IE38198L - Gold electrolyte - Google Patents

Gold electrolyte

Info

Publication number
IE38198L
IE38198L IE731571A IE157173A IE38198L IE 38198 L IE38198 L IE 38198L IE 731571 A IE731571 A IE 731571A IE 157173 A IE157173 A IE 157173A IE 38198 L IE38198 L IE 38198L
Authority
IE
Ireland
Prior art keywords
gold
gold electrolyte
baths
electrolyte
compounds
Prior art date
Application number
IE731571A
Other versions
IE38198B1 (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of IE38198L publication Critical patent/IE38198L/en
Publication of IE38198B1 publication Critical patent/IE38198B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Abstract

Galvanic baths are provided for the deposition of gold or gold alloy coatings, such baths containing in combination aldehyde and nitrogen compounds with arsenic compounds. [US3878066A]
IE1571/73A 1972-09-06 1973-09-04 Electrolytes for the electrodeposition of gold and gold alloys IE38198B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (en) 1972-09-06 1972-09-06 Aqueous bath for the galvanic deposition of gold and gold alloys

Publications (2)

Publication Number Publication Date
IE38198L true IE38198L (en) 1974-03-06
IE38198B1 IE38198B1 (en) 1978-01-18

Family

ID=5855965

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1571/73A IE38198B1 (en) 1972-09-06 1973-09-04 Electrolytes for the electrodeposition of gold and gold alloys

Country Status (17)

Country Link
US (1) US3878066A (en)
JP (1) JPS5421820B2 (en)
AT (1) AT322935B (en)
AU (1) AU469094B2 (en)
BE (1) BE804544A (en)
CA (1) CA1019276A (en)
CH (1) CH594746A5 (en)
DD (1) DD106060A5 (en)
DE (1) DE2244434C3 (en)
FR (1) FR2197997B1 (en)
GB (1) GB1438521A (en)
IE (1) IE38198B1 (en)
IT (1) IT995275B (en)
NL (1) NL7312310A (en)
SE (1) SE387372B (en)
SU (1) SU549089A3 (en)
ZA (1) ZA737128B (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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CH606502A5 (en) * 1974-11-15 1978-10-31 Oxy Metal Industries Corp
US4207149A (en) * 1974-12-04 1980-06-10 Engelhard Minerals & Chemicals Corporation Gold electroplating solutions and processes
CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
DE2800817C2 (en) * 1978-01-10 1982-11-04 Oxy Metal Industries Corp., 48089 Warren, Mich. Aldehyde-free aqueous bath for the electrodeposition of gold and its alloys and a process for the production of gold and gold alloy deposits using this bath
DE3020765A1 (en) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
WO2000005747A2 (en) * 1998-06-30 2000-02-03 Semitool, Inc. Metallization structures for microelectronic applications and process for forming the structures
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
CN1296524C (en) 1999-04-13 2007-01-24 塞米用具公司 System for electrochemically processing workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001259504A1 (en) * 2000-05-24 2001-12-03 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001282879A1 (en) * 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
FR2828889B1 (en) * 2001-08-24 2004-05-07 Engelhard Clal Sas ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS
EP1481114A4 (en) 2001-08-31 2005-06-22 Semitool Inc Apparatus and methods for electrochemical processing of microelectronic workpieces
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
CH714243B1 (en) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Electroforming process and part or layer obtained by this method.
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
CH710184B1 (en) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
JP5707912B2 (en) * 2010-12-08 2015-04-30 東ソー株式会社 Composition of N- (dihydroxyalkyl) diethylenetriamines and method for producing 2-hydroxy (alkyl) triethylenediamines using the same
ITFI20120103A1 (en) * 2012-06-01 2013-12-02 Bluclad Srl GALVANIC BATHROOMS FOR THE ACHIEVEMENT OF A LEAGUE OF LOW-CARATHED GOLD AND GALVANIC PROCESS THAT USES THESE BATHROOMS.
JP5687667B2 (en) * 2012-08-21 2015-03-18 日本エレクトロプレイテイング・エンジニヤース株式会社 Cyanide gold-palladium alloy plating solution and plating method
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations
US3791941A (en) * 1972-10-13 1974-02-12 Auric Corp Gold plating bath for barrel plating operations

Also Published As

Publication number Publication date
AU469094B2 (en) 1976-02-05
CA1019276A (en) 1977-10-18
NL7312310A (en) 1974-03-08
ZA737128B (en) 1974-08-28
DD106060A5 (en) 1974-05-20
DE2244434B2 (en) 1981-02-19
AT322935B (en) 1975-06-10
GB1438521A (en) 1976-06-09
JPS4967842A (en) 1974-07-01
DE2244434C3 (en) 1982-02-25
IT995275B (en) 1975-11-10
JPS5421820B2 (en) 1979-08-02
BE804544A (en) 1974-03-06
FR2197997B1 (en) 1976-11-19
AU5977073A (en) 1975-03-06
FR2197997A1 (en) 1974-03-29
SE387372B (en) 1976-09-06
CH594746A5 (en) 1978-01-31
DE2244434A1 (en) 1974-03-21
US3878066A (en) 1975-04-15
SU549089A3 (en) 1977-02-28
IE38198B1 (en) 1978-01-18

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