GB1443362A - Lsi chip package - Google Patents

Lsi chip package

Info

Publication number
GB1443362A
GB1443362A GB2996773A GB2996773A GB1443362A GB 1443362 A GB1443362 A GB 1443362A GB 2996773 A GB2996773 A GB 2996773A GB 2996773 A GB2996773 A GB 2996773A GB 1443362 A GB1443362 A GB 1443362A
Authority
GB
United Kingdom
Prior art keywords
chip
frame
leads
package
lsi chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2996773A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu IT Holdings Inc
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Publication of GB1443362A publication Critical patent/GB1443362A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W70/635—
    • H10W76/157—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07355—
    • H10W72/075—
    • H10W72/352—
    • H10W72/3524—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5475—
    • H10W72/884—
    • H10W72/926—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2996773A 1972-07-10 1973-06-25 Lsi chip package Expired GB1443362A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27044872A 1972-07-10 1972-07-10
US348239A US3872583A (en) 1972-07-10 1973-04-05 LSI chip package and method

Publications (1)

Publication Number Publication Date
GB1443362A true GB1443362A (en) 1976-07-21

Family

ID=26954305

Family Applications (2)

Application Number Title Priority Date Filing Date
GB2996773A Expired GB1443362A (en) 1972-07-10 1973-06-25 Lsi chip package
GB235576A Expired GB1443364A (en) 1972-07-10 1973-06-25 Method of fabricating an lsi package

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB235576A Expired GB1443364A (en) 1972-07-10 1973-06-25 Method of fabricating an lsi package

Country Status (9)

Country Link
US (1) US3872583A (enExample)
AU (1) AU468119B2 (enExample)
BE (1) BE801910A (enExample)
CA (1) CA1001324A (enExample)
CH (2) CH588770A5 (enExample)
DE (1) DE2334427A1 (enExample)
FR (1) FR2192376B1 (enExample)
GB (2) GB1443362A (enExample)
NL (1) NL7309189A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132411A (en) * 1982-11-12 1984-07-04 Hitachi Ltd Improvements in substrate structures

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1514595A (en) * 1975-03-03 1978-06-14 Hughes Aircraft Co Package for hermetically sealing electronic circuits
JPS5210678A (en) * 1975-07-15 1977-01-27 Kyocera Corp Ic package
JPS5756527Y2 (enExample) * 1977-02-25 1982-12-04
DE2860865D1 (en) * 1977-10-12 1981-10-29 Secr Defence Brit Improvements in or relating to microwave integrated circuit packages
DE2857170A1 (de) * 1977-11-18 1980-12-04 Fujitsu Ltd Semiconductor device
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS5612760A (en) * 1979-07-10 1981-02-07 Nec Corp Multi chip lsi package
JPS5615059U (enExample) * 1979-07-11 1981-02-09
DE3030763A1 (de) * 1979-08-17 1981-03-26 Amdahl Corp., Sunnyvale, Calif. Packung fuer eine integrierte schaltung in plaettchenform
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
EP0054069A1 (en) * 1980-06-19 1982-06-23 Digital Equipment Corporation Heat pin integrated circuit packaging
US4387388A (en) * 1980-07-14 1983-06-07 Ncr Corporation Package and connector receptacle
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
AU87287S (en) 1982-01-14 1983-07-01 Fujitsu Ltd Integrated circuit
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
JPS58186951A (ja) * 1982-04-24 1983-11-01 Toshiba Corp 電子部品のパッケ−ジング方法
EP0348017B1 (en) * 1982-06-30 1993-12-15 Fujitsu Limited Semiconductor integrated-circuit apparatus
US4608592A (en) * 1982-07-09 1986-08-26 Nec Corporation Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage
US4513355A (en) * 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4631572A (en) * 1983-09-27 1986-12-23 Trw Inc. Multiple path signal distribution to large scale integration chips
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
US4716124A (en) * 1984-06-04 1987-12-29 General Electric Company Tape automated manufacture of power semiconductor devices
US4680075A (en) * 1986-01-21 1987-07-14 Unisys Corporation Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity
US4730232A (en) * 1986-06-25 1988-03-08 Westinghouse Electric Corp. High density microelectronic packaging module for high speed chips
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
US5371321A (en) * 1992-07-22 1994-12-06 Vlsi Technology, Inc. Package structure and method for reducing bond wire inductance
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
US5808875A (en) * 1996-03-29 1998-09-15 Intel Corporation Integrated circuit solder-rack interconnect module
US6301122B1 (en) * 1996-06-13 2001-10-09 Matsushita Electric Industrial Co., Ltd. Radio frequency module with thermally and electrically coupled metal film on insulating substrate
CN114407513B (zh) * 2022-01-06 2023-08-01 Tcl华星光电技术有限公司 印刷网及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB863897A (en) * 1958-05-15 1961-03-29 Gen Electric Co Ltd Improvements in or relating to rectifier assemblies
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
JPS5026292Y1 (enExample) * 1968-01-29 1975-08-06
US3549784A (en) * 1968-02-01 1970-12-22 American Lava Corp Ceramic-metallic composite substrate
DE1764263A1 (de) * 1968-05-06 1971-06-16 Siemens Ag Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme
US3608197A (en) * 1968-07-17 1971-09-28 David Lloyd Mcivor Carpet knife and guide
GB1288982A (enExample) * 1968-11-06 1972-09-13
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
JPS4810904B1 (enExample) * 1969-03-12 1973-04-09
US3566959A (en) * 1969-07-17 1971-03-02 Controlled Power Corp Heat sink
DE1949731A1 (de) * 1969-10-02 1971-04-15 Bbc Brown Boveri & Cie Halbleiterelement mit kombinierten Loet-Druckkontakten
US3665592A (en) * 1970-03-18 1972-05-30 Vernitron Corp Ceramic package for an integrated circuit
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132411A (en) * 1982-11-12 1984-07-04 Hitachi Ltd Improvements in substrate structures

Also Published As

Publication number Publication date
GB1443364A (en) 1976-07-21
FR2192376A1 (enExample) 1974-02-08
US3872583A (en) 1975-03-25
NL7309189A (enExample) 1974-01-14
DE2334427A1 (de) 1974-01-31
CH588770A5 (enExample) 1977-06-15
CH590558A5 (enExample) 1977-08-15
AU5794773A (en) 1975-01-16
BE801910A (fr) 1973-11-05
AU468119B2 (en) 1976-01-08
CA1001324A (en) 1976-12-07
FR2192376B1 (enExample) 1977-10-14

Similar Documents

Publication Publication Date Title
GB1443362A (en) Lsi chip package
GB1001171A (en) Semiconductor devices
KR850004174A (ko) 반도체장치
GB1138401A (en) Bonding
GB1165609A (en) Lead Frame Package for Semiconductor Devices and Method for Making Same.
IE830584L (en) Dense mounting of semiconductor chip packages
US4115837A (en) LSI Chip package and method
GB1062985A (en) Semiconductor package
GB1499358A (en) Integrated circuit packages and method of manufacturing same
GB1288982A (enExample)
GB1383297A (en) Electrical integrated circuit package
JPS5553446A (en) Container of electronic component
GB1463023A (en) Hermetically sealed package including an integrated circuit
DE3777856D1 (de) Hermetische, mikroelektronische hochfrequenzpackung fuer oberflaechenmontage.
US5206460A (en) Oscillator package
GB1296744A (enExample)
GB1362730A (en) Microwave hermetic transistor package
GB1293710A (en) Improvements in and relating to substrate connections
US3662086A (en) Semiconductor package
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
GB1247378A (en) Semiconductor devices
GB1280610A (en) Improvements in or relating to semiconductor components
GB1401655A (en) Beam lead devices
JPS55110049A (en) Semiconductor device
GB1199849A (en) Improvements in and relating to Contact Bonding and Lead Attachment of an Electrical Device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19930624