GB1438521A - Electrolytes for the electrodeposition of gold and gold alloys - Google Patents

Electrolytes for the electrodeposition of gold and gold alloys

Info

Publication number
GB1438521A
GB1438521A GB3824873A GB3824873A GB1438521A GB 1438521 A GB1438521 A GB 1438521A GB 3824873 A GB3824873 A GB 3824873A GB 3824873 A GB3824873 A GB 3824873A GB 1438521 A GB1438521 A GB 1438521A
Authority
GB
United Kingdom
Prior art keywords
gold
alloys
electro
deposition
chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3824873A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB1438521A publication Critical patent/GB1438521A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)

Abstract

1438521 Electro-deposition of gold and gold alloys SCHERING AG 13 Aug 1973 [6 Sept 1972] 38248/73 Heading C7B Electrolyte for the electro-deposition of gold or gold alloys comprises (a) gold, e.g. as potassium dicyanoaurate, (b) an aldehyde, e.g. formaldehyde, acetaldehyde or glyoxal, (c) an amino compound of the Formula R" 2 N-(R'-NR")m-(R')n-NR" 2 in which R" = hydrogen, alkyl, hydroxy alkyl or aryl group, R' = alkylene group and m and n = 0-3, e.g. hydrazine, methyl-, propyl- or phenylhydrazine or an ethylene amine or a salt thereof, e.g. chloride or acetate; and (d) an alkali metal, e.g. Na or K, arsenite or arsenate, The bath may also contain boric acid; alcohol, e.g. ethylene glycol; a conductive salt, e.g. ammonium or alkali metal sulphate, nitrate or chloride; a buffer; a surfaceactive agent; and alloying material one or more of Ag, Cu, Zn, Cd, Mn, Co, Ni, Pd, In, Sb and Sn.
GB3824873A 1972-09-06 1973-08-13 Electrolytes for the electrodeposition of gold and gold alloys Expired GB1438521A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (en) 1972-09-06 1972-09-06 Aqueous bath for the galvanic deposition of gold and gold alloys

Publications (1)

Publication Number Publication Date
GB1438521A true GB1438521A (en) 1976-06-09

Family

ID=5855965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3824873A Expired GB1438521A (en) 1972-09-06 1973-08-13 Electrolytes for the electrodeposition of gold and gold alloys

Country Status (17)

Country Link
US (1) US3878066A (en)
JP (1) JPS5421820B2 (en)
AT (1) AT322935B (en)
AU (1) AU469094B2 (en)
BE (1) BE804544A (en)
CA (1) CA1019276A (en)
CH (1) CH594746A5 (en)
DD (1) DD106060A5 (en)
DE (1) DE2244434C3 (en)
FR (1) FR2197997B1 (en)
GB (1) GB1438521A (en)
IE (1) IE38198B1 (en)
IT (1) IT995275B (en)
NL (1) NL7312310A (en)
SE (1) SE387372B (en)
SU (1) SU549089A3 (en)
ZA (1) ZA737128B (en)

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CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
DE2800817C2 (en) * 1978-01-10 1982-11-04 Oxy Metal Industries Corp., 48089 Warren, Mich. Aldehyde-free aqueous bath for the electrodeposition of gold and its alloys and a process for the production of gold and gold alloy deposits using this bath
DE3020765A1 (en) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
DE69929607T2 (en) 1998-06-30 2006-07-27 Semitool, Inc., Kalispell METALIZATION STRUCTURES FOR MICROELECTRONIC APPLICATIONS AND METHOD FOR PRODUCING THESE STRUCTURES
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
EP1192298A4 (en) 1999-04-13 2006-08-23 Semitool Inc System for electrochemically processing a workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
FR2828889B1 (en) * 2001-08-24 2004-05-07 Engelhard Clal Sas ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS
EP1481114A4 (en) 2001-08-31 2005-06-22 Semitool Inc Apparatus and methods for electrochemical processing of microelectronic workpieces
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
CH714243B1 (en) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Electroforming process and part or layer obtained by this method.
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
CH710184B1 (en) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
JP5707912B2 (en) * 2010-12-08 2015-04-30 東ソー株式会社 Composition of N- (dihydroxyalkyl) diethylenetriamines and method for producing 2-hydroxy (alkyl) triethylenediamines using the same
ITFI20120103A1 (en) * 2012-06-01 2013-12-02 Bluclad Srl GALVANIC BATHROOMS FOR THE ACHIEVEMENT OF A LEAGUE OF LOW-CARATHED GOLD AND GALVANIC PROCESS THAT USES THESE BATHROOMS.
JP5687667B2 (en) * 2012-08-21 2015-03-18 日本エレクトロプレイテイング・エンジニヤース株式会社 Cyanide gold-palladium alloy plating solution and plating method
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

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Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations
US3791941A (en) * 1972-10-13 1974-02-12 Auric Corp Gold plating bath for barrel plating operations

Also Published As

Publication number Publication date
DE2244434A1 (en) 1974-03-21
AU469094B2 (en) 1976-02-05
FR2197997B1 (en) 1976-11-19
BE804544A (en) 1974-03-06
DD106060A5 (en) 1974-05-20
AT322935B (en) 1975-06-10
US3878066A (en) 1975-04-15
IE38198L (en) 1974-03-06
NL7312310A (en) 1974-03-08
CA1019276A (en) 1977-10-18
FR2197997A1 (en) 1974-03-29
JPS4967842A (en) 1974-07-01
ZA737128B (en) 1974-08-28
AU5977073A (en) 1975-03-06
SU549089A3 (en) 1977-02-28
IE38198B1 (en) 1978-01-18
JPS5421820B2 (en) 1979-08-02
DE2244434C3 (en) 1982-02-25
CH594746A5 (en) 1978-01-31
IT995275B (en) 1975-11-10
SE387372B (en) 1976-09-06
DE2244434B2 (en) 1981-02-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19930812