IE38198L - Gold electrolyte - Google Patents
Gold electrolyteInfo
- Publication number
- IE38198L IE38198L IE731571A IE157173A IE38198L IE 38198 L IE38198 L IE 38198L IE 731571 A IE731571 A IE 731571A IE 157173 A IE157173 A IE 157173A IE 38198 L IE38198 L IE 38198L
- Authority
- IE
- Ireland
- Prior art keywords
- gold
- gold electrolyte
- baths
- electrolyte
- compounds
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Vapour Deposition (AREA)
- Chemically Coating (AREA)
Abstract
Galvanic baths are provided for the deposition of gold or gold alloy coatings, such baths containing in combination aldehyde and nitrogen compounds with arsenic compounds.
[US3878066A]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2244434A DE2244434C3 (en) | 1972-09-06 | 1972-09-06 | Aqueous bath for the galvanic deposition of gold and gold alloys |
Publications (2)
Publication Number | Publication Date |
---|---|
IE38198L true IE38198L (en) | 1974-03-06 |
IE38198B1 IE38198B1 (en) | 1978-01-18 |
Family
ID=5855965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE1571/73A IE38198B1 (en) | 1972-09-06 | 1973-09-04 | Electrolytes for the electrodeposition of gold and gold alloys |
Country Status (17)
Country | Link |
---|---|
US (1) | US3878066A (en) |
JP (1) | JPS5421820B2 (en) |
AT (1) | AT322935B (en) |
AU (1) | AU469094B2 (en) |
BE (1) | BE804544A (en) |
CA (1) | CA1019276A (en) |
CH (1) | CH594746A5 (en) |
DD (1) | DD106060A5 (en) |
DE (1) | DE2244434C3 (en) |
FR (1) | FR2197997B1 (en) |
GB (1) | GB1438521A (en) |
IE (1) | IE38198B1 (en) |
IT (1) | IT995275B (en) |
NL (1) | NL7312310A (en) |
SE (1) | SE387372B (en) |
SU (1) | SU549089A3 (en) |
ZA (1) | ZA737128B (en) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH606502A5 (en) * | 1974-11-15 | 1978-10-31 | Oxy Metal Industries Corp | |
US4207149A (en) * | 1974-12-04 | 1980-06-10 | Engelhard Minerals & Chemicals Corporation | Gold electroplating solutions and processes |
CH626410A5 (en) * | 1977-09-07 | 1981-11-13 | Metaux Precieux Sa | Bath for the electrolytic deposition of gold or gold alloys and use of this bath |
DE2800817C2 (en) * | 1978-01-10 | 1982-11-04 | Oxy Metal Industries Corp., 48089 Warren, Mich. | Aldehyde-free aqueous bath for the electrodeposition of gold and its alloys and a process for the production of gold and gold alloy deposits using this bath |
DE3020765A1 (en) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS |
US5024733A (en) * | 1989-08-29 | 1991-06-18 | At&T Bell Laboratories | Palladium alloy electroplating process |
US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US6632292B1 (en) * | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
TWI223678B (en) | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6365033B1 (en) * | 1999-05-03 | 2002-04-02 | Semitoof, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
US6899805B2 (en) * | 1998-05-01 | 2005-05-31 | Semitool, Inc. | Automated chemical management system executing improved electrolyte analysis method |
USRE38931E1 (en) * | 1998-05-01 | 2006-01-10 | Semitool, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
US6814855B2 (en) * | 1998-05-01 | 2004-11-09 | Semitool, Inc. | Automated chemical management system having improved analysis unit |
EP1112125B1 (en) | 1998-06-30 | 2006-01-25 | Semitool, Inc. | Metallization structures for microelectronic applications and process for forming the structures |
US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
TW483950B (en) | 1998-12-31 | 2002-04-21 | Semitool Inc | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
JP4288010B2 (en) | 1999-04-13 | 2009-07-01 | セミトゥール・インコーポレイテッド | Workpiece processing apparatus having a processing chamber for improving the flow of processing fluid |
US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
AU2001282879A1 (en) * | 2000-07-08 | 2002-01-21 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6592736B2 (en) | 2001-07-09 | 2003-07-15 | Semitool, Inc. | Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath |
FR2828889B1 (en) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS |
WO2003018874A2 (en) | 2001-08-31 | 2003-03-06 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6991710B2 (en) * | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
CH714243B1 (en) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Electroforming process and part or layer obtained by this method. |
US20080264774A1 (en) * | 2007-04-25 | 2008-10-30 | Semitool, Inc. | Method for electrochemically depositing metal onto a microelectronic workpiece |
CH710184B1 (en) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
EP2312021B1 (en) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals |
JP5707912B2 (en) * | 2010-12-08 | 2015-04-30 | 東ソー株式会社 | Composition of N- (dihydroxyalkyl) diethylenetriamines and method for producing 2-hydroxy (alkyl) triethylenediamines using the same |
ITFI20120103A1 (en) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | GALVANIC BATHROOMS FOR THE ACHIEVEMENT OF A LEAGUE OF LOW-CARATHED GOLD AND GALVANIC PROCESS THAT USES THESE BATHROOMS. |
JP5687667B2 (en) * | 2012-08-21 | 2015-03-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Cyanide gold-palladium alloy plating solution and plating method |
US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
US3669852A (en) * | 1969-10-23 | 1972-06-13 | Bell Telephone Labor Inc | Electroplating gold |
US3770596A (en) * | 1972-07-21 | 1973-11-06 | Auric Corp | Gold plating bath for barrel plating operations |
US3783111A (en) * | 1972-09-11 | 1974-01-01 | Auric Corp | Gold plating bath for barrel plating operations |
US3791941A (en) * | 1972-10-13 | 1974-02-12 | Auric Corp | Gold plating bath for barrel plating operations |
-
1972
- 1972-09-06 DE DE2244434A patent/DE2244434C3/en not_active Expired
-
1973
- 1973-07-19 DD DD172375A patent/DD106060A5/xx unknown
- 1973-08-13 GB GB3824873A patent/GB1438521A/en not_active Expired
- 1973-08-16 CH CH1182673A patent/CH594746A5/xx not_active IP Right Cessation
- 1973-08-28 FR FR7331051A patent/FR2197997B1/fr not_active Expired
- 1973-08-29 AU AU59770/73A patent/AU469094B2/en not_active Expired
- 1973-08-29 US US394959A patent/US3878066A/en not_active Expired - Lifetime
- 1973-09-04 IE IE1571/73A patent/IE38198B1/en unknown
- 1973-09-04 IT IT28551/73A patent/IT995275B/en active
- 1973-09-05 SE SE7312093A patent/SE387372B/en unknown
- 1973-09-05 AT AT770573A patent/AT322935B/en not_active IP Right Cessation
- 1973-09-05 SU SU1959161A patent/SU549089A3/en active
- 1973-09-06 ZA ZA737128*A patent/ZA737128B/en unknown
- 1973-09-06 BE BE135388A patent/BE804544A/en not_active IP Right Cessation
- 1973-09-06 NL NL7312310A patent/NL7312310A/xx not_active Application Discontinuation
- 1973-09-06 JP JP10071973A patent/JPS5421820B2/ja not_active Expired
- 1973-09-06 CA CA180,445A patent/CA1019276A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS4967842A (en) | 1974-07-01 |
AU5977073A (en) | 1975-03-06 |
JPS5421820B2 (en) | 1979-08-02 |
IT995275B (en) | 1975-11-10 |
FR2197997A1 (en) | 1974-03-29 |
FR2197997B1 (en) | 1976-11-19 |
US3878066A (en) | 1975-04-15 |
CA1019276A (en) | 1977-10-18 |
BE804544A (en) | 1974-03-06 |
SE387372B (en) | 1976-09-06 |
ZA737128B (en) | 1974-08-28 |
CH594746A5 (en) | 1978-01-31 |
GB1438521A (en) | 1976-06-09 |
DD106060A5 (en) | 1974-05-20 |
IE38198B1 (en) | 1978-01-18 |
DE2244434A1 (en) | 1974-03-21 |
DE2244434C3 (en) | 1982-02-25 |
AT322935B (en) | 1975-06-10 |
NL7312310A (en) | 1974-03-08 |
AU469094B2 (en) | 1976-02-05 |
SU549089A3 (en) | 1977-02-28 |
DE2244434B2 (en) | 1981-02-19 |
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