SU549089A3 - Электролит дл осаждени покрытий на основе золота - Google Patents
Электролит дл осаждени покрытий на основе золотаInfo
- Publication number
- SU549089A3 SU549089A3 SU1959161A SU1959161A SU549089A3 SU 549089 A3 SU549089 A3 SU 549089A3 SU 1959161 A SU1959161 A SU 1959161A SU 1959161 A SU1959161 A SU 1959161A SU 549089 A3 SU549089 A3 SU 549089A3
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- electrolyte
- gold
- salt
- acid
- nitrogen
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Vapour Deposition (AREA)
- Chemically Coating (AREA)
Description
(54) ЭЛЕКТРОЛИТ ДЛЯ ОСАЖДЕНИЯ ПОКРЫТИЙ НА ОСНОВЕ ЗОЛОТА
3
олово в форме соединений, растворимых в воде .
В зависимости от того, какой сплав нужно получить (бинарный, тройной или четвертичный ) используют смеси солей соосаждаемых металлов.
В качестве комплексной соли золота используют , например, дицианоаурат кали .
Помимо указанных азотсодержащих оргавических соединений используют гидразин, метилгидразин, пропилгидразин, фенилгидразин .
Азотсодержащее органическое соединение должно отвечать общей формуле:
R,N-(R-NR)n,-(,,
4 где
R - алкильный радикал, содержащий от 1 до 4 атомов углерода или арильный остаток;
R - алкилидиновый остаток, содержащий от 1 до 5 атомов углерода;
m и п О, 1,2 -или 3.
Электролит также может содержать добавки , повышающие электропроводность, например сернокислый аммоний или соли щелочных металлов, буферные добавки и поверхностноактивные вещества.
Рассеивающа способность электролита составл ет 4-20%.
Claims (1)
- Изобретение может быть проиллюстрировано несколькими примерами, представленными в таблице. Из предлагаемого электролита осаждают ровные блест щие покрыти , имеющие прочное сцепление с основой. Так, из указанного электролита можно непосредственно (без нанесени промежуточного сло ) осаждать золото и его сплавы на основу, с трудом поддающуюс гальванической обработке, например на свинец€одерл :ащую медь, что приводит к экономии материала и времени. Формула изобретени Электролит дл осаждени покрытий на основе золота, содержащий комплексную соль золота, соль соосаждаемого металла, борную кислоту и азотсодержащее органическое соединение , например этилендиамин, или диэтилентриамин , или триэтилентетрамин, или тетраэтиленпентамин , отличающийс тем, что, с целью повышени выравнивающей способности электролита, он дополнительно содержит этиленгликоль, альдегид общей формулы: где R-HiCHs и СНО соединение мышь ка, выбранное из груп , содержащей мышь ковую кислоту, мышь вистую кислоту п щелочные соли этих кист при следующем соотношении компонен , г/л: Комплексна соль золота Соль соосаждаемого 0,01-200 металла Борна кислота 10-20 Азотсодержащее органи0 ,1-50 ческое соединение Этиленгликоль 10-200 Альдегид 0,005-50 Соединение мышь ка 0,001-5. сточники информации, прин тые во вниние при экспертизе: . Патент США № 2660554, 204-43, 1953. .Патент США № 2967135, 204-43, 1961.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2244434A DE2244434C3 (de) | 1972-09-06 | 1972-09-06 | Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU549089A3 true SU549089A3 (ru) | 1977-02-28 |
Family
ID=5855965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1959161A SU549089A3 (ru) | 1972-09-06 | 1973-09-05 | Электролит дл осаждени покрытий на основе золота |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US3878066A (ru) |
| JP (1) | JPS5421820B2 (ru) |
| AT (1) | AT322935B (ru) |
| AU (1) | AU469094B2 (ru) |
| BE (1) | BE804544A (ru) |
| CA (1) | CA1019276A (ru) |
| CH (1) | CH594746A5 (ru) |
| DD (1) | DD106060A5 (ru) |
| DE (1) | DE2244434C3 (ru) |
| FR (1) | FR2197997B1 (ru) |
| GB (1) | GB1438521A (ru) |
| IE (1) | IE38198B1 (ru) |
| IT (1) | IT995275B (ru) |
| NL (1) | NL7312310A (ru) |
| SE (1) | SE387372B (ru) |
| SU (1) | SU549089A3 (ru) |
| ZA (1) | ZA737128B (ru) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH606502A5 (ru) * | 1974-11-15 | 1978-10-31 | Oxy Metal Industries Corp | |
| US4207149A (en) * | 1974-12-04 | 1980-06-10 | Engelhard Minerals & Chemicals Corporation | Gold electroplating solutions and processes |
| CH626410A5 (en) * | 1977-09-07 | 1981-11-13 | Metaux Precieux Sa | Bath for the electrolytic deposition of gold or gold alloys and use of this bath |
| DE2800817C2 (de) * | 1978-01-10 | 1982-11-04 | Oxy Metal Industries Corp., 48089 Warren, Mich. | Aldehydfreies wässriges Bad für die galvanische Abscheidung von Gold und dessen Legierungen sowie ein Verfahren zur Herstellung von Gold- und Goldlegierungsabscheidungen unter Verwendung dieses Bades |
| DE3020765A1 (de) * | 1980-05-31 | 1981-12-10 | Degussa Ag, 6000 Frankfurt | Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten |
| US5024733A (en) * | 1989-08-29 | 1991-06-18 | At&T Bell Laboratories | Palladium alloy electroplating process |
| US6752584B2 (en) * | 1996-07-15 | 2004-06-22 | Semitool, Inc. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
| US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
| US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| US6632292B1 (en) * | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6197181B1 (en) * | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TWI223678B (en) | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US6365033B1 (en) | 1999-05-03 | 2002-04-02 | Semitoof, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
| US6899805B2 (en) * | 1998-05-01 | 2005-05-31 | Semitool, Inc. | Automated chemical management system executing improved electrolyte analysis method |
| USRE38931E1 (en) * | 1998-05-01 | 2006-01-10 | Semitool, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
| US6814855B2 (en) * | 1998-05-01 | 2004-11-09 | Semitool, Inc. | Automated chemical management system having improved analysis unit |
| JP2003517190A (ja) | 1998-06-30 | 2003-05-20 | セミトウール・インコーポレーテツド | ミクロ電子工学の適用のための金属被覆構造物及びその構造物の形成法 |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| TW483950B (en) | 1998-12-31 | 2002-04-21 | Semitool Inc | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
| US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| JP4288010B2 (ja) | 1999-04-13 | 2009-07-01 | セミトゥール・インコーポレイテッド | 処理流体の流れ具合を向上させる処理チャンバを備えた加工物処理装置 |
| US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7102763B2 (en) * | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| US6592736B2 (en) | 2001-07-09 | 2003-07-15 | Semitool, Inc. | Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath |
| FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
| AU2002343330A1 (en) | 2001-08-31 | 2003-03-10 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6991710B2 (en) * | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
| US6893505B2 (en) * | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
| US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
| US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
| US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| US20080264774A1 (en) * | 2007-04-25 | 2008-10-30 | Semitool, Inc. | Method for electrochemically depositing metal onto a microelectronic workpiece |
| CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
| EP2312021B1 (fr) | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
| JP5707912B2 (ja) * | 2010-12-08 | 2015-04-30 | 東ソー株式会社 | Ｎ−（ジヒドロキシアルキル）ジエチレントリアミン類の組成物、及びそれを用いた２−ヒドロキシ（アルキル）トリエチレンジアミン類の製造方 |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
| JP5687667B2 (ja) * | 2012-08-21 | 2015-03-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | シアン系金−パラジウム合金めっき液及びめっき方法 |
| US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| US3669852A (en) * | 1969-10-23 | 1972-06-13 | Bell Telephone Labor Inc | Electroplating gold |
| US3770596A (en) * | 1972-07-21 | 1973-11-06 | Auric Corp | Gold plating bath for barrel plating operations |
| US3783111A (en) * | 1972-09-11 | 1974-01-01 | Auric Corp | Gold plating bath for barrel plating operations |
| US3791941A (en) * | 1972-10-13 | 1974-02-12 | Auric Corp | Gold plating bath for barrel plating operations |
-
1972
- 1972-09-06 DE DE2244434A patent/DE2244434C3/de not_active Expired
-
1973
- 1973-07-19 DD DD172375A patent/DD106060A5/xx unknown
- 1973-08-13 GB GB3824873A patent/GB1438521A/en not_active Expired
- 1973-08-16 CH CH1182673A patent/CH594746A5/xx not_active IP Right Cessation
- 1973-08-28 FR FR7331051A patent/FR2197997B1/fr not_active Expired
- 1973-08-29 AU AU59770/73A patent/AU469094B2/en not_active Expired
- 1973-08-29 US US394959A patent/US3878066A/en not_active Expired - Lifetime
- 1973-09-04 IE IE1571/73A patent/IE38198B1/xx unknown
- 1973-09-04 IT IT28551/73A patent/IT995275B/it active
- 1973-09-05 SE SE7312093A patent/SE387372B/xx unknown
- 1973-09-05 SU SU1959161A patent/SU549089A3/ru active
- 1973-09-05 AT AT770573A patent/AT322935B/de not_active IP Right Cessation
- 1973-09-06 BE BE135388A patent/BE804544A/xx not_active IP Right Cessation
- 1973-09-06 JP JP10071973A patent/JPS5421820B2/ja not_active Expired
- 1973-09-06 CA CA180,445A patent/CA1019276A/en not_active Expired
- 1973-09-06 ZA ZA737128*A patent/ZA737128B/xx unknown
- 1973-09-06 NL NL7312310A patent/NL7312310A/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| FR2197997A1 (ru) | 1974-03-29 |
| FR2197997B1 (ru) | 1976-11-19 |
| AU5977073A (en) | 1975-03-06 |
| DE2244434A1 (de) | 1974-03-21 |
| IE38198L (en) | 1974-03-06 |
| SE387372B (sv) | 1976-09-06 |
| ZA737128B (en) | 1974-08-28 |
| DD106060A5 (ru) | 1974-05-20 |
| AU469094B2 (en) | 1976-02-05 |
| US3878066A (en) | 1975-04-15 |
| CA1019276A (en) | 1977-10-18 |
| CH594746A5 (ru) | 1978-01-31 |
| IE38198B1 (en) | 1978-01-18 |
| DE2244434B2 (de) | 1981-02-19 |
| GB1438521A (en) | 1976-06-09 |
| BE804544A (fr) | 1974-03-06 |
| AT322935B (de) | 1975-06-10 |
| IT995275B (it) | 1975-11-10 |
| NL7312310A (ru) | 1974-03-08 |
| JPS5421820B2 (ru) | 1979-08-02 |
| JPS4967842A (ru) | 1974-07-01 |
| DE2244434C3 (de) | 1982-02-25 |
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