BE804544A - Bain pour le depot galvanique d'or et d'alliages d'or - Google Patents

Bain pour le depot galvanique d'or et d'alliages d'or

Info

Publication number
BE804544A
BE804544A BE135388A BE135388A BE804544A BE 804544 A BE804544 A BE 804544A BE 135388 A BE135388 A BE 135388A BE 135388 A BE135388 A BE 135388A BE 804544 A BE804544 A BE 804544A
Authority
BE
Belgium
Prior art keywords
gold
bath
galvanic deposit
alloys
gold alloys
Prior art date
Application number
BE135388A
Other languages
English (en)
French (fr)
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of BE804544A publication Critical patent/BE804544A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
BE135388A 1972-09-06 1973-09-06 Bain pour le depot galvanique d'or et d'alliages d'or BE804544A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2244434A DE2244434C3 (de) 1972-09-06 1972-09-06 Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen

Publications (1)

Publication Number Publication Date
BE804544A true BE804544A (fr) 1974-03-06

Family

ID=5855965

Family Applications (1)

Application Number Title Priority Date Filing Date
BE135388A BE804544A (fr) 1972-09-06 1973-09-06 Bain pour le depot galvanique d'or et d'alliages d'or

Country Status (17)

Country Link
US (1) US3878066A (xx)
JP (1) JPS5421820B2 (xx)
AT (1) AT322935B (xx)
AU (1) AU469094B2 (xx)
BE (1) BE804544A (xx)
CA (1) CA1019276A (xx)
CH (1) CH594746A5 (xx)
DD (1) DD106060A5 (xx)
DE (1) DE2244434C3 (xx)
FR (1) FR2197997B1 (xx)
GB (1) GB1438521A (xx)
IE (1) IE38198B1 (xx)
IT (1) IT995275B (xx)
NL (1) NL7312310A (xx)
SE (1) SE387372B (xx)
SU (1) SU549089A3 (xx)
ZA (1) ZA737128B (xx)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH606502A5 (xx) * 1974-11-15 1978-10-31 Oxy Metal Industries Corp
US4207149A (en) * 1974-12-04 1980-06-10 Engelhard Minerals & Chemicals Corporation Gold electroplating solutions and processes
CH626410A5 (en) * 1977-09-07 1981-11-13 Metaux Precieux Sa Bath for the electrolytic deposition of gold or gold alloys and use of this bath
DE2800817C2 (de) * 1978-01-10 1982-11-04 Oxy Metal Industries Corp., 48089 Warren, Mich. Aldehydfreies wässriges Bad für die galvanische Abscheidung von Gold und dessen Legierungen sowie ein Verfahren zur Herstellung von Gold- und Goldlegierungsabscheidungen unter Verwendung dieses Bades
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
WO2000005747A2 (en) * 1998-06-30 2000-02-03 Semitool, Inc. Metallization structures for microelectronic applications and process for forming the structures
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
JP5707912B2 (ja) * 2010-12-08 2015-04-30 東ソー株式会社 Ｎ−（ジヒドロキシアルキル）ジエチレントリアミン類の組成物、及びそれを用いた２−ヒドロキシ（アルキル）トリエチレンジアミン類の製造方
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
JP5687667B2 (ja) * 2012-08-21 2015-03-18 日本エレクトロプレイテイング・エンジニヤース株式会社 シアン系金−パラジウム合金めっき液及びめっき方法
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3669852A (en) * 1969-10-23 1972-06-13 Bell Telephone Labor Inc Electroplating gold
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations
US3791941A (en) * 1972-10-13 1974-02-12 Auric Corp Gold plating bath for barrel plating operations

Also Published As

Publication number Publication date
NL7312310A (xx) 1974-03-08
IT995275B (it) 1975-11-10
DE2244434B2 (de) 1981-02-19
AT322935B (de) 1975-06-10
DE2244434C3 (de) 1982-02-25
DD106060A5 (xx) 1974-05-20
SE387372B (sv) 1976-09-06
AU5977073A (en) 1975-03-06
DE2244434A1 (de) 1974-03-21
CH594746A5 (xx) 1978-01-31
JPS5421820B2 (xx) 1979-08-02
ZA737128B (en) 1974-08-28
IE38198L (en) 1974-03-06
IE38198B1 (en) 1978-01-18
JPS4967842A (xx) 1974-07-01
FR2197997B1 (xx) 1976-11-19
CA1019276A (en) 1977-10-18
US3878066A (en) 1975-04-15
AU469094B2 (en) 1976-02-05
SU549089A3 (ru) 1977-02-28
FR2197997A1 (xx) 1974-03-29
GB1438521A (en) 1976-06-09

Similar Documents

Publication Publication Date Title
BE804544A (fr) Bain pour le depot galvanique d'or et d'alliages d'or
CH555894A (fr) Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
BE770346A (fr) Procede et bain pour le depot de cuivre brillant
BE771514A (fr) Copolymere thermoplastique pour l'enduction de metaux
FR2285474A1 (fr) Bain pour l'electrodeposition d'alliages de metaux precieux
CH286123A (fr) Bain pour le dépôt par voie galvanique d'alliages d'or.
CH534215A (fr) Bain électrolytique pour l'électrodéposition d'alliages d'or et une utilisation de celui-ci
BE849410A (fr) Bain et procede pour l'electrodeposition d'un alliage d'etain et d'or
BE838335A (fr) Bain pour le depot galvanique d'alliages de palladium-nickel
BE764153A (fr) Bain galvanique aqueux pour l'electrodeposition d'alliages a base de ruthenium
CH540344A (fr) Bain pour le dépôt électrolytique d'alliagesd'or
FR2043686A1 (fr) Dispositif pour le depot electrolytique d'un metal sur un objet ou pour l'oxydation anodique d'un objet
BE781965A (fr) Bain et procede pour l'electrodeposition de nickel
FR2329772A1 (fr) Bain et procede de depot electrolytique d'argent
BE751377A (fr) Technique de depot d'un email de support ceramique
CH525963A (fr) Bain galvanique pour l'électrodéposition de l'or et son utilisation en galvanoplastie
BE798881R (fr) Procede pour le revetement des surfaces de zinc et d'alliages de zinc
BE756128A (fr) Recipient pour le sang de reserve et pour l'admission du sang coronair
BE758010A (fr) Bains pour le depot d'or par voie chimique
BE796165A (fr) Procede et solution pour le depot electrolytique d'alliages d'or brillants
CH556916A (fr) Procede pour le depot electrolytique d'alliages d'or.
CH523968A (fr) Bain électrolytique pour l'électrodéposition des métaux
FR2343062A2 (fr) Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent
CH530473A (fr) Procédé pour le dépôt électrolytique d'or brillant et bain électrolytique pour la mise en oeuvre de ce proédé
CH390024A (fr) Bain électrolytique pour dépôt épais et brillant d'alliage or-cuivre

Legal Events

Date Code Title Description
RE20 Patent expired

Owner name: SCHERING A.G.

Effective date: 19930906