324750A patent/FR2192376B1/fr not_active Expired
- 1973-07-06 DE DE19732334427 patent/DE2334427A1/de not_active Ceased
- 1973-07-06 CH CH1391476A patent/CH590558A5/xx not_active IP Right Cessation
- 1973-07-06 CH CH988673A patent/CH588770A5/xx not_active IP Right Cessation
- 1973-07-10 AU AU57947/73A patent/AU468119B2/en not_active Expired
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863897A (en) * | 1958-05-15 | 1961-03-29 | Gen Electric Co Ltd | Improvements in or relating to rectifier assemblies |
| DE1690292B1 (de) * | 1966-07-29 | 1971-06-09 | Texas Instruments Inc | Verfahren zum einbauen einer mit vielen zuleitungen versehenen halbleitervorrichtung und eine nach diesem hergestellte einbauvorric htung |
| DE1900539A1 (de) * | 1968-01-10 | 1969-07-17 | Western Electric Co | Leistungsverstaerker |
| DE1904118B2 (de) * | 1968-01-29 | 1972-06-22 | Hitachi, Ltd , Tokio | Elektrodenanschluss fuer ein integriertes halbleiterbauelement |
| DE1764263A1 (de) * | 1968-05-06 | 1971-06-16 | Siemens Ag | Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme |
| DE1956501A1 (de) * | 1968-11-06 | 1970-06-11 | Olivetti & Co Spa | Gehaeuse fuer integrierte Halbleiter-Schaltungen |
| DE1958175A1 (de) * | 1969-03-03 | 1970-09-10 | North American Rockwell | Elektronische Baugruppe |
| DE1949731A1 (de) * | 1969-10-02 | 1971-04-15 | Bbc Brown Boveri & Cie | Halbleiterelement mit kombinierten Loet-Druckkontakten |
| US3665592A (en) * | 1970-03-18 | 1972-05-30 | Vernitron Corp | Ceramic package for an integrated circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3026183A1 (de) * | 1979-07-10 | 1981-02-19 | Nippon Electric Co | Gehaeuse fuer integrierte logikschaltkreise |
| DE3146796A1 (de) * | 1980-11-28 | 1982-06-16 | Western Electric Co., Inc., 10038 New York, N.Y. | "verkapselung fuer ein halbleiterchip mit integrierter schaltung" |
| DE3511722A1 (de) * | 1984-04-02 | 1985-10-03 | Burroughs Corp. (n.d. Ges. des Staates Delaware), Detroit, Mich. | Elektromechanische baugruppe fuer integrierte schaltkreismatrizen |
| US4680075A (en) * | 1986-01-21 | 1987-07-14 | Unisys Corporation | Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2192376A1 (enExample) | 1974-02-08 |
| US3872583A (en) | 1975-03-25 |
| CA1001324A (en) | 1976-12-07 |
| BE801910A (fr) | 1973-11-05 |
| CH590558A5 (enExample) | 1977-08-15 |
| GB1443362A (en) | 1976-07-21 |
| CH588770A5 (enExample) | 1977-06-15 |
| NL7309189A (enExample) | 1974-01-14 |
| FR2192376B1 (enExample) | 1977-10-14 |
| AU468119B2 (en) | 1976-01-08 |
| GB1443364A (en) | 1976-07-21 |
| AU5794773A (en) | 1975-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8131 | Rejection |