DE2244434C3 - Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen - Google Patents

Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen

Info

Publication number
DE2244434C3
DE2244434C3 DE2244434A DE2244434A DE2244434C3 DE 2244434 C3 DE2244434 C3 DE 2244434C3 DE 2244434 A DE2244434 A DE 2244434A DE 2244434 A DE2244434 A DE 2244434A DE 2244434 C3 DE2244434 C3 DE 2244434C3
Authority
DE
Germany
Prior art keywords
liter
gold
bath
content
gloss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2244434A
Other languages
German (de)
English (en)
Other versions
DE2244434B2 (de
DE2244434A1 (de
Inventor
Rolf Dipl.-Chem. Dr. 1000 Berlin Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE2244434A priority Critical patent/DE2244434C3/de
Priority to DD172375A priority patent/DD106060A5/xx
Priority to GB3824873A priority patent/GB1438521A/en
Priority to CH1182673A priority patent/CH594746A5/xx
Priority to FR7331051A priority patent/FR2197997B1/fr
Priority to AU59770/73A priority patent/AU469094B2/en
Priority to US394959A priority patent/US3878066A/en
Priority to IT28551/73A priority patent/IT995275B/it
Priority to IE1571/73A priority patent/IE38198B1/xx
Priority to SU1959161A priority patent/SU549089A3/ru
Priority to SE7312093A priority patent/SE387372B/xx
Priority to AT770573A priority patent/AT322935B/de
Priority to NL7312310A priority patent/NL7312310A/xx
Priority to BE135388A priority patent/BE804544A/xx
Priority to CA180,445A priority patent/CA1019276A/en
Priority to JP10071973A priority patent/JPS5421820B2/ja
Priority to ZA737128*A priority patent/ZA737128B/xx
Publication of DE2244434A1 publication Critical patent/DE2244434A1/de
Publication of DE2244434B2 publication Critical patent/DE2244434B2/de
Application granted granted Critical
Publication of DE2244434C3 publication Critical patent/DE2244434C3/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)
DE2244434A 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen Expired DE2244434C3 (de)

Priority Applications (17)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (de) 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
DD172375A DD106060A5 (US20020095090A1-20020718-M00002.png) 1972-09-06 1973-07-19
GB3824873A GB1438521A (en) 1972-09-06 1973-08-13 Electrolytes for the electrodeposition of gold and gold alloys
CH1182673A CH594746A5 (US20020095090A1-20020718-M00002.png) 1972-09-06 1973-08-16
FR7331051A FR2197997B1 (US20020095090A1-20020718-M00002.png) 1972-09-06 1973-08-28
US394959A US3878066A (en) 1972-09-06 1973-08-29 Bath for galvanic deposition of gold and gold alloys
AU59770/73A AU469094B2 (en) 1972-09-06 1973-08-29 Gold electrolytes forthe deposition of gold and gold alloys
IE1571/73A IE38198B1 (en) 1972-09-06 1973-09-04 Electrolytes for the electrodeposition of gold and gold alloys
IT28551/73A IT995275B (it) 1972-09-06 1973-09-04 Bagno per la deposizione galvanica di oro e leghe di oro
SE7312093A SE387372B (sv) 1972-09-06 1973-09-05 Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar
AT770573A AT322935B (de) 1972-09-06 1973-09-05 Bad zur galvanischen abscheidung von gold und goldlegeierungen
SU1959161A SU549089A3 (ru) 1972-09-06 1973-09-05 Электролит дл осаждени покрытий на основе золота
BE135388A BE804544A (fr) 1972-09-06 1973-09-06 Bain pour le depot galvanique d'or et d'alliages d'or
NL7312310A NL7312310A (US20020095090A1-20020718-M00002.png) 1972-09-06 1973-09-06
CA180,445A CA1019276A (en) 1972-09-06 1973-09-06 Gold electrolytes for the deposition of gold and gold alloys
JP10071973A JPS5421820B2 (US20020095090A1-20020718-M00002.png) 1972-09-06 1973-09-06
ZA737128*A ZA737128B (en) 1972-09-06 1973-09-06 Gold electrolytes for the deposition of gold and gold alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (de) 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen

Publications (3)

Publication Number Publication Date
DE2244434A1 DE2244434A1 (de) 1974-03-21
DE2244434B2 DE2244434B2 (de) 1981-02-19
DE2244434C3 true DE2244434C3 (de) 1982-02-25

Family

ID=5855965

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2244434A Expired DE2244434C3 (de) 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen

Country Status (17)

Country Link
US (1) US3878066A (US20020095090A1-20020718-M00002.png)
JP (1) JPS5421820B2 (US20020095090A1-20020718-M00002.png)
AT (1) AT322935B (US20020095090A1-20020718-M00002.png)
AU (1) AU469094B2 (US20020095090A1-20020718-M00002.png)
BE (1) BE804544A (US20020095090A1-20020718-M00002.png)
CA (1) CA1019276A (US20020095090A1-20020718-M00002.png)
CH (1) CH594746A5 (US20020095090A1-20020718-M00002.png)
DD (1) DD106060A5 (US20020095090A1-20020718-M00002.png)
DE (1) DE2244434C3 (US20020095090A1-20020718-M00002.png)
FR (1) FR2197997B1 (US20020095090A1-20020718-M00002.png)
GB (1) GB1438521A (US20020095090A1-20020718-M00002.png)
IE (1) IE38198B1 (US20020095090A1-20020718-M00002.png)
IT (1) IT995275B (US20020095090A1-20020718-M00002.png)
NL (1) NL7312310A (US20020095090A1-20020718-M00002.png)
SE (1) SE387372B (US20020095090A1-20020718-M00002.png)
SU (1) SU549089A3 (US20020095090A1-20020718-M00002.png)
ZA (1) ZA737128B (US20020095090A1-20020718-M00002.png)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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CH606502A5 (US20020095090A1-20020718-M00002.png) * 1974-11-15 1978-10-31 Oxy Metal Industries Corp
US4207149A (en) * 1974-12-04 1980-06-10 Engelhard Minerals & Chemicals Corporation Gold electroplating solutions and processes
CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
DE2800817C2 (de) * 1978-01-10 1982-11-04 Oxy Metal Industries Corp., 48089 Warren, Mich. Aldehydfreies wässriges Bad für die galvanische Abscheidung von Gold und dessen Legierungen sowie ein Verfahren zur Herstellung von Gold- und Goldlegierungsabscheidungen unter Verwendung dieses Bades
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
WO2000005747A2 (en) * 1998-06-30 2000-02-03 Semitool, Inc. Metallization structures for microelectronic applications and process for forming the structures
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
JP5707912B2 (ja) * 2010-12-08 2015-04-30 東ソー株式会社 Ｎ−（ジヒドロキシアルキル）ジエチレントリアミン類の組成物、及びそれを用いた２−ヒドロキシ（アルキル）トリエチレンジアミン類の製造方
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
JP5687667B2 (ja) * 2012-08-21 2015-03-18 日本エレクトロプレイテイング・エンジニヤース株式会社 シアン系金−パラジウム合金めっき液及びめっき方法
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

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US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations
US3791941A (en) * 1972-10-13 1974-02-12 Auric Corp Gold plating bath for barrel plating operations

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT

Also Published As

Publication number Publication date
NL7312310A (US20020095090A1-20020718-M00002.png) 1974-03-08
IT995275B (it) 1975-11-10
DE2244434B2 (de) 1981-02-19
AT322935B (de) 1975-06-10
DD106060A5 (US20020095090A1-20020718-M00002.png) 1974-05-20
SE387372B (sv) 1976-09-06
AU5977073A (en) 1975-03-06
DE2244434A1 (de) 1974-03-21
CH594746A5 (US20020095090A1-20020718-M00002.png) 1978-01-31
JPS5421820B2 (US20020095090A1-20020718-M00002.png) 1979-08-02
ZA737128B (en) 1974-08-28
IE38198L (en) 1974-03-06
BE804544A (fr) 1974-03-06
IE38198B1 (en) 1978-01-18
JPS4967842A (US20020095090A1-20020718-M00002.png) 1974-07-01
FR2197997B1 (US20020095090A1-20020718-M00002.png) 1976-11-19
CA1019276A (en) 1977-10-18
US3878066A (en) 1975-04-15
AU469094B2 (en) 1976-02-05
SU549089A3 (ru) 1977-02-28
FR2197997A1 (US20020095090A1-20020718-M00002.png) 1974-03-29
GB1438521A (en) 1976-06-09

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Legal Events

Date Code Title Description
OD Request for examination
C3 Grant after two publication steps (3rd publication)