SE387372B - Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar - Google Patents

Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar

Info

Publication number
SE387372B
SE387372B SE7312093A SE7312093A SE387372B SE 387372 B SE387372 B SE 387372B SE 7312093 A SE7312093 A SE 7312093A SE 7312093 A SE7312093 A SE 7312093A SE 387372 B SE387372 B SE 387372B
Authority
SE
Sweden
Prior art keywords
gold
galvic
aquatic
alloys
precipitation
Prior art date
Application number
SE7312093A
Other languages
English (en)
Swedish (sv)
Inventor
M Dettke
K-H Fuchs
R Ludwig
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE387372B publication Critical patent/SE387372B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
SE7312093A 1972-09-06 1973-09-05 Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar SE387372B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (de) 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen

Publications (1)

Publication Number Publication Date
SE387372B true SE387372B (sv) 1976-09-06

Family

ID=5855965

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7312093A SE387372B (sv) 1972-09-06 1973-09-05 Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar

Country Status (17)

Country Link
US (1) US3878066A (xx)
JP (1) JPS5421820B2 (xx)
AT (1) AT322935B (xx)
AU (1) AU469094B2 (xx)
BE (1) BE804544A (xx)
CA (1) CA1019276A (xx)
CH (1) CH594746A5 (xx)
DD (1) DD106060A5 (xx)
DE (1) DE2244434C3 (xx)
FR (1) FR2197997B1 (xx)
GB (1) GB1438521A (xx)
IE (1) IE38198B1 (xx)
IT (1) IT995275B (xx)
NL (1) NL7312310A (xx)
SE (1) SE387372B (xx)
SU (1) SU549089A3 (xx)
ZA (1) ZA737128B (xx)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH606502A5 (xx) * 1974-11-15 1978-10-31 Oxy Metal Industries Corp
US4207149A (en) * 1974-12-04 1980-06-10 Engelhard Minerals & Chemicals Corporation Gold electroplating solutions and processes
CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
DE2800817C2 (de) * 1978-01-10 1982-11-04 Oxy Metal Industries Corp., 48089 Warren, Mich. Aldehydfreies wässriges Bad für die galvanische Abscheidung von Gold und dessen Legierungen sowie ein Verfahren zur Herstellung von Gold- und Goldlegierungsabscheidungen unter Verwendung dieses Bades
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
EP1112125B1 (en) * 1998-06-30 2006-01-25 Semitool, Inc. Metallization structures for microelectronic applications and process for forming the structures
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
TW483950B (en) 1998-12-31 2002-04-21 Semitool Inc Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
JP2005501180A (ja) 2001-08-31 2005-01-13 セミトゥール・インコーポレイテッド 超小型電子ワークピースの電気化学処理のための装置及び方法
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
JP5707912B2 (ja) * 2010-12-08 2015-04-30 東ソー株式会社 Ｎ−（ジヒドロキシアルキル）ジエチレントリアミン類の組成物、及びそれを用いた２−ヒドロキシ（アルキル）トリエチレンジアミン類の製造方
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
JP5687667B2 (ja) * 2012-08-21 2015-03-18 日本エレクトロプレイテイング・エンジニヤース株式会社 シアン系金−パラジウム合金めっき液及びめっき方法
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations
US3791941A (en) * 1972-10-13 1974-02-12 Auric Corp Gold plating bath for barrel plating operations

Also Published As

Publication number Publication date
DE2244434C3 (de) 1982-02-25
AU469094B2 (en) 1976-02-05
DE2244434B2 (de) 1981-02-19
JPS5421820B2 (xx) 1979-08-02
ZA737128B (en) 1974-08-28
CH594746A5 (xx) 1978-01-31
US3878066A (en) 1975-04-15
FR2197997A1 (xx) 1974-03-29
IT995275B (it) 1975-11-10
IE38198L (en) 1974-03-06
IE38198B1 (en) 1978-01-18
DE2244434A1 (de) 1974-03-21
JPS4967842A (xx) 1974-07-01
GB1438521A (en) 1976-06-09
FR2197997B1 (xx) 1976-11-19
SU549089A3 (ru) 1977-02-28
DD106060A5 (xx) 1974-05-20
NL7312310A (xx) 1974-03-08
BE804544A (fr) 1974-03-06
CA1019276A (en) 1977-10-18
AT322935B (de) 1975-06-10
AU5977073A (en) 1975-03-06

Similar Documents

Publication Publication Date Title
SE387372B (sv) Vattenhaltigt guldbad for galvisk utfellning av guld och dess legeringar
SE400575B (sv) Bad for betning av koppar och dess legeringar
SE400581B (sv) Bad for kemisk polering av koppar och dess legeringar
IT994135B (it) Bagno al solfito per l elettrodero sizione di oro e procedimento di elettrodeposizione
SE402604B (sv) Forfarande for bearbetning av legeringar av koppar-nickel-tenn
SE408437B (sv) Sett och bad for galvanisk utfellning av edelmetall-legeringar
CH520781A (fr) Procédé et dispositif d'élaboration de métaux ou alliages
SE411716B (sv) Forfarande for framstellning av strengpressade foremal av metallpulver med kernelement och anordning for dess genomforande
SE382042B (sv) Sett att framstella metalliskt kisel och kiselhaltiga legeringar
SE397281B (sv) Forfarande och anordning for framstellning av rorformiga metallforemal medelst elektroslaggomsmeltning
SE385715B (sv) Vattenbad for elektrolytisk avskiljning av guld och guldlegeringar
SE393821B (sv) Sett for galvanisk utfellning av guldlegeringsoverdrag
SE408436B (sv) Sett och bad for galvanisk utfellning av guld
IT981033B (it) Coloranti complessi di metalli
FR2275562A1 (fr) Alliages metalliques consistant en or et en argent
IT974464B (it) Utilizzazione di ferroleghe complesse
SE400171B (sv) Anordning for avkenning och bearbetning av fysiologiska metsignaler
FI61322C (fi) Foerfarande foer separering och rening av platinametaller och guld
SE388439B (sv) Karbid-metallmaterial och forfarande for dess framstellning
SE7511132L (sv) Kopparlegering och behandling derav
BE834168A (fr) Procede pour la preparation de polycarbonates aliphatiques et de copolycarbonates aliphaticoaromatiques
AT324794B (de) Galvanische abscheidung von goldlegierungen
FR1509815A (fr) Procédé de coulée d'alliages de ferro-silicium-magnésium
IT1002432B (it) Metodo di produzione di leghe contenente cromo
TR17514A (tr) Metanin oksiklorlanmasi